Abstract: A non-volatile memory cell includes NMOS programming, read, erase, and control transistors having gate electrodes connected to a storage node. The erase and control transistors have interconnected source, drain, and bulk electrodes. The cell is programmed by setting source, drain, bulk, and gate electrodes of all transistors to a positive voltage. An inhibiting voltage is applied to source, drain, and bulk electrodes of the read transistor, while setting source and drain electrodes of the programming transistor to the positive voltage and the bulk electrode of the programming transistor to the positive voltage or the inhibiting voltage. Source, drain, and bulk electrodes of the control transistor are then ramped to a negative control voltage while ramping source, drain, and bulk electrodes of the erase transistor to a negative erase voltage and then back to the positive voltage. Source, drain.

Abstract: A non-volatile memory (NVM) cell structure comprises a PMOS program transistor having source, drain and bulk region electrodes and a gate electrode that is connected to a data storage node; an NMOS control transistor having source, drain and bulk region electrodes that are commonly-connected to receive a control voltage and a gate electrode that is connected to the data storage node; a PMOS erase transistor having source, drain and bulk region electrodes that are commonly-connected to receive an erase voltage and a gate electrode that is connected to the data storage node; and an NMOS read transistor having source, drain and bulk region electrodes and a gate electrode connected to the data storage node.

Abstract: An NVM cell design enables direct reading of cell output voltage to determine data stored in the cell, while providing low current consumption and a simple program sequence that utilizes reverse Fowler-Nordheim tunneling.

Abstract: A non-volatile memory (NVM) cell structure comprises an NMOS control transistor having source, drain and bulk region electrodes that are commonly-connected to receive a control voltage and a gate electrode that is connected to a data storage node; a PMOS erase transistor having source, drain and bulk region electrodes that are commonly-connected to receive an erase voltage and a gate electrode that is connected to the data storage node; and an NMOS data transistor having source, drain and bulk region electrodes and a gate electrode connected to the data storage node.

Abstract: A non-volatile memory (NVM) cell structure comprises a PMOS program transistor having source, drain and bulk region electrodes and a gate electrode that is connected to a data storage node; an NMOS control transistor having source, drain and bulk region electrodes that are commonly-connected to receive a control voltage and a gate electrode that is connected to the data storage node; a PMOS erase transistor having source, drain and bulk region electrodes that are commonly-connected to receive an erase voltage and a gate electrode that is connected to the data storage node; and an NMOS read transistor having source, drain and bulk region electrodes and a gate electrode connected to the data storage node.

Abstract: An NVM cell design enables direct reading of cell output voltage to determine data stored in the cell, while providing low current consumption and a simple program sequence that utilizes reverse Fowler-Nordheim tunneling.

Abstract: A 4-transistor non-volatile memory (NVM) cell includes a static random access memory (SRAM) cell structure. The NVM cell utilizes a reverse Fowler-Nordheim tunneling programming technique that, in combination with the SRAM cell structure, allows an entire array to be programmed at one cycle. Equalize transistors are utilized to obtain more uniform voltage on the floating gates after an erase operation. Utilization of decoupling pas gates during a read operation results in more charge difference on floating gates of programmed and erased cells.

Abstract: Anti-pirate circuitry is provided for combating the theft of intellectual property contained with semiconductor integrated circuits. The anti-pirate circuit includes a unique number generator that provides a multi-bit die ID data string that is unique to the integrated circuit associated with the anti-pirate circuit. One time programmable (OTP) EPROM circuitry reads the die ID data string at wafer sort and writes the data content to nonvolatile memory. During a subsequent verification cycle, ID comparator circuitry compares the data string provided by the unique number generator to the stored contents of the nonvolatile memory. If the comparison results in a mismatch between more than a predefined number of bits, then the integrated circuit associated with the anti-pirate circuit is not enabled for operation.

Abstract: In a SRAM structure, space and power saving is achieved by providing row and column select lines to select a specific bit cell, and reducing the number of bit lines in the structure used for writing to and reading from the bit cells. The number of bit lines is reduced by sharing bit lines of adjacent bit cells. Furthermore, in order to achieve power saving, the load on the row select lines is reduced by sharing the pass gates between adjacent bit cells that are used to control precharging, reading from and writing to the bit cells.

Abstract: A non-volatile memory (NVM) cell splits its basic functions, i.e. program, erase, read and control, among a four PMOS transistor structure, allowing independent optimization of each cell function. The cell structure also includes an embedded static random access memory (SRAM) cell that utilizes a latch structure to preprogram data to be written to the cell and a plurality of cascoded NMOS pass gates. The cell structure reduces total programming time and provides the flexibility of programming the entire cell array simultaneously or one row or sector of the array at a time.

Abstract: A non-volatile memory (NVM) cell splits its basic function, i.e. program, erase, read and control, among a four PMOS transistor structure, allowing independent optimization of each function. The cell structure also includes an embedded static random access memory (SRAM) cell that utilizes a latch structure to preprogram data to be written to the cell. The programming method for the cell utilizes a reverse Fowler-Nordheim tunneling mechanism with a very small programming current, allowing an entire NVM array to be programmed at one cycle.

Abstract: In accordance with a method of programming an NVM array that includes 4-transistor PMOS non-volatile memory (NVM) cells having commonly connected floating gates, for all the cell's in the array that are to be programmed, all the electrodes of the cell are grounded. Then, an inhibiting voltage Vn is applied to the bulk-connected source region Vr of the cell's read transistor Pr, to the commonly connected drain, bulk and source regions Ve of the cell's erase transistor Pe, and to the drain region Dr of the read transistor Pr. The source region Vp and the drain region Dp of the cell's programming transistor Pw are grounded. The bulk Vnw of the programming transistor Pw is optional; it can be grounded or remain at the inhibiting voltage Vn. For all cells in the NVM array that are not selected for programming, the inhibiting voltage Vn is applied to Vr, Ve and Dr and is also applied to Vp, Dp and Vnw.

Abstract: In a ROM structure, power consumption is reduced by providing for pre-discharging of only the bit line corresponding to the memory location that is being read. Column select lines are coupled to logic to switch in a pre-discharging circuit prior to reading, and to disconnect, from the pre-discharging circuit during reading, only the bit line corresponding to the memory location being read.

Abstract: In a SRAM structure, power consumption is reduced by providing a structure which allows specific memory cells to be selected using word lines and column select lines, and reducing the load on the column address lines by dividing the load into sectors. The dividing into sectors is achieved by making use of sector select lines for selecting two or more rows of cells, and logically ANDing the sector select lines with the column select lines.

Abstract: A method of selectively programming nonvolatile memory cells in which multiple programming voltages are used to obtain the desired voltage on the storage nodes of the cells selected for programming, while the storage nodes of unselected cells remain undisturbed.

Abstract: A method of programming a nonvolatile memory cell in which a ramped control voltage is used to obtain the desired voltage on the storage node.

Abstract: An integrated nonvolatile memory circuit having a plurality of control devices. Separate devices execute distinct control, erase, write and read operations, thereby allowing each device to be individually selected and optimized for performing its respective operation.

Abstract: A SRAM system which provides for reduced power consumption. The SRAM system utilizes an array of bit cells. Columns of bit cells in the array are partitioned into sections. Each section of bit cells shares a local bit line. A sector select circuit provides for precharging the local bit lines. The sector select circuit also includes a mux for connecting a local bit line to a global bit line. The sector select circuit includes a device for detecting when a sector select signal and a column select signal are present. When both of these signals are present the sector select circuit couples the local bit line with the global bit line, and disengages the precharging of the local bit line.

Abstract: A ROM array which provides for reduced size and power consumption. The bit cell of the ROM provides that a first type of information is stored in the bit cell when a transistor is disposed between a bit line and a word line, and a second type of information is stored in the cell when no transistor is disposed between the bit line and the word line. In the bit cell a contact between a bit line and a region where a transistor drain can be formed in a substrate is provided in those instances when a transistor is formed between the bit line and a word line. In those instances when a bit cell provides no transistors between the word line and the bit line, no contact is provided between the bit line and the region where a transistor drain can be formed. Further, where a bit cell does not provide a transistor between the bit line and the word line a bit cell region in the substrate can consist substantially of an isolating dielectric material.

Abstract: Anti-pirate circuitry is provided for combating the theft of intellectual property contained with semiconductor integrated circuits. The anti-pirate circuit includes a unique number generator that provides a multi-bit die ID data string that is unique to the integrated circuit associated with the anti-pirate circuit. One time programmable (OTP) EPROM circuitry reads the die ID data string at wafer sort and writes the data content to nonvolatile memory. During a subsequent verification cycle, ID comparator circuitry compares the data string provided by the unique number generator to the stored contents of the nonvolatile memory. If the comparison results in a mismatch between more than a predefined number of bits, then the integrated circuit associated with the anti-pirate circuit is not enabled for operation.