Abstract: Various methods and systems are provided for a cathode cup having a surface texturing to aid in adherence of emitter deposited films. In one embodiment, a method may include chemically and/or mechanically texturing a surface of a cathode cup to form a plurality of features with a higher than threshold depth of each feature, the surface of the cathode cup facing an emitter coupled to the cathode cup.

Abstract: Various methods and systems are provided for a cathode cup having a surface texturing to aid in adherence of emitter deposited films. In one embodiment, a method may include chemically and/or mechanically texturing a surface of a cathode cup to form a plurality of features with a higher than threshold depth of each feature, the surface of the cathode cup facing an emitter coupled to the cathode cup.

Abstract: Liquid metal bearing assemblies and methods for operation of said assemblies are provided. One example liquid metal bearing assembly includes a liquid metal interface positioned between a stationary component and a rotational component. The rotational component includes a liquid metal reservoir configured to contain a liquid metal and positioned radially inward from the liquid metal interface, a liquid metal passage extending between the liquid metal reservoir and the liquid metal interface, and an anti-wetting surface in the liquid metal passage.