Abstract: Systems, methods, and devices are described for constructing a digital representation of a physical scene by obtaining information about the physical scene. Based on the information, an initial portion of a planar surface within the physical scene may be identified. In one aspect of the disclosure, constructing a digital representation of a physical scene may include obtaining information about the physical scene, identifying a planar surface within the physical scene, selecting a physical object within the physical scene, placed above the planar surface, detecting properties associated with the physical object, generating a three-dimensional (3D) reconstructed object using the properties associated with the physical object, and representing the planar surface as an augmented reality (AR) plane in an augmented reality environment, wherein the AR plane in the AR environment is capable of supporting 3D reconstructed objects on top of it.

Abstract: A computer-implemented method of tracking a target object in an object recognition system includes acquiring a plurality of images with a camera. The method further includes simultaneously tracking the target object and dynamically building environment map data from the plurality of images. The tracking of the target object includes attempting to estimate a target pose of the target object with respect to the camera based on at least one of the plurality of images and based on target map data. Next, the method determines whether the tracking of the target object with respect to the camera is successful. If not, then the method includes inferring the target pose with respect to the camera based on the dynamically built environment map data. In one aspect the method includes fusing the inferred target pose with the actual target pose even if tracking is successful to improve robustness.

Abstract: Systems, methods, and devices are described for constructing a digital representation of a physical scene by obtaining information about the physical scene. Based on the information, an initial portion of a planar surface within the physical scene may be identified. In one aspect of the disclosure, constructing a digital representation of a physical scene may include obtaining information about the physical scene, identifying a planar surface within the physical scene, selecting a physical object within the physical scene, placed above the planar surface, detecting properties associated with the physical object, generating a three-dimensional (3D) reconstructed object using the properties associated with the physical object, and representing the planar surface as an augmented reality (AR) plane in an augmented reality environment, wherein the AR plane in the AR environment is capable of supporting 3D reconstructed objects on top of it.

Abstract: Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices.

Abstract: Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices.

Abstract: Electro-optical packages that embed the electronics of the packages directly to the optical cabling, provide short electrical connection paths for high performance, and that provide a robust interconnects. A first electro-optical package includes an integrated circuit and a connector sleeve configured to receive a plug-in optical assembly from the underside of the PC board. The plug-in optical assembly includes a backing piece and an opto-electric device mounted onto the backing piece. An electrical connection is provided between the opto-electric device and a contact location on the backing piece and a contact is provided between the contact location on the backing piece and the integrated circuit. With a second electro-optical package, an integrated circuit having an active surface facing in a first direction and an opto-electric device having contact points facing a second direction are provided.

Abstract: Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices.