Patents by Inventor Andrew Giannetta

Andrew Giannetta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220277964
    Abstract: A method for planarizing a metal conductor layer embedded in a dielectric layer is provided. The method includes removing a portion of an overburden of the metal conductor layer that is formed over the dielectric layer with a first CMP slurry. The method also includes removing a remaining portion of the overburden of the metal conductor layer with a second CMP slurry to expose upper portions of the dielectric layer.
    Type: Application
    Filed: February 26, 2021
    Publication date: September 1, 2022
    Inventors: Mahadevaiyer Krishnan, Michael Francis Lofaro, Andrew Giannetta, Douglas Bishop, Eugene J. O'Sullivan, Daniel Charles Edelstein