Abstract: Thermal management systems and corresponding use methods are described herein. A thermal management system includes a thermal dock operable to cool a computing device in physical contact with the thermal dock. The thermal dock includes a housing, a first thermal management device supported by the housing, and a second thermal management device physically connected to the first thermal management device. The first thermal management device is a different type of thermal management device than the second thermal management device.

Abstract: Thermal management devices and systems, and corresponding manufacturing methods are described herein. A thermal management device includes a plate having a first surface. The first surface partially defines a chamber of the thermal management device. The thermal management device also includes capillary features disposed on the plate, and walls having a first end and a second end. The walls are disposed on the plate and extend away from the first surface of the plate, at the first end, to the second end. The walls partially define the chamber of the thermal management device. The thermal management device also includes a layer of material disposed on the walls, at the second end of the wall. The layer of material partially defines the chamber.

Abstract: A thermal venting device is provided that includes a plenum including an inlet port and a plurality of outlet ports, the plenum being substantially fluidically sealed except for the inlet port and the plurality of outlet ports, the inlet port including an inlet fan configured to pressurize the plenum, each of the plurality of outlet ports being configured to direct airflow from the pressurized plenum toward different electronic components of a plurality of electronic components, and each of the plurality of outlet ports including respective resistive elements having varied airflow resistances configured to bias airflow through the plurality of outlet ports.

Abstract: A lost wax cast vapor chamber device is provided. Once a mesh is produced, a meltable core is formed from a meltable core material with the mesh positioned at least partially inside the core. Over the meltable core a metallic layer is formed, at least partially surrounding the meltable core. A chamber formed by the metallic layer is exposed by melting the meltable core to cause it to be removed from an internal void of the chamber, the internal void encapsulating the mesh. The melted material from the meltable core flows out an opening on at least one surface of the chamber. Subsequently, the internal void is filled at least partially with a working fluid and the opening is closed. The mesh supports the surfaces of the chamber against deformation under the vacuum of the internal void. Movement of working fluid by capillary action is facilitated by the mesh.

Abstract: Thermal management devices and methods are making are described herein. In one example, the thermal management device includes a heat spreader having a first surface and a second surface, wherein the first surface of the heat spreader is configured to be positioned adjacent to a heat source of an electronic device. The thermal management device also includes a heat dissipation device configured to dissipate heat from the heat source, wherein at least a portion of the second surface of the heat spreader is metallurgically bonded with at least a portion of a surface of the heat dissipation device.

Abstract: A three-dimensional printed vapor chamber device is provided. A chamber from a first surface and a second surface at least partially enclosing a volume includes a spanning structure extending from the first surface to the second surface throughout a region within the volume. A defined gap between the first surface and second surface is maintained by the spanning structure, which also defines a plurality of flow passages. Evaporated working fluid flows from an evaporation region proximate a heat source through looped flow passages to a condensation region at a distal end of the chamber before returning as condensate by way of capillary action to the evaporation region.

Abstract: Thermal management devices and systems, and corresponding manufacturing methods are described herein. A phase change thermal management device is manufactured with a method that includes forming a volume of a first material. The volume of the first material defines a chamber of the thermal management device and an inner surface of a port. A layer of a second material is electroplated on the volume of the first material. The volume of the first material is melted or dissolved, such that the electroplated layer of the second material forms the chamber and the port. The melted volume of the first material is removed via the port.

Abstract: Thermal management devices and systems, and corresponding manufacturing methods are described herein. A thermal management device includes a plate having a first surface. The first surface partially defines a chamber of the thermal management device. The thermal management device also includes capillary features disposed on the plate, and walls having a first end and a second end. The walls are disposed on the plate and extend away from the first surface of the plate, at the first end, to the second end. The walls partially define the chamber of the thermal management device. The thermal management device also includes a layer of material disposed on the walls, at the second end of the wall. The layer of material partially defines the chamber.

Abstract: Thermal management systems and corresponding use methods are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an outer surface and an inner surface. The computing device also includes a heat generating component supported by the housing. The computing device includes a phase change device adjacent or physically connected to the heat generating component. The phase change device includes a first side and a second side. The first side is closer to the heat generating component than the second side. The second side is opposite the first side. The phase change device is compressible, such that when a force is applied to the outer surface of the housing, the inner surface of the housing flexes towards the second side of the phase change device and the phase change device is compressed.

Abstract: Fan assemblies included within a computing device are described herein. The computing device includes a housing, a heat generating component supported within the housing, and a fan assembly. The fan assembly is operable to move heat generated by the heat generating component out of the housing. The fan assembly is supported within the housing. The fan assembly includes a shaft and a plurality of discs positioned along and fixed to the shaft. The shaft and the plurality of discs are rotatable relative to the housing about an axis of rotation.

Abstract: Thermal management systems are described herein. A thermal management system includes components of a computing device. The computing device includes a heat generating component and a heat spreader physically connected to the heat generating component. The heat spreader includes a first surface and a second surface. The second surface is closer to the heat generating component than the first surface is to the heat generating component. The computing device also includes a layer of phase change material on at least a portion of the first surface, the second surface, or the first surface and the second surface of the heat spreader.

Abstract: Thermal management systems are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an inner surface. A portion of the inner surface of the housing has a first emissivity. The computing device also includes a thermal management device positioned within the housing, at a distance from the portion of the inner surface of the housing. The thermal management device includes an outer surface. The outer surface of the thermal management device includes a first portion and a second portion. The first portion of the outer surface of the thermal management device has a second emissivity, and the second portion of the outer surface of the thermal management device has a third emissivity. The second emissivity is greater than the third emissivity, and the first emissivity is substantially the same as the second emissivity.

Abstract: A uniform flow heat sink is described that is configured to employ variable spacing for air flow channels to account for non-uniformities in air flow due to arrangements of components within a housing of a computing device. Non-uniformities may be ascertained by analysis of an air flow profile for a computing device to detect regions of high and low flow. Air flow rates for the computing device may be balanced by configuring air flow channel spacing for the heat sink to vary around a perimeter of the heat sink and account for the ascertained non-uniformities. Air flow channel spacing may be controlled by changing the concentration, spacing, pitch, positioning and/or other characteristics of heat transfer surfaces associated with the heat sink. Generally, air flow channel spacing is increased in areas of high system impedance and decreased in areas of low system impedance to increase uniformity of flow.

Abstract: Thermal management systems and corresponding use methods are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an outer surface and an inner surface. The computing device also includes a heat generating component supported by the housing. The computing device includes a phase change device adjacent or physically connected to the heat generating component. The phase change device includes a first side and a second side. The first side is closer to the heat generating component than the second side. The second side is opposite the first side. The phase change device is compressible, such that when a force is applied to the outer surface of the housing, the inner surface of the housing flexes towards the second side of the phase change device and the phase change device is compressed.

Abstract: Techniques for monitoring surface temperature of devices are described. Generally, surface temperature of devices is monitored and controlled to prevent user discomfort and/or injury that may result from user contact with an excessively heated surface. In at least some embodiments, temperature of an external surface of the device is indirectly monitored. For instance, a temperature sensor is positioned at an internal location in a device that has a known temperature relationship to a temperature of an external surface of the device. Alternatively or additionally, a temperature of an external surface of a device may be directly detected. In at least some embodiments, when a temperature of an external surface of a device is determined to reach or exceed a threshold temperature, procedures can be implemented to reduce the temperature of the external surface and/or prevent further heating of the external surface.

Abstract: Micro-hole vents for device ventilation systems are described herein that may be formed as a plurality of micro-holes that are invisible to unaided human eyes. The micro-holes are configured to blend into the housing for a computing device such that the holes are substantially concealed from users of the computing device. A micro-hole vent may be aligned with a blower for a ventilation system to enable air intake through the corresponding micro-holes for cooling of components within the housing. In addition or alternatively, one or more exhaust vents for the ventilation system may also be configured as micro-hole vents. Each micro-hole vent may have many, very small holes for sufficient air flow. For example, micro-holes having diameters of about fifty to two hundred microns may be arranged in a pattern with a coverage in a range of about twelve thousand to fifty thousand holes per square inch.

Abstract: Techniques for monitoring surface temperature of devices are described. Generally, surface temperature of devices is monitored and controlled to prevent user discomfort and/or injury that may result from user contact with an excessively heated surface. In at least some embodiments, temperature of an external surface of the device is indirectly monitored. For instance, a temperature sensor is positioned at an internal location in a device that has a known temperature relationship to a temperature of an external surface of the device. Alternatively or additionally, a temperature of an external surface of a device may be directly detected. In at least some embodiments, when a temperature of an external surface of a device is determined to reach or exceed a threshold temperature, procedures can be implemented to reduce the temperature of the external surface and/or prevent further heating of the external surface.

Abstract: A thermal control system that includes a combination of active and passive components is described herein. In one or more implementation, the thermal control system compensates for non-uniformities in a temperature profile for an arrangement of components within a computing device. One or more active components of the thermal control system transfer heat away from heat-generating devices by active means, such as active transfer to a moving fluid that is driven by a blower or fan. Additionally, one or more passive components are positioned to transfer heat to selected areas of the device using passive transfer devices, such as heat-pipes and thermal spreaders made of conductive materials. The active and passive components operate together to compensate for temperature variations across the device surfaces, produce a controlled temperature profile having greater uniformity, reduce overall differences in surface temperatures, and provide greater capability for heat dissipation.

Abstract: A spectrally selective radiation emission device is described. In one or more implementations, an apparatus includes a housing, one or more electrical components disposed within the housing, and a spectrally selective radiation emission device. The one or more electrical components are configured to generate heat during operation. The spectrally selective radiation emission device is disposed on the housing and configured to emit radiation when heated by the one or more electrical components at one or more wavelengths of electromagnetic energy and reflect radiation at one or more other wavelengths of electromagnetic energy.

Abstract: Sounds sensed by a microphone of a device include sounds from a cooling fan of the device that varies based on the speed of the cooling fan, and other sounds used by a program of the device such as voice inputs. The sound level of sounds used by the program is determined, and the speed of the fan is adjusted so that a desired cooling level is attained while keeping the fan speed low enough that the noise from the fan does not interfere with the sounds used by the program.