Abstract: Processes for manufacturing cellulose based integrated circuitry constructions are provided, the processes can include providing a first substrate having a plurality of vias; providing a first conductive material to the one surface of the substrate; providing adhesive to the other surface; providing a monolithic electronic component to the other surface; providing a second conductive material to the other surface and the monolithic electronic component; providing a backing material to the other surface of the substrate; and providing a second substrate to the backing material to form the construction.

Abstract: Processes for manufacturing cellulose based integrated circuitry constructions are provided, the processes can include providing a first substrate having a plurality of vias; providing a first conductive material to the one surface of the substrate; providing adhesive to the other surface; providing a monolithic electronic component to the other surface; providing a second conductive material to the other surface and the monolithic electronic component; providing a backing material to the other surface of the substrate; and providing a second substrate to the backing material to form the construction.

Abstract: Processes for manufacturing cellulose based integrated circuitry constructions are provided, the processes can include providing a first substrate having a plurality of vias; providing a first conductive material to the one surface of the substrate; providing adhesive to the other surface; providing a monolithic electronic component to the other surface; providing a second conductive material to the other surface and the monolithic electronic component; providing a backing material to the other surface of the substrate; and providing a second substrate to the backing material to form the construction.

Abstract: Memory programming devices include a print head that moves across a substrate to deposit memory material on the substrate to form an array of memory cells and programming circuitry coupled to the print head so that the programming circuitry moves across the substrate along with the print head and that, for individual memory cells of the array, is positioned proximate the individual memory cell and writes data to the individual memory cell. Memory programming methods include depositing memory material above a first portion of an electrically conductive bitline printed on a substrate to form a memory cell and using programming circuitry positioned proximate the memory cell, storing data in the memory cell by altering a characteristic of the memory cell, the characteristic remaining altered after the programming circuitry is moved away from the memory cell.

Abstract: Memory programming devices include a print head that moves across a substrate to deposit memory material on the substrate to form an array of memory cells and programming circuitry coupled to the print head so that the programming circuitry moves across the substrate along with the print head and that, for individual memory cells of the array, is positioned proximate the individual memory cell and writes data to the individual memory cell. Memory programming methods include depositing memory material above a first portion of an electrically conductive bitline printed on a substrate to form a memory cell and using programming circuitry positioned proximate the memory cell, storing data in the memory cell by altering a characteristic of the memory cell, the characteristic remaining altered after the programming circuitry is moved away from the memory cell.

Abstract: An electronic assembly includes an electronic device having high-resolution features and at least one conductive contact pad. The electronic assembly further includes a substrate supporting the electronic device and an electrical connection having low-resolution features. The electrical connection extends from the at least one conductive contact pad to a position upon the substrate.

Abstract: Electronic storage devices include one or more substrates, storage circuitry configured to store electronic data and communication circuitry configured to receive the electronic data from a programming device and provide the electronic data to the storage circuitry. The storage circuitry and communication circuitry are embedded in and are in direct physical contact with the one or more substrates. Programming methods include providing an electronic storage device comprising storage circuitry configured to store electronic data and communication circuitry configured to receive the electronic data and provide the electronic data to the storage circuitry, the storage circuitry and communication circuitry being embedded in two or more substrates. The methods also include communicating the electronic data to the communication circuitry and storing the electronic data in the storage circuitry.

Abstract: A programming device includes communication circuitry for communicating with an electronic device. A first set of one or more electrical contacts connected to the communication circuitry and configured to physically contact a corresponding second set of one or more electrical contacts located on a substrate. One or more guides configured to align the first and second sets of electrical contacts when the substrate physically contacts the one or more guides.

Abstract: Electronic storage devices include one or more substrates, storage circuitry configured to store electronic data and communication circuitry configured to receive the electronic data from a programming device and provide the electronic data to the storage circuitry. The storage circuitry and communication circuitry are embedded in and are in direct physical contact with the one or more substrates. Programming methods include providing an electronic storage device comprising storage circuitry configured to store electronic data and communication circuitry configured to receive the electronic data and provide the electronic data to the storage circuitry, the storage circuitry and communication circuitry being embedded in two or more substrates. The methods also include communicating the electronic data to the communication circuitry and storing the electronic data in the storage circuitry.

Abstract: A programming device includes communication circuitry for communicating with an electronic device. A first set of one or more electrical contacts connected to the communication circuitry and configured to physically contact a corresponding second set of one or more electrical contacts located on a substrate. One or more guides configured to align the first and second sets of electrical contacts when the substrate physically contacts the one or more guides.

Abstract: An electronic assembly includes an electronic device having high-resolution features and at least one conductive contact pad. The electronic assembly further includes a substrate supporting the electronic device and an electrical connection having low-resolution features. The electrical connection extends from the at least one conductive contact pad to a position upon the substrate.

Abstract: Memory programming devices include a print head that moves across a substrate to deposit memory material on the substrate to form an array of memory cells and programming circuitry coupled to the print head so that the programming circuitry moves across the substrate along with the print head and that, for individual memory cells of the array, is positioned proximate the individual memory cell and writes data to the individual memory cell. Memory programming methods include depositing memory material above a first portion of an electrically conductive bitline printed on a substrate to form a memory cell and using programming circuitry positioned proximate the memory cell, storing data in the memory cell by altering a characteristic of the memory cell, the characteristic remaining altered after the programming circuitry is moved away from the memory cell.