Abstract: A Solid State Imaging Sensor Microassembly for miniature, remote head video cameras having small imaging sensor (10) and two circuits boards, top board (30) and bottom board (32). The imaging sensor of the type without a package and protected by the glass cover only, with leads (26) attached directly to the silicon chip (22). The sensor leads (26) bonded to opposite edges of the top board (30) placing the imager (10) in parallel alignment to the top board (30) some distance from it. Alternatively the packageless and leadless imaging sensor (12), bonded and connected to the top surface of the top circuit board (60) by the grid of small solder balls (66). Second circuit board (32) bonded perpendicularly and off center to the other side of top board (32) forming structure of an unsymmetrical capital T with one arm shorter than the other.