Patents by Inventor Andrew Dennis Watson Carswell

Andrew Dennis Watson Carswell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9153451
    Abstract: A method of forming a planar surface for a semiconductor device structure. The method comprises forming a particle film comprising a plurality of discrete particles on a non-planar surface of a semiconductor device structure. The semiconductor device structure is subjected to at least one chemical-mechanical polishing process after forming the particle film on the non-planar surface of the semiconductor device structure. Methods of forming a semiconductor device structure are also described.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: October 6, 2015
    Assignee: Micron Technology, Inc.
    Inventors: Andrew Dennis Watson Carswell, Wayne Hai-Wei Huang, Siddartha Kondoju, Jin Lu, Suresh Ramakrishnan, Kozaburo Sakai, Sony Varghese, Andrey V. Zagrebelny
  • Publication number: 20150044783
    Abstract: A method of forming a forming a semiconductor device comprises forming at least one semiconductor device structure over a surface of a wafer. An opposing surface of the wafer is subjected to at least one chemical-mechanical polishing process to form a modified opposing surface of the wafer comprising at least one recessed region and at least one elevated region. Additional methods of forming a semiconductor device, and methods of reducing stress on a wafer are also described.
    Type: Application
    Filed: August 12, 2013
    Publication date: February 12, 2015
    Applicant: Micron Technology, Inc.
    Inventor: Andrew Dennis Watson Carswell
  • Publication number: 20140162455
    Abstract: A method of forming a planar surface for a semiconductor device structure. The method comprises forming a particle film comprising a plurality of discrete particles on a non-planar surface of a semiconductor device structure. The semiconductor device structure is subjected to at least one chemical-mechanical polishing process after forming the particle film on the non-planar surface of the semiconductor device structure. Methods of forming a semiconductor device structure are also described.
    Type: Application
    Filed: December 12, 2012
    Publication date: June 12, 2014
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Andrew Dennis Watson Carswell, Wayne Hai-Wei Huang, Siddartha Kondoju, Jin Lu, Suresh Ramakrishnan, Kozaburo Sakai, Sony Varghese, Andrey V. Zagrebelny
  • Publication number: 20090056744
    Abstract: Compositions and methods of removing debris including organic debris from a hydrophobic surface during semiconductor processing are disclosed. The method includes exposing a semiconductor wafer having debris, including organic debris, thereon to a cleaning solution including an oxidizing agent and at least one surfactant.
    Type: Application
    Filed: August 29, 2007
    Publication date: March 5, 2009
    Applicant: MICRON TECHNOLOGY, INC.
    Inventor: Andrew Dennis Watson Carswell