Abstract: Input device haptics and pressure sensing techniques are described. An input device includes an outer surface, a pressure sensor and haptic feedback mechanism, and a pressure sensing and haptic feedback module. The outer surface is configured to receive an application of pressure by an object. The pressure sensor and haptic feedback mechanism has one or more piezos configured to detect and quantify an amount of the application of the pressure to the outer surface by the object, the one or more piezos configured to output a signal indicating the quantified amount of the pressure. The pressure sensing and haptic feedback module is configured to receive the signal from the one or more piezos indicating the quantified amount of the pressure and control the haptic feedback of the pressure sensor and haptic feedback mechanism.

Abstract: A thin keyboard device is described herein. In one or more implementations, a keyboard device includes a plurality of keys, and a housing that includes a structural printed circuit board (PCB). The structural PCB includes, for each of the plurality of keys, a first conductive trace and a second conductive trace. The keyboard device further includes a key-switch mechanism for each of the plurality of keys. The key-switch mechanism includes a conductive material oriented towards the first conductive trace and the second conductive trace, and is configured to cause the conductive material to move downwards, when the key is depressed, to electrically connect the first conductive trace and the second conductive trace of the depressed key.

Abstract: A thin keyboard device is described herein. In one or more implementations, a keyboard device includes a plurality of keys, and a housing that includes a structural printed circuit board (PCB). The structural PCB includes, for each of the plurality of keys, a first conductive trace and a second conductive trace. The keyboard device further includes a key-switch mechanism for each of the plurality of keys. The key-switch mechanism includes a conductive material oriented towards the first conductive trace and the second conductive trace, and is configured to cause the conductive material to move downwards, when the key is depressed, to electrically connect the first conductive trace and the second conductive trace of the depressed key.

Abstract: A mechanical attach and retention feature is described. An apparatus may include a cover portion that is configured to cover at least a portion of a display device of a computing device having a mobile form factor that is configured to be held by one or more hands of a user. The apparatus includes, a first mid-spine that is rotationally connected to the cover portion, a second mid-spine that is rotationally connected to the first mid-spine, and a connection portion that is rotationally connection to the second mid-spine. The connection portion is configured to form a removable physical coupling to the computing device using a projection that is configured to be disposed within a channel formed in a housing of the computing device and a protrusion disposed on the projection, the protrusion configured to be received within a cavity formed as part of the channel.

Abstract: A thin keyboard device is described herein. In one or more implementations, a keyboard device includes a plurality of keys, and a housing that includes a structural printed circuit board (PCB). The structural PCB includes, for each of the plurality of keys, a first conductive trace and a second conductive trace. The keyboard device further includes a key-switch mechanism for each of the plurality of keys. The key-switch mechanism includes a conductive material oriented towards the first conductive trace and the second conductive trace, and is configured to cause the conductive material to move downwards, when the key is depressed, to electrically connect the first conductive trace and the second conductive trace of the depressed key.

Abstract: Input device haptics and pressure sensing techniques are described. An input device includes an outer surface, a pressure sensor and haptic feedback mechanism, and a pressure sensing and haptic feedback module. The outer surface is configured to receive an application of pressure by an object. The pressure sensor and haptic feedback mechanism has one or more piezos configured to detect and quantify an amount of the application of the pressure to the outer surface by the object, the one or more piezos configured to output a signal indicating the quantified amount of the pressure. The pressure sensing and haptic feedback module is configured to receive the signal from the one or more piezos indicating the quantified amount of the pressure and control the haptic feedback of the pressure sensor and haptic feedback mechanism.

Abstract: A mechanical attach and retention feature is described. An apparatus may include a cover portion that is configured to cover at least a portion of a display device of a computing device having a mobile form factor that is configured to be held by one or more hands of a user. The apparatus includes, a first mid-spine that is rotationally connected to the cover portion, a second mid-spine that is rotationally connected to the first mid-spine, and a connection portion that is rotationally connection to the second mid-spine. The connection portion is configured to form a removable physical coupling to the computing device using a projection that is configured to be disposed within a channel formed in a housing of the computing device and a protrusion disposed on the projection, the protrusion configured to be received within a cavity formed as part of the channel.

Abstract: Input device haptics and pressure sensing techniques are described. An input device includes an outer surface, a pressure sensor and haptic feedback mechanism, and a pressure sensing and haptic feedback module. The outer surface is configured to receive an application of pressure by an object. The pressure sensor and haptic feedback mechanism has one or more piezos configured to detect and quantify an amount of the application of the pressure to the outer surface by the object, the one or more piezos configured to output a signal indicating the quantified amount of the pressure. The pressure sensing and haptic feedback module is configured to receive the signal from the one or more piezos indicating the quantified amount of the pressure and control the haptic feedback of the pressure sensor and haptic feedback mechanism.

Abstract: A mechanical attach and retention feature is described. An apparatus may include a cover portion that is configured to cover at least a portion of a display device of a computing device having a mobile form factor that is configured to be held by one or more hands of a user. The apparatus includes, a first mid-spine that is rotationally connected to the cover portion, a second mid-spine that is rotationally connected to the first mid-spine, and a connection portion that is rotationally connection to the second mid-spine. The connection portion is configured to form a removable physical coupling to the computing device using a projection that is configured to be disposed within a channel formed in a housing of the computing device and a protrusion disposed on the projection, the protrusion configured to be received within a cavity formed as part of the channel.

Abstract: A mechanical attach and retention feature is described. An apparatus may include a cover portion that is configured to cover at least a portion of a display device of a computing device having a mobile form factor that is configured to be held by one or more hands of a user. The apparatus includes, a first mid-spine that is rotationally connected to the cover portion, a second mid-spine that is rotationally connected to the first mid-spine, and a connection portion that is rotationally connection to the second mid-spine. The connection portion is configured to form a removable physical coupling to the computing device using a projection that is configured to be disposed within a channel formed in a housing of the computing device and a protrusion disposed on the projection, the protrusion configured to be received within a cavity formed as part of the channel.

Abstract: Input device haptics and pressure sensing techniques are described. An input device includes an outer surface, a pressure sensor and haptic feedback mechanism, and a pressure sensing and haptic feedback module. The outer surface is configured to receive an application of pressure by an object. The pressure sensor and haptic feedback mechanism has one or more piezos configured to detect and quantify an amount of the application of the pressure to the outer surface by the object, the one or more piezos configured to output a signal indicating the quantified amount of the pressure. The pressure sensing and haptic feedback module is configured to receive the signal from the one or more piezos indicating the quantified amount of the pressure and control the haptic feedback of the pressure sensor and haptic feedback mechanism.