Abstract: In one embodiment, an automatic high-speed X-ray system may generate a high-resolution X-ray image of an inspected sample at a direction substantially orthogonal to a plane of the inspected sample. The system may determine a first cross-sectional shape of a first portion of a first element of interest in the inspected sample based on grayscale values of the X-ray image associated with the first element of interest. The system may determine a second cross-sectional shape of a second portion of the first element of interest in the inspected sample. The second cross-sectional shape may be determined based on the grayscale values of the X-ray image associated with the first element of interest. The system may determine one or more first metrological parameters associated with the first element of interest in the inspected sample based a comparison of the first cross-sectional shape and the second cross-sectional shape.

Abstract: In one embodiment, an X-ray inspection system may nondestructively inspect a printed circuit board to measure a number of dimensions at a number of pre-determined locations of the printed circuit board. The X-ray inspection system may generate a data set for the printed circuit board based on the measured dimensions. The X-ray inspection system may calculate one or more drilling values based on the data set of the printed circuit board. The X-ray inspection system may provide, to a drilling machine, instructions for drilling a number of plated-through vias based on the calculated drilling values for the printed circuit board.

Abstract: The present disclosure provides methods and apparatus for rapidly classifying detected defects in subcomponents of a manufactured component or device. The defect classification may occur after defect detection or, because the classification may be sufficiently rapid to be performed in real-time, during defect detection, as part of the defect detection process. In an exemplary implementation, the presently-disclosed technology may be utilized to enable real-time classification of detected defects in multiple subcomponents of the component in parallel. The component may be, for example, a multi-chip package with silicon interposers, and the subcomponents may include, for example, through-silicon vias and solder joints. Defects in subcomponents of other types of components may be also be classified. One embodiment relates to a method of classifying detected defects in subcomponents of a manufactured component.

Abstract: In one embodiment, an automatic high-speed X-ray system may generate a high-resolution X-ray image of an inspected sample at a direction substantially orthogonal to a plane of the inspected sample. The system may determine a first cross-sectional shape of a first portion of a first element of interest in the inspected sample based on grayscale values of the X-ray image associated with the first element of interest. The system may determine a second cross-sectional shape of a second portion of the first element of interest in the inspected sample. The second cross-sectional shape may be determined based on the grayscale values of the X-ray image associated with the first element of interest. The system may determine one or more first metrological parameters associated with the first element of interest in the inspected sample based a comparison of the first cross-sectional shape and the second cross-sectional shape.

Abstract: In one embodiment, an X-ray inspection system may nondestructively inspect a printed circuit board to measure a number of dimensions at a number of pre-determined locations of the printed circuit board. The X-ray inspection system may generate a data set for the printed circuit board based on the measured dimensions. The X-ray inspection system may calculate one or more drilling values based on the data set of the printed circuit board. The X-ray inspection system may provide, to a drilling machine, instructions for drilling a number of plated-through vias based on the calculated drilling values for the printed circuit board.

Abstract: The present disclosure provides methods and apparatus for rapidly classifying detected defects in subcomponents of a manufactured component or device. The defect classification may occur after defect detection or, because the classification may be sufficiently rapid to be performed in real-time, during defect detection, as part of the defect detection process. In an exemplary implementation, the presently-disclosed technology may be utilized to enable real-time classification of detected defects in multiple subcomponents of the component in parallel. The component may be, for example, a multi-chip package with silicon interposers, and the subcomponents may include, for example, through-silicon vias and solder joints. Defects in subcomponents of other types of components may be also be classified. One embodiment relates to a method of classifying detected defects in subcomponents of a manufactured component.