Abstract: A tray composite comprises a polymeric based liner including an exterior surface layer, an interior surface layer, and a formed base removably affixed to the interior surface layer of the polymeric based liner. A formed base is removably affixed to the interior surface layer of the polymeric based liner. The polymeric based liner and the formed base are manually separable after they have been removably affixed together by a first portion of the interior surface layer remaining affixed to the formed base and a second portion of the interior surface layer separating from the first portion of the interior surface layer.

Abstract: A heat dissipating device. The heat dissipating device includes a receiving area open on at least one side, and a mosaic segment, arranged in the receiving area, which includes a thermally conductive and elastic compensation element and a thermally conductive low-adherent contact region. The thermally conductive and elastic compensation element rests against the inner surface of the base of the receiving area. The thermally conductive low-adherent contact region at least partly protrudes out of the receiving area at the open face of the receiving area lying opposite the base. The outer surface of the base of the receiving area forms a rigid first contact surface for a heat source or a heat sink, and the thermally conductive low-adherent contact region of the at least one mosaic segment forms a flexible second contact surface for the heat sink or the source.

Abstract: An organic light-emitting device (OLED) display is provided. The OLED display includes a thin-film transistor (TFT) substrate having a plurality of TFTs and a plurality of data lines that control the plurality of TFTs. The OLED display also includes a conductive shielding layer disposed over the TFT substrate and an OLED layer disposed over the conductive shielding layer. The OLED layer includes a plurality of OLEDs that are driven by the plurality of TFTs. The OLED layer also includes a touch panel layer disposed over the OLED layer. The conductive shielding layer is configured to reduce noise coupling between the TFT substrate and the touch panel layer.

Abstract: Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a surface of a base, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is connected to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the piezoelectric plate and a perimeter of the base.

Abstract: A process for fabricating a transversely-excited film bulk acoustic resonator (XBAR) and that XBAR are described. A sacrificial pillar is formed on a surface of a piezoelectric wafer and a highly conforming dielectric layer is deposited on the piezoelectric wafer to bury the sacrificial pillar. The highly conforming dielectric layer is polished to form a planar surface and to leave a thickness of the highly conforming dielectric that covers the sacrificial pillar. The planar surface of the highly conforming dielectric layer is bonded to a surface of a substrate wafer. A conductor pattern is formed on a front surface of the piezoelectric plate and holes are formed through the piezoelectric wafer to the sacrificial pillar. The sacrificial pillar is removed using an etchant introduced through the holes in the piezoelectric wafer to form a cavity under a diaphragm of the piezoelectric wafer spanning the cavity.

Abstract: A process for fabricating a transversely-excited film bulk acoustic resonator (XBAR) having a metal cavity, and the fabricated XBAR include forming a conductor pattern including interleaved interdigital transducer (IDT) fingers on a piezoelectric wafer. Thein forming a metal layer on a substrate, the metal layer having a cavity. Then, bonding the piezoelectric plate to the metal layer using a metal-to-metal bond such that the IDT fingers are disposed over the cavity. Then, thinning the piezoelectric wafer to form a piezoelectric plate having a portion of the piezoelectric plate forming a diaphragm that spans the cavity.

Abstract: A top-emitting pixel device is disclosed. The pixel device may include a reflective bottom electrode disposed over a substrate, a first charge transport layer disposed over the reflective bottom electrode, an emissive layer disposed over the first charge transport layer, and a second charge transport layer disposed over the emissive layer. Further, the pixel device may include a patterned transparent polymer electrode disposed over the second charge transport layer and extending laterally to cover an emissive area of the top-emitting pixel device, and a patterned auxiliary electrode disposed at least partially over the patterned transparent polymer electrode outside of the emissive area of the top-emitting pixel device to make direct electrical contact with the patterned transparent polymer electrode.

Abstract: Acoustic resonator devices and methods are disclosed. An acoustic resonator device includes a substrate having a front surface and an intervening oxide layer on the front surface and having a cavity. A thickness of the intervening oxide layer defines a depth of the cavity, and the substrate has vertical etch-stop material for etching the intervening oxide layer. Lateral fences formed in the intervening oxide layer define a perimeter of the cavity. The lateral fences has a lateral etch-stop material for etching the intervening oxide layer. A single-crystal piezoelectric plate has a back surface attached to the front surface of the intervening oxide layer except for a portion of the piezoelectric plate forming a diaphragm that spans the cavity. An interdigital transducer is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm.

Abstract: A flexible touch panel apparatus includes a series of first electrodes extending along a first direction, at least one second electrode extending along a second direction and defining a bending axis of the flexible touch panel. An elastomeric layer is located between the series of first electrodes at least second electrode. A series of third electrodes are extending along the second direction parallel to the bending axis, and an insulator layer is located between at least one second electrode and the series of third electrodes. At least one second electrode is capacitively coupled to at least one of the series of first electrodes for bend sensing in the flexible touch panel along the bending axis, and the third electrodes are capacitively coupled to the first electrodes for touch sensing on the flexible touch panel.

Abstract: Filter devices are disclosed. A filter device includes a piezoelectric plate comprising a supported portion, a first diaphragm, and a second diaphragm. The supported portion is attached to a substrate and the first and second diaphragms spans respective cavities in the substrate. A first interdigital transducer (IDT) has interleaved fingers on the first diaphragm. A second interdigital transducer (IDT) has interleaved fingers on the second diaphragm. A first dielectric layer is between the interleaved fingers of the first IDT, and a second dielectric layer is between the interleaved fingers of the second IDT. A thickness of the first dielectric layer is greater than a thickness of the second dielectric layer. The piezoelectric plate and the first and second IDTs are configured such that radio frequency signals applied to first and second IDTs excite primary shear acoustic modes in the respective diaphragms.

Abstract: An acoustic resonator device is formed using sacrificial polysilicon pillar by forming a polysilicon pillar on a substrate and depositing a dielectric layer to bury the polysilicon pillar and planarizing the surface of the dielectric layer. A piezoelectric plate is bonded to the planarized surface of the dielectric layer and thinned to a target piezoelectric membrane thickness. At least one conductor pattern is formed on the thinned piezoelectric plate and the polysilicon pillar is then removed using an etchant introduced through holes in the piezoelectric plate to form an air cavity where the pillar was removed.

Abstract: An acoustic resonator device is formed that reduces a thermal coefficient of expansion mismatch between a piezoelectric plate and a silicon substrate by bonding the front surface of the silicon substrate having a filled and planarized sacrificial tub to a piezoelectric substrate and thinning the silicon substrate by removing material from a back surface. That back surface is then bonded to a handle wafer having a thermal coefficient of expansion (TCE) closer to a TCE of the piezoelectric substrate than a TCE of the silicon substrate and thinning the piezoelectric substrate to a target piezoelectric membrane thickness to form a piezoelectric plate. A conductor pattern is formed on the thinned piezoelectric plate and the sacrificial tub is removed to form a cavity and release a membrane of the piezoelectric plate using an etchant introduced through holes in the piezoelectric plate.

Abstract: Acoustic resonators, filters, and methods. A filter includes a piezoelectric plate supported by a substrate; and three or more diaphragms of the piezoelectric plate spanning a respective cavity in the substrate. A conductor pattern on the plate has interdigital transducers (IDTs) of three or more acoustic resonators. Each IDT has two sets of interleaved fingers extending from two busbars respectively. Overlapping portions of the fingers define an aperture of each acoustic resonator. Sometimes, each of the resonators has two dielectric strips that overlap the IDT fingers in first and second margins of the aperture and that extend into first and second gaps between the first and second margins and the busbars. Other times, the first and second dielectric strips are on the front surface of the plate, have a first portion under the IDT fingers and have a second portion extending into a gap between the margins and the busbars.

Abstract: An acoustic resonator device is formed that reduces a thermal coefficient of expansion mismatch between a piezoelectric plate and a silicon substrate by bonding the front surface of the silicon substrate having a filled and planarized sacrificial tub to a piezoelectric substrate and thinning the silicon substrate by removing material from a back surface. That back surface is then bonded to a handle wafer having a thermal coefficient of expansion (TCE) closer to a TCE of the piezoelectric substrate than a TCE of the silicon substrate and thinning the piezoelectric substrate to a target piezoelectric membrane thickness to form a piezoelectric plate. A conductor pattern is formed on the thinned piezoelectric plate and the sacrificial tub is removed to form a cavity and release a membrane of the piezoelectric plate using an etchant introduced through holes in the piezoelectric plate.

Abstract: Acoustic resonators, filters, and methods. An acoustic resonator includes a substrate, a piezoelectric plate, and a diaphragm including a portion of the piezoelectric plate spanning a cavity in a substrate. An interdigital transducer (IDT) on a front surface of the piezoelectric plate includes first and second sets of interleaved interdigital transducer (IDT) fingers extending from first and second busbars respectively. The interleaved IDT fingers extend onto the diaphragm. Overlapping portions of the interleaved IDT fingers define an aperture of the acoustic resonator. First and second dielectric strips are on the front surface of the piezoelectric plate. Each dielectric strip has a first portion under the IDT fingers in a respective margin of the aperture and a second portion extending into a gap between the respective margin and the respective busbar.

Abstract: Acoustic resonators, filters, and methods. An acoustic resonator includes a substrate, a piezoelectric plate, and a diaphragm including a portion of the piezoelectric plate spanning a cavity in a substrate. An interdigital transducer (IDT) on a front surface of the piezoelectric plate includes first and second sets of interleaved interdigital transducer (IDT) fingers extending from first and second busbars respectively. The interleaved IDT fingers extend onto the diaphragm. Overlapping portions of the interleaved IDT fingers define an aperture of the acoustic resonator. First and second dielectric strips are on the front surface of the piezoelectric plate. Each dielectric strip has a first portion under the IDT fingers in a respective margin of the aperture and a second portion extending into a gap between the respective margin and the respective busbar.

Abstract: An organic light-emitting device (OLED) display is provided. The OLED display includes a thin-film transistor (TFT) substrate having a plurality of TFTs and a plurality of data lines that control the plurality of TFTs. The OLED display also includes a conductive shielding layer disposed over the TFT substrate and an OLED layer disposed over the conductive shielding layer. The OLED layer includes a plurality of OLEDs that are driven by the plurality of TFTs. The OLED layer also includes a touch panel layer disposed over the OLED layer. The conductive shielding layer is configured to reduce noise coupling between the TFT substrate and the touch panel layer.

Abstract: An acoustic resonator device is formed using a wafer-to-wafer bonding process by etching recesses into a first surface of a piezoelectric substrate, a depth of the recesses greater than a target piezoelectric membrane thickness; then wafer-to-wafer bonding the first surface of the piezoelectric substrate to a handle wafer using a releasable bonding method. The piezoelectric substrate is then thinned to the target piezoelectric membrane thickness to form a piezoelectric plate and at least one conductor pattern is formed on the thinned piezoelectric plate. The side of the thinned piezoelectric plate having the conductor pattern is bonded to a carrier wafer using a metal-to-metal wafer bonding process and the handle wafer is removed.

Abstract: An acoustic resonator device is formed using a wafer-to-wafer bonding process by etching recesses into a first surface of a piezoelectric substrate, a depth of the recesses greater than a target piezoelectric membrane thickness; then wafer-to-wafer bonding the first surface of the piezoelectric substrate to a handle wafer using a releasable bonding method. The piezoelectric substrate is then thinned to the target piezoelectric membrane thickness to form a piezoelectric plate and at least one conductor pattern is formed on the thinned piezoelectric plate. The side of the thinned piezoelectric plate having the conductor pattern is bonded to a carrier wafer using a metal-to-metal wafer bonding process and the handle wafer is removed.

Abstract: An acoustic resonator has a piezoelectric plate attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) formed on the plate has interleaved fingers on the diaphragm with first parallel fingers extending from a first busbar and second parallel fingers extending from a second busbar of the IDT. The first and second busbars of the IDT terminate in beveled corners that extend off of the diaphragm as side edges of the busbars that form angles with a perimeter of the cavity.