Abstract: A connector provides capacitive coupling between circuit devices such as printed circuitboards and integrated circuits. The connector includes at least a first contact that contacts a conductor of the first circuit device, a second contact that contacts a conductor of the second circuit device, and a capacitor coupled between the first and second contacts. The connector includes an insulative body that encapsulate the capacitor and carries the first and second contacts. The connector may further include a plurality of the first contacts, a like plurality of the second contacts, and a like plurality of AC blocking capacitors with each capacitor being coupled between a respective different pair of the first contacts and second contacts.

Abstract: One embodiment disclosed relates to a microprocessor for targeted fault-tolerant computing. The microprocessor's decode circuitry is configured to decode a fault-tolerant version of an instruction and a non-fault-tolerant version of the instruction distinctly from each other. The microprocessor's execution circuitry is configured to execute the fault-tolerant version of the instruction with redundancy checking and to execute the non-fault-tolerant version of the instruction without redundancy checking.

Abstract: A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.

Abstract: A rack equipment application performance modification system and method is disclosed for providing a convenient and efficient manner to modify performance of rack equipment based upon an application. In one embodiment of the present invention, a rack equipment application performance modification system comprises rack equipment, an application performance modification component, and a communication bus. The rack equipment processes information. The application performance modification component modifies performance of said rack equipment based upon an application. The communication bus communicatively couples the rack equipment and the application performance modification component and the communication bus communicates information between the application performance modification component and the rack equipment.

Abstract: A heat dissipation apparatus comprising a base and a plurality of fins connected to the base and extending out from the base at a non-orthogonal angle to the base.

Abstract: An apparatus for heat dissipation in a chassis housing an electronic system, and a method for implementing the same. The apparatus comprises a heat sink base for collecting thermal heat. The apparatus further comprises a fin thermally coupled to the heat sink base for dissipating the thermal heat. The fin is arranged in the chassis to direct air flow from a first direction, that is originally directed at said fin, to a second direction.

Abstract: A rack equipment environmental condition adjustment system and method is presented. In one embodiment of the present invention, a rack equipment environmental condition adjustment system includes rack equipment for processing information. An environmental condition adjustment component adjusts the rack equipment based upon environmental conditions. A communication bus for communicatively coupling the rack equipment and the environmental condition adjustment component, wherein the communication bus communicates information between the environmental adjustment component and the rack equipment.

Abstract: A device and method are provided for reducing impedance, impedance discontinuities, and signal-loop area in flex cables used for a signal path. In one embodiment of the invention, a flex cable is provided for reducing the impedance and length of a return-signal path. The flex cable includes a signal conductor, and a return-signal conductor not connected to ground. The flex cable may also include a ground conductor. Such a flex cable provides a shorter- and lower-impedance return-signal path between a signal source and receiver than do conventional flex cables. In another embodiment of the invention, a method is provided that includes the steps of delivering a signal from a signal source to a signal receiver with a flexible conductor, and returning the signal from the signal receiver to the signal source with another flexible conductor other than ground.

Abstract: An apparatus for terminating a transmission line includes a terminating circuit coupled to a first connector portion. A second connector portion mates with the first connector portion. The second connector portion is coupled in electrical contact with the transmission line and includes one or more components, such as pins, that can radiate unwanted electromagnetic interference (EMI) when the transmission line is not terminated. The terminating circuit includes components, such as one or more resistors, that substantially match the impedance of the transmission line. The terminating circuit can also be configured to terminate other conductive lines that can pick up signal noise in a system. The terminating apparatus can be utilized on operational boards that plug into devices such as backplanes or mid-planes. Alternatively, the terminating circuit can be included on a null device or built into the first connector portion.

Abstract: A short card support for supporting a short printed circuit card insertable into an electronic system is disclosed. The short card support has a card guide end adapted to couple to the card guide of the electronic system and a card receptor end adapted to couple with a first edge of the short printed circuit card. A support span between the card guide end and the card receptor end permits the short card support to accommodate varying lengths of short printed circuit cards.

Abstract: A card guide of an apparatus in one example comprises a plurality of card guide portions that serve to guide a circuit board into a chassis. The plurality of card guide portions comprise a first card guide portion and a second card guide portion. The first card guide portion serves to guide the circuit board substantially along a first direction during engagement of the circuit board with the first card guide portion. The second card guide portion serves to guide the circuit board substantially along a second direction that is nonlinear with the first direction during engagement of the circuit board with the second card guide portion.

Abstract: A signal probe includes a tip assembly having a first tip for contacting a first signal node, a second tip for contacting a second signal node, and a tip body for positioning the first tip a distance away from the second tip, the distance corresponding to the spacing between the first and second signal nodes. With the tip body, a technician no longer has to couple a wire between one of the signal nodes and a respective tip to probe the electronic device. Thus, the length of the path that a signal travels from the first signal node to the second signal node may be reduced to increase the accuracy of the signal's measurement.

Abstract: One embodiment disclosed relates to a printed circuit assembly (PCA) with built-in circuitry to detect and communicate an interconnect failure. The PCA includes a connector, a continuity detect circuit, and an interface circuit. The connector is configured to interconnect to an electronic unit. The continuity detect circuit is coupled to the connector for detection of continuity failure in the interconnect. The interface circuit is coupled to the continuity detect circuit for communicating data pertaining to status of the interconnect to system management.

Abstract: One embodiment disclosed relates to a method of status generation for a node of a high-availability cluster. A heartbeat signal is sent from the node through a network to the cluster. In addition, a current status of the node is determined, and the status is sent out through a specialized interface to a next node. Another embodiment disclosed relates to a method of cluster-wide management performed per node. A heartbeat input received from the previous node is checked. Furthermore, an up/down status input received from the previous node and a degraded status input received from the previous node are also checked. Another embodiment disclosed relates to a system for of a high-availability cluster. The system includes a general inter-node communication network that is configured to carry signals including heartbeat signals from the nodes. In addition, a separate inter-node communication channel is included for communicating node status signals.

Abstract: One embodiment disclosed relates to a printed circuit board (PCB) with built-in circuitry to test connector loading. The PCB includes at least the connector to be tested, an indicator circuit, and a switch. The connector is configured to interconnect to a card. The switch couples the connector to the indicator circuit, and integrity of the interconnection between the card and the connector is indicated by the indicator circuit.

Abstract: Described are devices for cooling a component, and methods thereof. The device includes a base that can be coupled to the component so that heat is transferred from the component to the base. The device also includes fins coupled to the base. The fins are arranged to funnel air from an air intake end of the device toward a location on the base.

Abstract: A pivot component of an apparatus in one example is coupled with a first circuit board that comprises a first connection component. The pivot component controls a relative alignment of the first connection component with a second connection component of a second circuit board for an engagement of the first connection component with the second connection component.

Abstract: An assembly for supporting a short printed circuit card includes a card slot separator disposed in a card bay of a computer system and at least one card support block. The at least one card support block couples to the card slot separator and can be selectively positioned along the card slot separator for reception of an unsupported edge of the short printed circuit card.

Abstract: An embodiment of a cable system includes a cable that has a conductor, a power layer and dielectric material. The conductor is operative to carry a signal, the dielectric material is located at least partially between the conductor and the power layer, and the power layer is operative as ground. The power layer is formed of a conductive material and includes a first region and an adjacent second region. The first region includes a greater amount of the conductive material than the second region so that the power layer is less resistant to bending along the second region than along the first region. Methods and other systems are also provided.

Abstract: A pivot component of an apparatus in one example is coupled with a first circuit board that comprises a first connection component. The pivot component controls a relative alignment of the first connection component with a second connection component of a second circuit board for an engagement of the first connection component with the second connection component.