Patents by Inventor Andrew George Laquer

Andrew George Laquer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11760466
    Abstract: An unmanned aerial vehicle is provided, including an airframe including a fuselage and at least one stowable wing. The unmanned aerial vehicle can further include a radar panel positioned on the fuselage such that the radar panel is angled downward and extends longitudinally along a ventral region of the fuselage. The unmanned aerial vehicle can further include a drop-away rocket engine that is configured to detachably mount to the airframe adjacent the radar panel.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: September 19, 2023
    Assignee: THE BOEING COMPANY
    Inventors: Lathan Hunter Collins, III, Ryan Douglas Jones, Rachael Dawn Morelli, Andrew George Laquer, Mark Andrew Lundgren, Joshua Robert Laub
  • Publication number: 20220194551
    Abstract: An unmanned aerial vehicle is provided, including an airframe including a fuselage and at least one stowable wing. The unmanned aerial vehicle can further include a radar panel positioned on the fuselage such that the radar panel is angled downward and extends longitudinally along a ventral region of the fuselage. The unmanned aerial vehicle can further include a drop-away rocket engine that is configured to detachably mount to the airframe adjacent the radar panel.
    Type: Application
    Filed: November 24, 2021
    Publication date: June 23, 2022
    Inventors: Lathan Hunter Collins, III, Ryan Douglas Jones, Rachael Dawn Morelli, Andrew George Laquer, Mark Andrew Lundgren, Joshua Robert Laub
  • Patent number: 10069464
    Abstract: The present disclosure relates systems and methods for providing a three-dimensional device architecture for transistor elements in a power amplifier circuit. Namely, an example system may include a plurality of high electron mobility transistors disposed on a first substrate. A first portion of the plurality of high electron mobility transistors are electrically coupled via respective first level interconnects disposed on the first substrate. The system also includes a plurality of second level interconnects disposed on a second substrate. A second portion of the plurality of high electron mobility transistors are electrically coupled via respective second level interconnects. The first substrate and the second substrate are coupled such that the plurality of high electron mobility transistors provides an amplified output signal via at least one of the first level interconnects or the second level interconnects.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: September 4, 2018
    Assignee: The Boeing Company
    Inventors: Andrew George Laquer, Dean L Araki, Pohan Yang
  • Publication number: 20180241356
    Abstract: The present disclosure relates systems and methods for providing a three-dimensional device architecture for transistor elements in a power amplifier circuit. Namely, an example system may include a plurality of high electron mobility transistors disposed on a first substrate. A first portion of the plurality of high electron mobility transistors are electrically coupled via respective first level interconnects disposed on the first substrate. The system also includes a plurality of second level interconnects disposed on a second substrate. A second portion of the plurality of high electron mobility transistors are electrically coupled via respective second level interconnects. The first substrate and the second substrate are coupled such that the plurality of high electron mobility transistors provides an amplified output signal via at least one of the first level interconnects or the second level interconnects.
    Type: Application
    Filed: February 21, 2017
    Publication date: August 23, 2018
    Inventors: Andrew George Laquer, Dean L Araki, Pohan Yang
  • Patent number: 10005217
    Abstract: According to an embodiment, a method includes receiving a magnetic device design comprising a magnetic structure to be formed, at least in part, from a magnetic material matrix, wherein the magnetic material matrix is configured to be used in at least one of a magnetic materials additive manufacturing system (MMAMS) and a magnetic materials bulk extrusion system (MMBES); receiving the magnetic material matrix by at least one of the MMAMS and the MMBES; and dispensing the magnetic material matrix using at least one of the MMAMS and the MMBES to form the magnetic structure.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: June 26, 2018
    Assignee: The Boeing Company
    Inventors: John D. Willams, Andrew George Laquer
  • Publication number: 20170050363
    Abstract: According to an embodiment, a method includes receiving a magnetic device design comprising a magnetic structure to be formed, at least in part, from a magnetic material matrix, wherein the magnetic material matrix is configured to be used in at least one of a magnetic materials additive manufacturing system (MMAMS) and a magnetic materials bulk extrusion system (MMBES); receiving the magnetic material matrix by at least one of the MMAMS and the MMBES; and dispensing the magnetic material matrix using at least one of the MMAMS and the MMBES to form the magnetic structure.
    Type: Application
    Filed: August 20, 2015
    Publication date: February 23, 2017
    Inventors: John D. Williams, Andrew George Laquer