Abstract: Embodiments are disclosed of a lighting apparatus including a fixture adapted to accommodate a camera having imaging optics that define an optical axis, wherein the fixture includes an open end through which the imaging optics can capture an image. One or more side-emitting illumination light sources are positioned adjacent to the open end, the plurality of side-emitting light sources positioned to direct light toward a plane intersected by the optical axis. Other embodiments are disclosed and claimed.

Abstract: Embodiments are disclosed of a lighting apparatus including a fixture adapted to accommodate a camera having imaging optics that define an optical axis, wherein the fixture includes an open end through which the imaging optics can capture an image. One or more side-emitting illumination light sources are positioned adjacent to the open end, the plurality of side-emitting light sources positioned to direct light toward a plane intersected by the optical axis. Other embodiments are disclosed and claimed.

Abstract: An apparatus is disclosed comprising a base capable of receiving a camera including a lens, and a projector coupled to the base and adapted to project a plurality of beams of light onto a plane positioned at a focus distance from the base, wherein the projections of the beams of light on the plane are geometric shapes, and wherein an intersection of the geometric shapes is at the center of the field of view of the lens when the lens is installed on the base. In addition, an apparatus is disclosed comprising a base capable of receiving a camera including a lens, an image processor capable of being coupled to the camera for processing an image of a target captured by the camera, and a confirmation projector coupled to the image processor, wherein the projector projects a confirmation beam onto the plane of the target when the image processor signals the confirmation projector that it has processed the image.

Abstract: The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.

Abstract: An apparatus is disclosed comprising a base capable of receiving a camera including a lens, and a projector coupled to the base and adapted to project a plurality of beams of light onto a plane positioned at a focus distance from the base, wherein the projections of the beams of light on the plane are geometric shapes, and wherein an intersection of the geometric shapes is at the center of the field of view of the lens when the lens is installed on the base. In addition, an apparatus is disclosed comprising a base capable of receiving a camera including a lens, an image processor capable of being coupled to the camera for processing an image of a target captured by the camera, and a confirmation projector coupled to the image processor, wherein the projector projects a confirmation beam onto the plane of the target when the image processor signals the confirmation projector that it has processed the image.

Abstract: The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.

Abstract: The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.

Abstract: The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.

Abstract: The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilicon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.