Abstract: Voltage on the output terminal of an inductor is obtained as a first input signal to a control block (CB); the inductor has an input terminal connected to a power switch and driver block at a switching node. A sense input voltage is obtained on an output terminal of a sensing circuit that is not directly connected to the switching node, as a second input signal to the CB. A voltage is generated on a first output terminal of the CB and is selected such that the CB can use its first and second input signals to infer the current through the inductor. A pulse width modulation (PWM) signal is generated on a second output terminal of the CB, based on the inferred current through the inductor; the second output signal from the CB is provided to a PWM input terminal of the power switch and driver block.

Abstract: Systems, devices, and methods of diagnosing an electrochemical cell using cyclic coulometry are discussed. An exemplary battery diagnostic system comprises a current generator to generate symmetric charge current and discharge current to excite an electrochemical cell, and a cyclic coulometer to evaluate performance of the electrochemical cell. The cyclic coulometer can adjust at least one of a charge time for applying the charge current, or a discharge time for applying the discharge current, to keep a monitored cell voltage toward a specific setpoint. The adjustment of charge or discharge time can be achieved by changing a current switch timing for reversing current from a first to a second current direction. The cyclic coulometer measures one or more electrical parameters during the charge or discharge cycle, and generates a performance metric using the measured electrical parameters.

Abstract: The present invention improves control of currents in a multi-site direct current neurostimulation system. Precise control incorporates three constant current sources in a system consisting of spinal, polarizing and peripheral circuits. Constant current sources (sinks) are placed on the high side of the peripheral circuit and one sink in series on the low side of the spinal circuit in a four electrode configuration, for maintaining both predetermined currents, and current ratios, as the electrode/skin impedance and body impedance vary over the course of a treatment. Resistive steering is also implemented.

Abstract: Systems and methods are provided for portable and compact nitric oxide (NO) generation that can be embedded into other therapeutic devices or used alone. In some embodiments, an ambulatory NO generation system can be comprised of a controller and disposable cartridge. The cartridge can contain filters and scavengers for preparing the gas used for NO generation and for scrubbing output gases prior to patient inhalation. The system can utilize an oxygen concentrator to increase nitric oxide production and compliment oxygen generator activity as an independent device. The system can also include a high voltage electrode assembly that is easily assembled and installed. Various nitric oxide delivery methods are provided, including the use of a nasal cannula.

Abstract: Printed circuit board (PCB), electrical structures including PCBs, and methods for making the same. One PCB structures includes: a substrate having a plurality of surfaces, including a first aerial main face (AMF), a second AMF, and a first peripheral end face (PEF), wherein the first PEF separates the first AMF from the second AMF, and a first plurality of contacts embedded in the first PEF, where each of the first plurality of contacts forms a contiguous contact with the first PEF and at least one of i) the second AMF, ii) the first AMF, and iii) another one of the plurality of surfaces.

Abstract: Systems and methods are provided for portable and compact nitric oxide (NO) generation that can be embedded into other therapeutic devices or used alone. In some embodiments, an ambulatory NO generation system can be comprised of a controller and disposable cartridge. The cartridge can contain filters and scavengers for preparing the gas used for NO generation and for scrubbing output gases prior to patient inhalation. The system can utilize an oxygen concentrator to increase nitric oxide production and compliment oxygen generator activity as an independent device. The system can also include a high voltage electrode assembly that is easily assembled and installed. Various nitric oxide delivery methods are provided, including the use of a nasal cannula.

Abstract: A method for fabricating a semiconductor device includes, for a substrate having a first region protected by a cap layer, forming a first device on a second region of the substrate. The substrate includes an insulator layer disposed between a first semiconductor layer and a second semiconductor layer each including a first semiconductor material. The method further includes forming a second device on the first region, including forming one or more transistors each having a channel formed from a second semiconductor material different from the first semiconductor material.

Abstract: A semiconductor device includes a first circuit formed on a substrate in a first region, a second circuit formed on the substrate in a second region and including one or more transistors, and connections between the first circuit and respective gates of the transistors of the second circuit. The substrate includes a first semiconductor material and the second circuit includes one or more transistors having channels formed from a second semiconductor material different from the first semiconductor material.

Abstract: A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.

Abstract: A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.

Abstract: A power-delivery system may comprise a load device and a direct-current converter configured to deliver current to the load device when the direct-current converter is in an on state. The power-deliver system may comprise a voltage-measurement system configured to measure, at a beginning of each measurement cycle in a cyclic measurement pattern, a voltage at the load device. The power-deliver system may comprise a power controller configure to receive, at the beginning of each measurement cycle, the measurement of the voltage, and to perform, at the beginning of a control cycle in a cyclic control pattern, a voltage-control decision in response to a change in the measurement of the voltage being below a voltage-change threshold. The voltage-control decision may comprise whether to switch the state of the first direct-current converter. The cyclic control pattern may operate at a first frequency, and the measurement pattern may operate at a second frequency.

Abstract: A semiconductor device includes a first circuit formed on a substrate in a first region, a second circuit formed on the substrate in a second region and including one or more transistors, and connections between the first circuit and respective gates of the transistors of the second circuit. The substrate includes a first semiconductor material and the second circuit includes one or more transistors having channels formed from a second semiconductor material different from the first semiconductor material.

Abstract: An apparatus is provided including a transformer including a first printed circuit board having one or more conducting layers, the one or more conducting layers forming, at least in part, a transformer coil; at least one inductor; and at least one continuous piece of conducting material external to the printed circuit board, where the at least one continuous piece of conducting material forms a connection between the transformer and the at least one inductor. A method is also provided for assembling a switched-mode power supply.

Abstract: A redundant power supply apparatus includes at least two power inlets, at least two power supply units, and a common component. Each power inlet is connected to an AC power source. Each power supply unit has an input side and the at least two power supply units having a common output side, each input side is connected to the power inlet, and each power supply unit is configured to convert the AC power source into a DC power source. The common component is connected at the common output side and configured to receive DC power sources. Accordingly, the redundant power supply apparatus is provided to improve reliability of redundant operations between multiple external power sources without using mechanical switches.

Abstract: An electrical connector carries large amounts of electrical current between two circuit boards with low resistance and low self-inductance by means of an interdigitated anode and cathode, thereby providing low dynamic voltage loss. The connector also may include, near where power will be consumed, an interposer board with on-board capacitance to provide even lower dynamic voltage loss. The connector has application to delivering low-voltage, high-current power from a power supply on a first board to electronics on a second board: the low resistance provides low voltage drop for a load current that is constant, while the low inductance and the capacitors provide low voltage fluctuation for a load current that changes. These issues are of great importance, for example, in designing high-performance computers.

Abstract: A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.

Abstract: A power-delivery system may comprise a load device and a direct-current converter configured to deliver current to the load device when the direct-current converter is in an on state. The power-deliver system may comprise a voltage-measurement system configured to measure, at a beginning of each measurement cycle in a cyclic measurement pattern, a voltage at the load device. The power-deliver system may comprise a power controller configure to receive, at the beginning of each measurement cycle, the measurement of the voltage, and to perform, at the beginning of a control cycle in a cyclic control pattern, a voltage-control decision in response to a change in the measurement of the voltage being below a voltage-change threshold. The voltage-control decision may comprise whether to switch the state of the first direct-current converter. The cyclic control pattern may operate at a first frequency, and the measurement pattern may operate at a second frequency.

Abstract: Printed circuit board (PCB), electrical structures including PCBs, and methods for making the same. One PCB structures includes: a substrate having a plurality of surfaces, including a first aerial main face (AMF), a second AMF, and a first peripheral end face (PEF), wherein the first PEF separates the first AMF from the second AMF, and a first plurality of contacts embedded in the first PEF, where each of the first plurality of contacts forms a contiguous contact with the first PEF and at least one of i) the second AMF, ii) the first AMF, and iii) another one of the plurality of surfaces.

Abstract: A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.

Abstract: A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.