Abstract: A circuit board (10, 50, 70) and method transport a conduction medium (75) through the circuit board for operating a semiconductor device (16, 60, 77, 79) supported on a surface (15, 62, 82) of the circuit board. A medium transport cavity (20, 36, 54, 80) is formed in the circuit board such that a portion (36, 54, 80) runs parallel to the surface, and therefore has a length greater than the thickness of the circuit board. The conduction medium can include air, a coolant fluid, or an optical fiber, which can transport energy such as pressure/vacuum, sound, heat or light from an external source to the semiconductor device.

Abstract: An N.times.M electrical connector suitable for use at microwave frequencies comprises a first set of N insulating parallel substrates each containing M notches with adjacent planar conductors and a second set of M parallel substrates having up to N spaced-apart conductors, wherein the notch-to-notch and conductor-to-conductor spacing of the first set matches the substrate-to-substrate spacing of the second set and vice versa, so that when the second set is pushed into the notches of the first set, each notch and associated conductor on the first set aligns with related conductors on the second set of "L" shaped relation. One or more spring contacts at each intersection provide positive electrical connection between the proximate conductors. The arrangement is especially useful for microwave systems since multiple signal lines and ground planes may be connected simultaneously without interference or substantial electrical discontinuity.