Patents by Inventor Andrew J. Neuhalfen

Andrew J. Neuhalfen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface-mountable device for protection against electrostatic damage to electronic components
    Patent number: 6191928
    Abstract: The thin film, electrical device is an subminiature overvoltage circuit protection device in a surface mountable configuration for use in printed circuit board or thick film hybrid circuit technology. The surface mountable device (SMD) is designed to protect against electrostatic discharge (ESD) damage to electronic components. The circuit protection device comprises three material subassemblies. The first subassembly generally includes a substrate carrier, electrodes, and terminal pads for connecting the protection device 60 to a PC board. The second subassembly includes a voltage variable polymer material with nonlinear resistance characteristics, and the third subassembly includes a cover coat for protecting other elements of the circuit protection device.
    Type: Grant
    Filed: February 23, 1999
    Date of Patent: February 20, 2001
    Assignee: Littelfuse, Inc.
    Inventors: Louis Rector, Hugh M. Hyatt, Anthony Minervini, Robert Swensen, Andrew J. Neuhalfen, Andrew W. S. Elliott
  • Printed circuit board assembly having an integrated fusible link
    Patent number: 6043966
    Abstract: A printed circuit board assembly comprising a printed circuit board having a plurality of conductive traces deposited on a surface thereof to define a plurality of electrical circuit geometries. A plurality of thin film fuses are deposited on the printed circuit board, each fuse providing circuit protection to one of the plurality of conductive traces.
    Type: Grant
    Filed: May 13, 1999
    Date of Patent: March 28, 2000
    Assignee: Littelfuse, Inc.
    Inventors: David J Krueger, Andrew J. Neuhalfen
  • Surface-mountable device having a voltage variable polgmeric material for protection against electrostatic damage to electronic components
    Patent number: 6023028
    Abstract: The thin film, circuit device is an subminiature overvoltage protection device in a surface mountable configuration for use in printed circuit board or thick film hybrid circuit technology. The surface mountable device (SMD) is designed to protect against electrostatic discharge (ESD) damage to electronic components.The circuit protection device includes three material subassemblies. The first subassembly generally includes a substrate carier, electrodes, and terminal pads for connecting the protection device 60 to a PC board. The second subassembly includes a voltage variable polymer material with non-linear characteristics, and the third subassembly includes a cover coat for protecting other elements of the circuit protection device.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: February 8, 2000
    Assignee: Littelfuse, Inc.
    Inventor: Andrew J. Neuhalfen
  • Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components
    Patent number: 5974661
    Abstract: The thin film, circuit device is a subminiature overvoltage protection device in a surface mountable configuration for use in printed circuit board or thick film hybrid circuit technology. The surface mountable device (SMD) is designed to protect against electrostatic discharge (ESD) damage to electronic components.The circuit protection device comprises three material subassemblies. The first subassembly generally includes a substrate carrier, electrodes, and terminal pads for connecting the protection device to a PC board. The second subassembly includes a voltage variable polymer material with non-linear characteristics, and the third subassembly includes a cover coat for protecting the circuit protection device.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: November 2, 1999
    Assignee: Littelfuse, Inc.
    Inventor: Andrew J. Neuhalfen
  • Method of manufacturing a surface-mounted fuse device
    Patent number: 5943764
    Abstract: A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate and terminal pads. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polyurethane gel or paste. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: August 31, 1999
    Assignee: Littelfuse, Inc.
    Inventors: Vladimir Blecha, Katherine M. McGuire, Andrew J. Neuhalfen, Daniel B. Onken
  • Printed circuit board assembly having an integrated fusible link
    Patent number: 5923239
    Abstract: A printed circuit board assembly comprising a printed circuit board having a plurality of conductive traces deposited on a surface thereof to define a plurality of electrical circuit geometries. A plurality of thin film fuses are deposited on the printed circuit board, each fuse providing circuit protection to one of the plurality of conductive traces.
    Type: Grant
    Filed: December 2, 1997
    Date of Patent: July 13, 1999
    Assignee: Littelfuse, Inc.
    Inventors: David J Krueger, Andrew J. Neuhalfen
  • Method of protecting a surface-mount fuse device
    Patent number: 5844477
    Abstract: A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate and terminal pads. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polycarbonate adhesive. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
    Type: Grant
    Filed: October 23, 1995
    Date of Patent: December 1, 1998
    Assignee: Littelfuse, Inc.
    Inventors: Vladmir Blecha, Katherine M. McGuire, Andrew J. Neuhalfen, Daniel B. Onken
  • Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces
    Patent number: 5790008
    Abstract: A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate with a groove on side surfaces and a plurality of conductive terminal pad layers. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polyurethane gel or paste. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
    Type: Grant
    Filed: January 14, 1997
    Date of Patent: August 4, 1998
    Assignee: Littlefuse, Inc.
    Inventors: Vladimir Blecha, Katherine M. McGuire, Andrew J. Neuhalfen, Daniel B. Onken
  • Surface-mounted fuse device
    Patent number: 5552757
    Abstract: A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate and terminal pads. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polycarbonate adhesive. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
    Type: Grant
    Filed: May 27, 1994
    Date of Patent: September 3, 1996
    Assignee: Littelfuse, Inc.
    Inventors: Vladimir Blecha, Katherine M. McGuire, Andrew J. Neuhalfen, Daniel B. Onken