Patents by Inventor Andrew J. SLIPPEY

Andrew J. SLIPPEY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-bore constant conductance heat pipe for high heat flux and thermal storage
    Patent number: 10837712
    Abstract: A heat pipe device comprising at least two of the following: an axially grooved bore for thermal transport, the axially grooved bore having an axial groove wick; a phase change material bore for thermal storage, the phase change material bore having internal fins to enhance heat transfer, the internal fins extend along the axis of the phase change material bore; and a porous media bore for accepting high heat fluxes, the porous media bore having a porous media wick in areas of high heat flux.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: November 17, 2020
    Assignee: ADVANCED COOLING TECHNOLOGIES, INC.
    Inventors: Michael Dechristopher, William G. Anderson, Jens E. Weyant, Calin Tarau, Andrew J. Slippey
  • Heat management for electronic enclosures
    Patent number: 9578781
    Abstract: An enclosure and method for housing electrical components. The enclosure includes walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. The at least one thermal transport device has a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion. The at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: February 21, 2017
    Assignee: Advanced Cooling Technologies, Inc.
    Inventors: Andrew J. Slippey, Michael C. Ellis
  • HEAT MANAGEMENT FOR ELECTRONIC ENCLOSURES
    Publication number: 20150327402
    Abstract: An enclosure and method for housing electrical components. The enclosure includes walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. The at least one thermal transport device has a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion. The at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 12, 2015
    Applicant: ADVANCED COOLING TECHNOLOGIES, INC.
    Inventors: Andrew J. SLIPPEY, Michael C. ELLIS