Patents by Inventor Andrew Hilley

Andrew Hilley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reactive hot-melt adhesive for use on electronics
    Patent number: 9659832
    Abstract: The disclosure relates to a method of making an electronic assembly with a reactive hot-melt adhesive composition that include an atmospheric curing prepolymer and optionally a thermoplastic component with a softening point of at least about 120° C., and the electronic assembly made therewith.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: May 23, 2017
    Assignee: H.B. Fuller Company
    Inventors: Albert M. Giorgini, Andrew Hilley
  • REACTIVE HOT-MELT ADHESIVE FOR USE ON ELECTRONICS
    Publication number: 20140242323
    Abstract: The disclosure relates to a method of making an electronic assembly with a reactive hot-melt adhesive composition that include an atmospheric curing prepolymer and optionally a thermoplastic component with a softening point of at least about 120° C., and the electronic assembly made therewith.
    Type: Application
    Filed: July 19, 2012
    Publication date: August 28, 2014
    Inventors: Albert M. Giorgini, Andrew Hilley