Patents by Inventor Andrew H. Ashwill

Andrew H. Ashwill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11769977
    Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: September 26, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
  • Patent number: 11682876
    Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: June 20, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
  • Publication number: 20210075176
    Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.
    Type: Application
    Filed: November 16, 2020
    Publication date: March 11, 2021
    Inventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
  • Publication number: 20210075175
    Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.
    Type: Application
    Filed: November 16, 2020
    Publication date: March 11, 2021
    Inventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
  • Patent number: 10840662
    Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: November 17, 2020
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
  • Publication number: 20160294141
    Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.
    Type: Application
    Filed: March 31, 2016
    Publication date: October 6, 2016
    Inventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane