Patents by Inventor Andrew F. Willner

Andrew F. Willner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11370483
    Abstract: A haptic feedback mechanism for steering by wire system includes a motor. Electronic circuitry includes a node and switches for controlling the motor. A voltage sensor at the node and a motion sensor for the DC motor feed a motor control logic module that is operative to: determine if the voltage at the node is above a predetermined threshold; determine if the input motion is above a predetermined speed; and change the switches into an overcurrent protection mode if the voltage is above the predetermined threshold or the input motion is above the predetermined speed. In overcurrent protection mode, electrical power, generated by the input motion, passes through resistance and/or the motor to dissipate while maintaining haptic feedback. An endstop mechanism includes a position sensor coupled to the haptic feedback mechanism for detecting an angular position of the motor to increase feedback torque near an endstop of the motor.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: June 28, 2022
    Assignee: Sensata Technologies, Inc.
    Inventors: Max L. Kotula, Maxwell C. Geary, Brent R. Chinnock, Andrew F. Willner
  • Publication number: 20210229738
    Abstract: A haptic feedback mechanism for steering by wire system includes a motor. Electronic circuitry includes a node and switches for controlling the motor. A voltage sensor at the node and a motion sensor for the DC motor feed a motor control logic module that is operative to: determine if the voltage at the node is above a predetermined threshold; determine if the input motion is above a predetermined speed; and change the switches into an overcurrent protection mode if the voltage is above the predetermined threshold or the input motion is above the predetermined speed. In overcurrent protection mode, electrical power, generated by the input motion, passes through resistance and/or the motor to dissipate while maintaining haptic feedback. An endstop mechanism includes a position sensor coupled to the haptic feedback mechanism for detecting an angular position of the motor to increase feedback torque near an endstop of the motor.
    Type: Application
    Filed: January 27, 2020
    Publication date: July 29, 2021
    Applicant: Sensata Technologies, Inc.
    Inventors: Max L. Kotula, Maxwell C. Geary, Brent R. Chinnock, Andrew F. Willner
  • Patent number: 8256300
    Abstract: A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: September 4, 2012
    Assignee: Sensata Technologies, Inc.
    Inventors: Andrew F. Willner, Louis Tomasso, Giovanni Fraone, Prasanth Ambady
  • Patent number: 8156816
    Abstract: A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: April 17, 2012
    Assignee: Sensata Technologies, Inc.
    Inventors: Andrew F. Willner, Giovanni Fraone, Prasanth Ambady, Lauren Snedeker
  • Patent number: 8129624
    Abstract: A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: March 6, 2012
    Assignee: Sensata Technologies, Inc.
    Inventors: Andrew F. Willner, Lauren Snedeker, Brian Wilkie, Gifford Plume, Prasanth Ambady
  • Publication number: 20110290539
    Abstract: A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Inventors: Andrew F. Willner, Lauren Snedecker, Brian Wilkie, Gifford Plume, Prasanth Ambady
  • Publication number: 20110290030
    Abstract: A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Inventors: Andrew F. Willner, Louis Tomasso, Giovanni Fraone, Prasanth Ambady
  • Publication number: 20110290029
    Abstract: A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Inventors: Andrew F. Willner, Giovanni Fraone, Prasanth Ambady, Lauren Snedeker
  • Patent number: 7197937
    Abstract: A pressure sensing device (10, 40) is shown having a ceramic capacitive sensing element (12) received in a chamber formed in a hexport housing (16). The hexport housing has a fluid passageway (16c) communicating with a recessed chamber (16d) formed in a bottom wall circumscribed by an annular platform shoulder (16e). A thin flexible metal diaphragm (18) is hermetically attached to the bottom wall along the platform shoulder. A curable adhesive resin having a thermal coefficient of expansion and modulus of elasticity appropriately matching that of sensing element (12), such as polyurethane, is cast between the sensing element (12) and the metal diaphragm (18) forming, when cured, a layer bonded to both members resulting in a sensor that is effective in monitoring negative as well as positive fluid pressures.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: April 3, 2007
    Assignee: Sensata Technologies, Inc.
    Inventors: Alan G. Amore, Eric J. Giasson, James I. Ogilvie, Stephen P. Greene, David J. Field, Andrew F. Willner, Vanvisa Attaset