Abstract: A thermal transfer component, a thermal transfer apparatus and a method for cooling a heat generating component located upon a substrate each include a thermally conductive frame having an aperture formed completely through the thermally conductive frame within which aperture is located a thermally conductive plug. The thermally conductive plug aligns with and contacts the heat generating component when the thermally conductive frame and the substrate are mutually aligned and assembled. A spring may further compress the thermally conductive plug against the heat generating component when the thermally conductive frame and the substrate are mutually aligned and assembled. The thermally conductive plug comprises an isotropic thermal transfer material and the thermally conductive frame comprises an anisotropic thermal conductive material to provide for enhanced thermal transfer from the heat generating component to a chassis.

Abstract: A circuit board frame and a circuit board assembly that includes the circuit board frame includes a first region designed for receiving a circuit board, and a second region contiguous with the first region and including a heat sink. The circuit board frame and circuit board assembly are designed and fabricated so that the first region is located inside a circuit board chassis and the heat sink is located outside the circuit board chassis when the circuit board frame or the circuit board assembly is assembled into the circuit board chassis by insertion into at least one slot within a sidewall of the circuit board chassis. The at least one slot within the sidewall of the circuit board chassis may have straight sidewalls, or alternatively tapered sidewalls that may ease insertion and assembly of the circuit board frame or circuit board assembly into the circuit board chassis.

Abstract: A thermal transfer component, a thermal transfer apparatus and a method for cooling a heat generating component located upon a substrate each include a thermally conductive frame having an aperture formed completely through the thermally conductive frame within which aperture is located a thermally conductive plug. The thermally conductive plug aligns with and contacts the heat generating component when the thermally conductive frame and the substrate are mutually aligned and assembled. A spring may further compress the thermally conductive plug against the heat generating component when the thermally conductive frame and the substrate are mutually aligned and assembled. The thermally conductive plug comprises an isotropic thermal transfer material and the thermally conductive frame comprises an anisotropic thermal conductive material to provide for enhanced thermal transfer from the heat generating component to a chassis.