Abstract: The present invention provides a moisture-reactive hot melt adhesive composition. The composition comprises: (a) urethane prepolymer, derived from at least one polyol and at least one polyisocyanate, and having free isocyanate groups effective to cure the composition in the presence of moisture; and (b) acrylic(co)polymer, wherein the acrylic (co)polymer comprises one or more residues of an (alk)acrylate (co)monomer of formula (I) wherein the group R contains at least one cyclic, tertiary or quaternary carbon, R is attached to the group —C(O)O— via a cyclic or tertiary carbon atom and wherein R? is a hydrogen or an alkyl group. The invention extends to use of an acrylic (co)polymer in a moisture reactive hot melt adhesive composition as a stringing reducing agent; a substrate comprising the moisture reactive hot melt adhesive composition; and a method of bonding materials together with the composition.