Patents by Inventor Andrew H. Barada

Andrew H. Barada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10082461
    Abstract: An integrated metrology module includes a chuck for holding a sample and positioning the sample with respect to an optical metrology device, a reference chip for the optical metrology device, the reference chip being movable to various positions with respect to the optical metrology device, and a reference chip purge device provides a flow of purge gas or air over the reference chip while the reference chip is in the various positions. The reference chip purge device may be static or movable with the reference chip.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: September 25, 2018
    Assignee: Nanometrics Incorporated
    Inventors: Andrew S. Klassen, Andrew J. Hazelton, Andrew H. Barada, Todd M. Petit, Chuan Sheng Tu
  • Publication number: 20160033399
    Abstract: An integrated metrology module includes a chuck for holding a sample and positioning the sample with respect to an optical metrology device, a reference chip for the optical metrology device, the reference chip being movable to various positions with respect to the optical metrology device, and a reference chip purge device provides a flow of purge gas or air over the reference chip while the reference chip is in the various positions. The reference chip purge device may be static or movable with the reference chip.
    Type: Application
    Filed: July 24, 2015
    Publication date: February 4, 2016
    Inventors: Andrew S. KLASSEN, Andrew J. Hazelton, Andrew H. Barada, Todd M. Petit, Chuan Sheng Tu
  • Patent number: 7169016
    Abstract: Methods and apparatus for substantially continuously measuring the surface of a wafer during a polishing process are disclosed. According to one aspect of the present invention, an apparatus includes a wafer support table that supports a wafer, a polishing pad that polishes a surface of the wafer, and a polishing pad structure that rotates the polishing pad over the surface of the wafer. The apparatus also includes a measuring device which is capable of continuously measuring the surface of the wafer during polishing of the surface of the wafer.
    Type: Grant
    Filed: January 25, 2006
    Date of Patent: January 30, 2007
    Assignee: Nikon Corporation
    Inventors: Andrew H. Barada, Takehiko Ueda
  • Patent number: 4953388
    Abstract: A pneumatic bridge air gauge sensor. A measurement leg and a reference leg are used to measure a gap between a measurement probe and a surface. The two legs are initially balanced resulting in no air flow therebetween. A mass air flow sensor coupled between the two legs detects the mass air flow between the two legs resulting from a change in the gap distance from the balanced state.
    Type: Grant
    Filed: January 25, 1989
    Date of Patent: September 4, 1990
    Assignee: The Perkin-Elmer Corporation
    Inventor: Andrew H. Barada