Patents by Inventor Andrew J. Yarne

Andrew J. Yarne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vapor phase bonding for RF microstrip line circuits
    Patent number: 4638938
    Abstract: An improved vapor phase soldering process and apparatus are disclosed having particular application to electronic circuitry designed for operation at frequencies higher than 1 MHz. A printed circuit board having a defined circuit pattern on both sides is clamped between two parallel clamping fixtures, one having circuit matching characteristics for the specified PC board, and the fixture further having vents allowing vapor phase gas access to the PC board and soldering process waste gasses egress from the soldering area. This process and apparatus allows shortened soldering time, and improves performance characteristics of the PC board by improving the conduction characteristics of the defined circuit pattern.
    Type: Grant
    Filed: July 3, 1986
    Date of Patent: January 27, 1987
    Assignee: Rockwell International Corporation
    Inventors: Andrew J. Yarne, Eldon F. Burr