Abstract: Technologies for thermal plugs in photonic integrated circuit (PIC) dies are disclosed. In an illustrative embodiment, several thermal plugs extend from contact pads in a PIC die, through a dielectric layer, to a waveguide layer. The thermal plugs can carry heat at a higher rate than the surrounding dielectric layer, increasing the heat transfer through the PIC die. The PIC die may be mounted on an electronic integrated circuit (EIC) die in an integrated circuit component. The PIC die can transfer heat from the EIC die, through the PIC die, and to another component such as an integrated heat spreader, lowering the temperature of the EIC die. The thermal plugs can increase the heat transfer through the PIC die.

Abstract: High density brine compositions may be formulated including water and at least one rare earth nitrate salt, where the at least one rare earth salt is present in an amount effective for the high density brine composition to have a density in the range of about 8.5 to about 21 pounds per gallon (about 1020 to about 2500 kg/m3). Suitable rare earth nitrate salts include, but are not necessarily limited to, lanthanum nitrate (La(NO3)3), cerium nitrate (Ce(NO3)3), scandium nitrate, and/or yttrium nitrate. Alkaline earth metal salts such as, but not limited to, calcium bromide (CaBr2), and alkali metal salts and metal salts may also be used with the rare earth nitrate salt(s). In one non-limiting embodiment the high density brines have an absence of zinc and cesium salts. These high density brine compositions may be suitably used for completion fluids in hydrocarbon recovery operations.