Abstract: Described herein is a stator water cooling (SWC) system in an electrical power generator with improved resistance to copper fouling, more specifically, to a component of the SWC system, such as a strainer, having an anti-fouling metallic material on the surface of the component. Also described herein is a method of reducing copper fouling in a SWC system that comprises applying an anti-fouling metallic material to the surface of a SWC system component.

Abstract: A vapor chamber may be integrated with one or more components of a computing device to provide thermal management. The vapor chamber may include upper and lower portions forming the vapor chamber, and an annular space between the upper and lower portions that includes a fluid. The vapor chamber may be configured to absorb heat from a heat source of the computing device. Subsequently, the uniform heat transfer may enable the external surfaces of the computing device to achieve substantially isothermal external surface conditions, which may maximize a power dissipation of the computing device for a given ambient temperature ensuring a temperature of the computing device remains at or below safe limits while in use.

Abstract: The description relates to devices, such as computing devices. One example can include a processor secured to a circuit board and a self-biasing heat sink positioned over the processor and secured to the circuit board to complete a Faraday Cage around the processor. The self-biasing heat sink can include a peripheral portion positioned in a first plane and a contact portion positioned in a second different plane and biased against the heat generating component by an interposed biasing portion that is flexed to force the contact portion against the processor.

Abstract: The description relates to computing devices, such as mobile computing devices. One example can include a housing containing a processor. This example can also include a transition component configured to automatically change a distance between the processor and a proximate region of the housing based upon a state of the processor.

Abstract: The description relates to devices, such as computing devices. One example can include a processor secured to a circuit board and a self-biasing heat sink positioned over the processor and secured to the circuit board to complete a Faraday Cage around the processor. The self-biasing heat sink can include a peripheral portion positioned in a first plane and a contact portion positioned in a second different plane and biased against the heat generating component by an interposed biasing portion that is flexed to force the contact portion against the processor.

Abstract: A thermal interface material comprises a polymeric elastomer material, a thermally conductive filler, and a coupling agent, along with other optional components.

Abstract: The description relates to computing devices, such as mobile computing devices. One example can include a housing containing a processor. This example can also include a transition component configured to automatically change a distance between the processor and a proximate region of the housing based upon a state of the processor.

Abstract: A vapor chamber may be integrated with one or more components of a computing device to provide thermal management. The vapor chamber may include upper and lower portions forming the vapor chamber, and an annular space between the upper and lower portions that includes a fluid. The vapor chamber may be configured to absorb heat from a heat source of the computing device. Subsequently, the uniform heat transfer may enable the external surfaces of the computing device to achieve substantially isothermal external surface conditions, which may maximize a power dissipation of the computing device for a given ambient temperature ensuring a temperature of the computing device remains at or below safe limits while in use.

Abstract: A thermal interface material comprises a polymeric elastomer material, a thermally conductive filler, and a coupling agent, along with other optional components.

Abstract: Systems, methodologies, methods of manufacture, and other embodiments associated with semiconductor/processor module assemblies are described. One exemplary system embodiment includes a bolster plate assembly for a semiconductor module assembly that includes a bolster plate and a leaf spring pre-loaded onto the bolster plate. The example system may also include the leaf spring being releasably attached to the bolster plate and positioned to provide a force in a direction generally away from the bolster plate. The leaf spring can be configured to release from the bolster plate upon attaching the semiconductor module assembly to the bolster plate that causes the leaf spring to exert the force in the direction generally away from the bolster plate and against a semiconductor module assembly.

Abstract: Systems, methodologies, and other embodiments associated with a heat sink with a fin configured with a stator blade are described. One exemplary system embodiment includes a heat sink apparatus configured to experience a fan-assisted air flow. The example heat sink apparatus may be configured to include a fan that is configured to produce an air flow in the heat sink apparatus and a heat sink that houses the fan. The example heat sink may include a base and fins that are configured with stator blades.

Abstract: A pump or DC fan used to cool an electronic system is monitored for speed. When the pump or fan encounters an unexpected increase in impedance, such as an obstruction or a bearing anomaly, the controller temporarily increases the power to the pump or fan to overcome the impedance, and optionally notifies the user of the pump or fan problem. Also, when the pump or fan impedance returns to a normal range, the controller returns the power to the pump or fan to normal levels. In some embodiments, the controller may supply more power to the pump or fan than specified by the manufacturer to temporarily over come the increased impedance or pending failure of the pump or fan. This increased power allows the fan or pump to operate at a speed necessary for cooling an electronic system during a temporary increase in impedance, or during a slow degradation of the efficiency of the fan or pump.

Abstract: A variable-height thermal-interface assembly for transferring heat from a heat source to a heat sink comprises a slidable interface between two contacting surfaces, the slidable interface inclined diagonally relative to the z-axis. The two contacting surfaces slide relative to one another parallel to the incline direction to provide z-axis expansion of the assembly. The assembly further comprises a spring clip, which when released applies a shear force across the slidable interface, causing the two contacting surfaces to slide relative to one another, coupling the sliding to provide z-axis expansion. The assembly further comprises a reversible locking device, which when locked prevents the two contacting surfaces from sliding relative to one another, such that the spring clip remains retracted, and when unlocked allows the two contacting surfaces to slide relative to one another, such that the spring clip is released.

Abstract: A variable-height thermal-interface device is provided for transferring heat from a heat source to a heat sink. The device comprises a first uniaxial rotary cylindrical joint comprising a first cylindrically concave surface in slidable contact with a first cylindrically convex surface. The first cylindrically concave surface and the first cylindrically convex surface share a common first radius of curvature relative to a common first cylinder axis. The first cylindrically concave surface is operable to rotate about the common first cylinder axis relative to the first cylindrically convex surface to compensate for uniaxial angular misalignment between the heat source and the heat sink.

Abstract: A DC fan, or lot of DC fans is characterized at a constant voltage to determine the variation of their rotational speed with respect to altitude. Many such DC fans will have a substantially linear response in speed with respect to altitude. From this relationship, a converter is constructed to convert the rotational speed into an altitude. The converter may be a discrete electronic device including a look up table or capable of performing the arithmetic algorithm representing the relationship between fan speed and altitude. Alternatively, the converter may be incorporated into the system to be cooled by the DC fan. For example, it may be a software routine run by the computer that the DC fan is used to cool.

Abstract: A heat-generating device is characterized to determine the relationship between the speed of a DC cooling fan, and the thermal margin of the heat-generating device. Since the speed of DC fans is substantially linear with respect to their input voltage, the speed of the fan may be adjusted within a system to provide the speed necessary for cooling needs. An altitude is input to a converter which uses the characterization of the heat-generating device to determine a fan speed necessary at that altitude to cool the heat-generating device to a temperature within its operating range. The converter then controls the voltage supplied to the DC fan to result in the needed fan speed.