Abstract: Techniques for making glass components for electronic devices are disclosed. The techniques disclosed herein can be used to modify a glass workpiece to form a three-dimensional glass component, such as a glass cover member. The techniques may involve reshaping the glass workpiece, fusing glass layers of the workpiece, or combinations of these. Glass components and electronic devices including these components are also disclosed.

Abstract: Techniques for making glass components for electronic devices are disclosed. The techniques disclosed can be used to shape a glass workpiece to form a three-dimensional glass component, such as a glass cover member. Glass components and enclosures and electronic devices including the glass components are also disclosed.

Abstract: An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.

Abstract: An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.

Abstract: An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.

Abstract: An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.

Abstract: A method of forming a ceramic component is disclosed. A ceramic matrix material is combined with a binder material. The ceramic matrix material and the binder material are mixed to create an intermediate slurry. After mixing the ceramic matrix material and the binder material, reinforcing fibers are added to the intermediate slurry to create a final slurry. The final slurry is introduced into a mold cavity having a shape corresponding to the ceramic component. The final slurry is at least partially cured within the mold cavity to form an intermediate casting. The intermediate casting is sintered to produce the ceramic component from the intermediate casting.

Abstract: An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.

Abstract: Manufacturing methods that combine molding processes and shaping processes are described. The systems and methods described can be used to form composite parts using a single manufacturing process. In some embodiments, the methods involve positioning a workpiece within a mold cavity, then injecting a moldable material within the cavity at pressures sufficient to deform the workpiece such that features, such as protrusions or cavities, are formed within the workpiece. The resultant composite part includes the workpiece molded to a molded material. In some embodiments, the workpiece is a layer of metal material and the molded material is a structurally rigid plastic material, such that the composite part is a structurally rigid plastic with a metal coating. In some embodiments, multiple workpieces are molded within a composite part.

Abstract: Manufacturing methods that combine molding processes and shaping processes are described. The systems and methods described can be used to form composite parts using a single manufacturing process. In some embodiments, the methods involve positioning a workpiece within a mold cavity, then injecting a moldable material within the cavity at pressures sufficient to deform the workpiece such that features, such as protrusions or cavities, are formed within the workpiece. The resultant composite part includes the workpiece molded to a molded material. In some embodiments, the workpiece is a layer of metal material and the molded material is a structurally rigid plastic material, such that the composite part is a structurally rigid plastic with a metal coating. In some embodiments, multiple workpieces are molded within a composite part.

Abstract: A method of forming a ceramic component is disclosed. A ceramic matrix material is combined with a binder material. The ceramic matrix material and the binder material are mixed to create an intermediate slurry. After mixing the ceramic matrix material and the binder material, reinforcing fibers are added to the intermediate slurry to create a final slurry. The final slurry is introduced into a mold cavity having a shape corresponding to the ceramic component. The final slurry is at least partially cured within the mold cavity to form an intermediate casting. The intermediate casting is sintered to produce the ceramic component from the intermediate casting.

Abstract: Manufacturing methods related to anodizing of metal parts are described. In particular, pre-anodizing and post-anodizing methods for forming a consistent and defect-free interface between metal and non-metal sections of a part are described. Methods involve preventing residues from various manufacturing processes from entering a gap or space at the interface between the metal and non-metal section of the part and that can disrupt subsequent anodizing and anodic film dyeing processes. In particular embodiments, methods involve forming a barrier layer or filler layer between the metal and non-metal sections. Portions of the barrier layer or filler layer can be removed prior to anodizing. The resultant part has a well-defined and uniform space between the metal and non-metal sections that is free from visual defects.

Abstract: Manufacturing methods related to anodizing of metal parts are described. In particular, pre-anodizing and post-anodizing methods for forming a consistent and defect-free interface between metal and non-metal sections of a part are described. Methods involve preventing residues from various manufacturing processes from entering a gap or space at the interface between the metal and non-metal section of the part and that can disrupt subsequent anodizing and anodic film dyeing processes. In particular embodiments, methods involve forming a barrier layer or filler layer between the metal and non-metal sections. Portions of the barrier layer or filler layer can be removed prior to anodizing. The resultant part has a well-defined and uniform space between the metal and non-metal sections that is free from visual defects.