Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating ceramic ring. An electrically insulating glass material fixes the two or more electrically conducting contact rings to the insulating ceramic ring in axial alignment.

Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating ceramic ring. An electrically insulating glass material fixes the two or more electrically conducting contact rings to the insulating ceramic ring in axial alignment.

Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.

Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.

Abstract: Feedthrough assemblies and methods of manufacturing feedthrough assemblies are provided. Methods include molding a ferrule comprising titanium using metal injection molding and positioning the ferrule about at least a portion of an insulator, the insulator comprising alumina. Methods also include overmolding a ferrule about at least a portion of an insulator using metal injection molding, the ferrule comprising titanium and the insulator comprising alumina. Sintering densifies the ferrule and provides a hermetic seal between the ferrule and insulator. The insulator may be fired or unfired prior to sintering of the ferrule.

Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.

Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.

Abstract: In general, the disclosure is directed toward releasing material within a medical device via an optical feedthrough. A system for releasing material with a medical device comprises a cup that holds a material, wherein the cup includes a discharge port, a seal disc that seals the material within the cup, an optical feedthrough assembly coupled to the cup, a shell that defines a chamber within a medical device, wherein the optical feedthrough assembly is coupled to the shell, and a radiant energy source that shines a beam through the optical feedthrough assembly to puncture the seal disc to allow the material to enter the chamber via the discharge port.

Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating glass material. The electrically insulating glass material fixes the two or more electrically conducting contact rings in axial alignment.

Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.

Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating glass material. The electrically insulating glass material fixes the two or more electrically conducting contact rings in axial alignment.

Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating ceramic ring. An electrically insulating glass material fixes the two or more electrically conducting contact rings to the insulating ceramic ring in axial alignment.

Abstract: A feedthrough assembly, as well as a method of forming a feedthrough assembly, including a metallic ferrule, and a biocompatible, non-conductive, high-temperature, co-fired insulator engaged with the metallic ferrule at an interface between the ferrule and the insulator. The insulator includes a first surface at the interface and a second surface internal to the insulator. At least one conductive member may be disposed at the second surface, wherein at least the first surface of the insulator is devoid of surface cracks greater than 30 ?m. The first surface of the insulator may also be devoid of a surface roughness greater than 0.5 ?m.

Abstract: A method for making a feedthrough assembly for an implantable electronic medical device comprises providing a metallic ferrule having an outer surface and an aperture defined by an inner lumen surface; providing an insulator, the insulator having a first surface and a second surface. At least one of the first surface and the second surface of the insulator includes a brazing region disposed thereon. The braze material is applied to the brazing region and the insulator is positioned within or around the metallic ferrule such that the positioned insulator brazing region and the metallic ferrule outer surface or inner lumen surface defines a braze gap. The braze gap has a width ranging between 10 ?m to 50 ?m. The feedthrough assembly is then heated at a temperature conducive to melt the braze material in the braze gap thereby forming a hermetic seal between the ferrule and said insulator.

Abstract: In general, the disclosure is directed toward transmitting radiant energy across a boundary of a medical device via an optical feedthrough. A system for transmitting radiant energy across a boundary of a medical device includes a first functional module of a medical device, a second functional module of the medical device, an optical feedthrough assembly coupled to the first functional module, and a radiant energy source that emits a beam through the optical feedthrough assembly to perform a manufacturing process on the first functional module and the second functional module.

Abstract: In general, the disclosure is directed toward releasing material within a medical device via an optical feedthrough. A system for releasing material with a medical device comprises a cup that holds a material, wherein the cup includes a discharge port, a seal disc that seals the material within the cup, an optical feedthrough assembly coupled to the cup, a shell that defines a chamber within a medical device, wherein the optical feedthrough assembly is coupled to the shell, and a radiant energy source that shines a beam through the optical feedthrough assembly to puncture the seal disc to allow the material to enter the chamber via the discharge port.

Abstract: A titanium silicide material based on Ti.sub.5 Si.sub.3 intermetallic compound exhibits substantially improved oxidative stability at elevated temperatures. In particular, carbon is added to a Ti.sub.5 Si.sub.3 base material in an amount (e.g. about 0.3 to about 3.6 weight % C) effective to impart substantially improved oxidative stability at elevated temperatures, such as about 1000.degree. C. Boron is added to a Ti.sub.5 Si.sub.3 base material in an amount (e.g. about 0.3 to about 3.3 weight % B) to this same end.

Abstract: A titanium silicide material based on Ti.sub.5 Si.sub.3 intermetallic compound exhibits substantially improved oxidative stability at elevated temperatures. In particular, carbon is added to a Ti.sub.5 Si.sub.3 base material in an amount (e.g. about 0.3 to about 3.6 weight % C) effective to impart substantially improved oxidative stability at elevated temperatures, such as about 1000.degree. C. Boron is added to a Ti.sub.5 Si.sub.3 base material in an amount (e.g. about 0.3 to about 3.3 weight % B) to this same end.

Abstract: A titanium silicide material based on Ti.sub.5 Si.sub.3 intermetallic compound exhibits substantially improved oxidative stability at elevated temperatures. In particular, carbon is added to a Ti.sub.5 Si.sub.3 base material in an amount (e.g. about 0.3 to about 3.6 weight % C) effective to impart substantially improved oxidative stability at elevated temperatures, such as about 1000.degree. C. Boron is added to a Ti.sub.5 Si.sub.3 base material in an amount (e.g. about 0.3 to about 3.3 weight % B) to this same end.