Patents by Inventor Andrew J. Martin

Andrew J. Martin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10504807
    Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: December 10, 2019
    Assignee: International Business Machines Corporation
    Inventors: Taryn J. Davis, Jonathan R. Fry, Terence L. Kane, Christopher F. Klabes, Andrew J. Martin, Vincent J. McGahay, Kathryn E. Schlichting, Melissa A. Smith
  • Publication number: 20190358041
    Abstract: A joint prosthesis system is suitable for cementless fixation. The system includes a metal implant component that has a mounting surface for supporting an insert. The metal implant component includes a solid metal portion and a porous metal portion. The porous metal portion has surfaces with different characteristics, such as roughness, to improve bone fixation, ease removal of the implant component in a revision surgery, reduce soft tissue irritation, improve the strength of a sintered bond between the solid and porous metal portions, or reduce or eliminate the possibility of blood traveling through the porous metal portion into the joint space. A method of making the joint prosthesis is also disclosed. The invention may also be applied to discrete porous metal implant components, such as augment.
    Type: Application
    Filed: August 7, 2019
    Publication date: November 28, 2019
    Inventors: STEPHANIE M. WAINSCOTT, DAREN L. DEFFENBAUGH, HENGDA D. LIU, ANDREW J. MARTIN, JEFFREY A. RYBOLT, BRYAN J. SMITH, ANTHONY D. ZANNIS
  • Patent number: 10433964
    Abstract: A joint prosthesis system is suitable for cementless fixation. The system has two metal implant components and a bearing. One of the metal implant components has an articulation surface for articulation with the bearing. The other metal implant component has a mounting surface for supporting the bearing. One of the metal implant components includes a solid metal portion and a porous metal portion. The porous metal portion has surfaces with different characteristics, such as roughness, to improve bone fixation, ease removal of the implant component in a revision surgery, reduce soft tissue irritation, improve the strength of a sintered bond between the solid and porous metal portions, or reduce or eliminate the possibility of blood traveling through the porous metal portion into the joint space. A method of making the joint prosthesis is also disclosed. The invention may also be applied to discrete porous metal implant components, such as augment.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: October 8, 2019
    Assignee: DEPUY IRELAND UNLIMITED COMPANY
    Inventors: Stephanie M Wainscott, Daren L Deffenbaugh, Hengda D Liu, Andrew J Martin, Jeffrey A Rybolt, Bryan J Smith, Anthony D Zannis
  • Publication number: 20190271237
    Abstract: Casings and methods for manufacturing casings are provided. For example, a casing defining radial, axial, and circumferential directions is provided. The casing comprises an annular inner wall and an annular outer wall, each extending along the axial direction, with the outer wall radially spaced apart from the inner wall. The casing also comprises an auxetic structure extending from the inner wall to the outer wall and including a plurality of lattice elements. Each lattice element extends circumferentially and radially from the inner to the outer wall, and the lattice elements are axially spaced apart from one another. The auxetic structure may define at least one aperture for fluid flow from one portion to another of the auxetic structure and/or may be configured to vary the thermal characteristics of the casing along the axial direction. The casing may be integrally formed as a single monolithic component, e.g., by additive manufacturing.
    Type: Application
    Filed: March 1, 2018
    Publication date: September 5, 2019
    Inventors: Andrew J. Martin, Arthur William Sibbach
  • Publication number: 20190143408
    Abstract: In one aspect, an additive manufacturing system is provided. The additive manufacturing system includes a build platform, a first plurality of particles positioned on the build platform, and a particle containment system positioned on the build platform. The particle containment system includes a particle containment wall. The particle containment wall at least partially surrounds the first plurality of particles and includes a second plurality of particles consolidated together. The particle containment wall includes a top end spaced apart from the build platform, an inner face positioned against the first plurality of particles and extending between the build platform and the top end, and an outer face that faces a substantially particle-free region, the outer face positioned opposite the inner face and extending between the build platform and the top end.
    Type: Application
    Filed: November 13, 2017
    Publication date: May 16, 2019
    Inventors: Michael Evans Graham, William Monaghan, Thomas Charles Adcock, Andrew J. Martin, John Joseph Madelone, Jr., David Charles Bogdan, Jr., John Broddus Deaton, Jr., William Thomas Carter
  • Patent number: 10217682
    Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: a substrate having an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of spatially distributed electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: February 26, 2019
    Assignee: International Business Machines Corporation
    Inventors: Taryn J. Davis, Jonathan R. Fry, Terence L. Kane, Christopher F. Klabes, Andrew J. Martin, Vincent J. McGahay, Kathryn E. Schlichting, Melissa A. Smith
  • Publication number: 20190025526
    Abstract: The present disclosure provides embodiments of fiber optic cable connectors, sleeves for fiber optic cable connectors, fiber optic cable adapters and fiber optic connector assemblies that incorporate intelligent systems that can identify presence and exchange information.
    Type: Application
    Filed: July 19, 2018
    Publication date: January 24, 2019
    Inventors: Mohammad H. Raza, Boby Joseph, Andrew J. Martin, Robert C. O'Neill
  • Publication number: 20180350702
    Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.
    Type: Application
    Filed: July 24, 2018
    Publication date: December 6, 2018
    Inventors: Taryn J. Davis, Jonathan R. Fry, Terence L. Kane, Christopher F. Klabes, Andrew J. Martin, Vincent J. McGahay, Kathryn E. Schlichting, Melissa A. Smith
  • Patent number: 10060974
    Abstract: Approaches for detecting wear in integrated circuit chips are provided. An on-chip sensor system includes an integrated circuit chip including a plurality of sensor groups. Each respective one of the sensor groups is structured and arranged to detect a measure of wear corresponding to a respective one of a plurality of failure mechanisms.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: August 28, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Jonathan R. Fry, Christopher Klabes, Andrew J. Martin, Vincent J. McGahay, Kathryn E. Schlichting, Melissa A. Smith
  • Publication number: 20180226308
    Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: a substrate having an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of spatially distributed electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.
    Type: Application
    Filed: April 10, 2018
    Publication date: August 9, 2018
    Inventors: Taryn J. Davis, Jonathan R. Fry, Terence L. Kane, Christopher F. Klabes, Andrew J. Martin, Vincent J. McGahay, Kathryn E. Schlichting, Melissa A. Smith
  • Patent number: 10032683
    Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: a substrate having an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of spatially distributed electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: July 24, 2018
    Assignee: International Business Machines Corporation
    Inventors: Taryn J. Davis, Jonathan R. Fry, Terence L. Kane, Christopher F. Klabes, Andrew J. Martin, Vincent J. McGahay, Kathryn E. Schlichting, Melissa A. Smith
  • Publication number: 20180178287
    Abstract: A method is provided for controlling an additive manufacturing process in which one or more energy beams are used to selectively fuse a powder contained in an additive manufacturing machine having a gas flow therein in order to form a workpiece, in the presence of one or more plumes generated by interaction of the one or more energy beams with the powder, wherein the process is controlled by an electronic controller. The method includes: performing a build process to form a workpiece using a set of initial process parameters; sensing a condition of the finished workpiece; using the electronic controller, comparing the condition of the finished workpiece to a predetermined standard; using the electronic controller, changing one or more of the initial process parameters to define a set of revised process parameters; and performing a subsequent build process using the revised process parameters.
    Type: Application
    Filed: December 23, 2016
    Publication date: June 28, 2018
    Inventors: Justin Mamrak, Andrew J. Martin, Mackenzie Ryan Redding
  • Publication number: 20180178286
    Abstract: A method of monitoring an additive manufacturing process in which one or more energy beams are used to selectively fuse a powder to form a workpiece, in the presence of one or more plumes generated by interaction of the one or more energy beams with the powder. The method includes using at least one sensor to generate at least one signal representative of a trajectory of one or more of the plumes.
    Type: Application
    Filed: December 23, 2016
    Publication date: June 28, 2018
    Inventors: Andrew J. Martin, Mackenzie Ryan Redding, Justin Mamrak
  • Publication number: 20180178284
    Abstract: A method of controlling an additive manufacturing process in which one or more energy beams are used to selectively fuse a powder to form a workpiece, in the presence of one or more plumes generated by interaction of the one or more energy beams with the powder. The method includes controlling at least one of: a trajectory of the one or more plumes, and the one or more energy beams, so as to prevent the one or more energy beams from intersecting the one or more plumes.
    Type: Application
    Filed: December 23, 2016
    Publication date: June 28, 2018
    Inventors: Andrew J. Martin, Mackenzie Ryan Redding, Justin Mamrak
  • Publication number: 20180178285
    Abstract: A method of controlling an additive manufacturing process in which one or more energy beams are used to selectively fuse a powder contained in a build chamber having a gas flow therein in order to form a workpiece, in the presence of one or more plumes generated by interaction of the one or more energy beams with the powder. The method includes controlling a trajectory of at least one of the plumes, so as to prevent the one or more energy beams from intersecting the one or more plumes.
    Type: Application
    Filed: December 23, 2016
    Publication date: June 28, 2018
    Inventors: Andrew J. Martin, Mackenzie Ryan Redding, Justin Mamrak
  • Publication number: 20170239052
    Abstract: A joint prosthesis system is suitable for cementless fixation. The system has two metal implant components and a bearing. One of the metal implant components has an articulation surface for articulation with the bearing. The other metal implant component has a mounting surface for supporting the bearing. One of the metal implant components includes a solid metal portion and a porous metal portion. The porous metal portion has surfaces with different characteristics, such as roughness, to improve bone fixation, ease removal of the implant component in a revision surgery, reduce soft tissue irritation, improve the strength of a sintered bond between the solid and porous metal portions, or reduce or eliminate the possibility of blood traveling through the porous metal portion into the joint space. A method of making the joint prosthesis is also disclosed. The invention may also be applied to discrete porous metal implant components, such as augment.
    Type: Application
    Filed: May 8, 2017
    Publication date: August 24, 2017
    Inventors: STEPHANIE M. WAINSCOTT, DAREN L. DEFFENBAUGH, HENGDA D. LIU, ANDREW J. MARTIN, JEFFREY A. RYBOLT, BRYAN J. SMITH, ANTHONY D. ZANNIS
  • Patent number: 9620396
    Abstract: Disclosed is a process of annealing through silicon vias (TSVs) or other deeply buried metallic interconnects using a back side laser annealing process. The process provides several advantages including sufficient grain growth and strain relief of the metal such that subsequent thermal processes do not cause further grain growth; shorter anneal times thereby reducing cycle time of 3D device fabrication; and reduced pattern sensitivity of laser absorption.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: April 11, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Oleg Gluschenkov, Andrew J. Martin, Joyeeta Nag
  • Patent number: 9536784
    Abstract: A method of forming through silicon vias (TSVs) on integrated circuit (IC) chips and the IC chips. A TSV pattern on a stack of wiring layers on the surface of the IC chip identifies TSV locations. Etching the IC chip TSV pattern opens a cup shaped through hole through the stack to the silicon substrate at each TSV pattern location. The etched stack forms a TSV hard mask open (HMO) for the silicon substrate. Via through holes etched through the silicon substrate masked by the HMO are filled with conductor connecting IC circuits, e.g., to signal lines on the bottom of the chip.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: January 3, 2017
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Mukta G. Farooq, Andrew J. Martin, Jennifer A. Oakley
  • Publication number: 20160379883
    Abstract: A method of forming through silicon vias (TSVs) on integrated circuit (IC) chips and the IC chips. A TSV pattern on a stack of wiring layers on the surface of the IC chip identifies TSV locations. Etching the IC chip TSV pattern opens a cup shaped through hole through the stack to the silicon substrate at each TSV pattern location. The etched stack forms a TSV hard mask open (HMO) for the silicon substrate. Via through holes etched through the silicon substrate masked by the HMO are filled with conductor connecting IC circuits, e.g., to signal lines on the bottom of the chip.
    Type: Application
    Filed: June 25, 2015
    Publication date: December 29, 2016
    Inventors: Mukta G. Farooq, Andrew J. Martin, Jennifer A. Oakley
  • Publication number: 20160372391
    Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: a substrate having an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of spatially distributed electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.
    Type: Application
    Filed: June 16, 2015
    Publication date: December 22, 2016
    Inventors: Taryn J. Davis, Jonathan R. Fry, Terence L. Kane, Christopher F. Klabes, Andrew J. Martin, Vincent J. McGahay, Kathryn E. Schlichting, Melissa A. Smith