Patents by Inventor Andrew J. Frankovsky

Andrew J. Frankovsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for directly powering a multi-chip module from a power distribution bus
    Patent number: 4628411
    Abstract: A direct module powering scheme is disclosed. A plurality of integrated circuit chips are mounted on a module. The module is mounted on a printed circuit board. A plurality of metallization layers are distributed in parallel fashion within the module. A voltage tab is mounted on the edge of the module substrate and in contact with the edge of the metallization layers. The voltage tab may be attached to a source of power for providing the necessary voltage and current to the module needed to power the chips mounted on the module. The metallization layers comprise voltage distribution layers and voltage reference (ground) layers. The voltage tab is connected to the edge of the voltage distribution layer. A plurality of plated vias are disposed through the module in contact with one or more of the metallization layers.
    Type: Grant
    Filed: May 2, 1985
    Date of Patent: December 9, 1986
    Assignee: International Business Machines Corporation
    Inventors: Demetrios Balderes, Andrew J. Frankovsky, Robert A. Jarvela