Abstract: A wire bond LED lighting unit and method for maximizing heat transfer in an LED lighting unit are disclosed, wherein the LED lighting unit includes an LED package disposed on a first carrier plate and is in thermal communication therewith. A PWB is disposed on the first carrier plate spaced from the LED package. The LED package is in electrical communication with the PWB. The first carrier plate is also in thermal communication with the PWB.

Abstract: The electronic system generally includes an electronic panel having circuitry plated on a surface thereof as well as electronic components attached thereto. The circuitry connects the electronic components for operation of the electronic device in the engine compartment. A flatwire bus electronically connects the electronic panel and the electronic device in the engine compartment for transmitting signals there between. The electronic panel is directly connected to the bulkhead.

Abstract: A headlamp assembly for a motor vehicle having a light source, a chamber that receives the light source and a cooling channel for removing heat from the chamber. A conductive wall and an insulating wall cooperate to define the chamber and the channel. The conductive wall has a substantially higher thermal conductivity than the insulating wall to promote the heat exchange between the chamber and the cooling channel and to reduce heat exchange between the cooling channel and the relatively hot engine compartment.

Abstract: A headlamp assembly for a motor vehicle including a lens and a housing that cooperate to define an inner chamber that is generally isolated from the atmosphere. A heat sink includes a fin portion that extends from the inner chamber so as to be exposed to ambient air. A light source is located within the inner chamber and is supported on a base portion of the heat sink. The heat sink conducts heat from the light source to air located exterior of the chamber.

Abstract: The present invention provides in one embodiment, a system for encapsulating a substrate on a vehicle structure. The system includes the substrate, the vehicle structure and a package substrate. The substrate has a top portion and a bottom portion. The vehicle structure is operatively connected to the bottom portion of the substrate. The package substrate has a plurality of layers, where the package substrate is operatively connected to the top portion of the substrate. The package substrate conforms to a periphery area of the top portion of the substrate.

Abstract: An assembly that includes two or more microelectronic modules in a self-sustaining structure that is adapted to be installed in a housing. The microelectronic modules are affixed to supports that are attached to ribs and arranged in parallel-spaced relationship. When the assembly is received in a housing, the ribs engage the inner wall of the housing to securely position the assembly. Also, the ribs space the microelectronic modules apart from the housing to facilitate coolant gas flow through the housing and thereby improve thermal dissipation during operation.

Abstract: An electronic system generally includes a flatwire electronic site and a flatwire bus electronically connecting the flatwire electronic site to an electronic device in the engine compartment. The flatwire electronic site has a flexible substrate with electronic components attached to the substrate for operation of the electronic device. The flatwire electronic site is mounted to the passenger site of the bulkhead for thermal cooling as well as protection from the harsh environment of the engine compartment. The bulkhead has an aperture sized to allow the flatwire bus to pass through the bulkhead into the engine compartment. By utilizing a flatwire bus, this aperture is small in size and the integrity of the bulkhead is improved.

Abstract: An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.

Abstract: An antenna system for receiving communication signals from satellites having plurality of subplates, a plurality of antenna nodes supported on the top surface of each subplate, and an electronic control unit to which the subplates are fixed and aligned and a collapsible support stand fixed to the bottom of the electronic control unit opposite the subplates in which the subplates, electronic control unit and stand interconnect to form an easily assembled lightweight antenna assembly that may be disassembled into easily portable components.

Abstract: A microelectronic package comprises microelectronic assemblies and a housing having a cylindrical outer wall. The microelectronic assemblies include electronic components mounted on a substrate and are affixed to support surfaces of the inner wall of the housing. The housing is preferably formed of semi-cylindrical sections that are joined along axial edges. The housing includes one or more axial channels interposed between the outer wall and the inner wall for conveying coolant gas. In this manner, the housing provides more uniform thermal dissipation of heat generated by the microelectronic assemblies during operation, despite variations in the thickness between the cylindrical outer wall and the support surfaces, which are preferably planar.

Abstract: An electronic system generally includes a flatwire electronic site and a flatwire bus electronically connecting the flatwire electronic site and an electronic device in the engine compartment. The flatwire electronic site has a flexible substrate with electronic components attached to the substrate for operation of the electronic device. The flatwire electronic site is mounted to the engine side of the bulkhead for thermal cooling of the flatwire electronic site. A cover is attached to the bulkhead which encloses a flatwire electronic site for environmental protection.

Abstract: An electronic system generally includes a flatwire electronic site and a flatwire bus electronically connecting the flatwire electronic site and an electronic device in the engine compartment. The flatwire electronic site has a flexible substrate with electronic components attached to the substrate for operation of the electronic device. The flatwire electronic site is mounted to the engine side of the bulkhead for thermal cooling of the flatwire electronic site. A cover is attached to the bulkhead which encloses a flatwire electronic site for environmental protection.

Abstract: An electronic system generally includes a flatwire electronic site and a flatwire bus electronically connecting the flatwire electronic site to an electronic device in the engine compartment. The flatwire electronic site has a flexible substrate with electronic components attached to the substrate for operation of the electronic device. The flatwire electronic site is mounted to the passenger site of the bulkhead for thermal cooling as well as protection from the harsh environment of the engine compartment. The bulkhead has an aperture sized to allow the flatwire bus to pass through the bulkhead into the engine compartment. By utilizing a flatwire bus, this aperture is small in size and the integrity of the bulkhead is improved.

Abstract: The electronic system generally includes an electronic panel having circuitry plated on a surface thereof as well as electronic components attached thereto. The circuitry connects the electronic components for operation of the electronic device in the engine compartment. A flatwire bus electronically connects the electronic panel and the electronic device in the engine compartment for transmitting signals there between. The electronic panel is directly connected to the bulkhead.

Abstract: The present invention provides in one embodiment, a system for encapsulating a substrate on a vehicle structure. The system includes the substrate, the vehicle structure and a package substrate. The substrate has a top portion and a bottom portion. The vehicle structure is operatively connected to the bottom portion of the substrate. The package substrate has a plurality of layers, where the package substrate is operatively connected to the top portion of the substrate. The package substrate conforms to a periphery area of the top portion of the substrate.