Abstract: Embodiments of the present disclosure include stacked interposers, electronic circuits using stacked interposers, and techniques for manufacturing stacked interposers. In some embodiments, one or more interposers of the stacked interposers comprise capacitors. The capacitors may be coupled to power terminals of an integrated circuit. In some embodiments, stacked interposers comprise electrical connections in a metallization layer of a silicon integrated circuit. Electrical connections of different interposers may be coupled together using vias. In other embodiments, interposers are coupled together using solder bumps.

Abstract: An improved system or and method of connecting a hardware modeling element to the pin electronics circuitry of a hardware modeling system, with the improved system having circuitry and structures that will allow it to be connected to a hardware modeling system that is powered, circuitry to indicate to the pin electronics circuitry that the improved system is connected to it, circuitry to identify the hardware modeling element supported by the improved system to the hardware modeling system, circuitry to indicate to the hardware modeling system when the hardware modeling element is initialized so evaluation of it by the hardware modeling system can commence, circuitry to generate selectable supply voltages for the powering the hardware modeling element, and a hardware modeling element connector that will allow the connection of a family of hardware modeling elements to the same connector without the need to change the connector.