Abstract: A method for fabricating semiconductor components with lens structures and lens support structures includes the steps of providing semiconductor substrates on a substrate, attaching a carrier to the substrate configured to support the substrate during various processes, thinning the carrier to form lens support structures having desired geometrical characteristics, singulating the substrate and the carrier such that each semiconductor substrate includes a lens support structure, and then attaching the lens structures to the support structures. Each semiconductor component includes a thinned semiconductor substrate, a support structure attached to the semiconductor substrate, and a lens structure attached to the support structure. A system for fabricating the semiconductor components includes the substrate containing the semiconductor substrates, and the carrier configured to support the wafer, to protect the semiconductor substrates and to provide the lens support structures.

Abstract: A method for fabricating semiconductor components with lens structures and lens support structures includes the steps of providing semiconductor substrates on a substrate, attaching a carrier to the substrate configured to support the substrate during various processes, thinning the carrier to form lens support structures having desired geometrical characteristics, singulating the substrate and the carrier such that each semiconductor substrate includes a lens support structure, and then attaching the lens structures to the support structures. Each semiconductor component includes a thinned semiconductor substrate, a support structure attached to the semiconductor substrate, and a lens structure attached to the support structure. A system for fabricating the semiconductor components includes the substrate containing the semiconductor substrates, and the carrier configured to support the wafer, to protect the semiconductor substrates and to provide the lens support structures.

Abstract: Improved squiggle keys and cylinder locks include a squiggle key groove formed along a first broad surface of the squiggle key and a plurality of bittings formed along a second opposite broad surface of the squiggle key. The cylinder lock includes a plurality of rotatable discs that have groove-following elements that are rotated via the groove on the key. The rotatable discs operate to prevent a plug of the cylinder lock from rotating unless a correct squiggle key is inserted into a keyway in the plug. The bittings formed along the second opposite broad surface of the squiggle key are generally circular and have inner regions with a different depth than outer regions of the bittings. As a result, tumbler pins can be located along the inner and/or outer regions of the bittings which enables increased keying capabilities and variations and which enables a common lock to be operated by keys for different cylinder locks.