Abstract: The present invention provides, among other things, methods of treatment of Metachromatic Leukodystrophy Disease (MLD) and compositions comprising recombinant arylsulfatase A (ASA) protein using enzyme replacement therapy.

Abstract: The present invention provides, among other things, methods of treatment of Metachromatic Leukodystrophy Disease (MLD) and compositions comprising recombinant arylsulfatase A (ASA) protein using enzyme replacement therapy.

Abstract: Techniques for fabricating a semiconductor chip having a curved surface include placing a substantially flat photonic sensor chip on a recessed surface of a mold such that an active region of the photonic sensor chip at least partially covers a concave central region of the mold and an inactive region of the photonic sensor chip at least partially covers a convex peripheral region of the mold. The mold has a radially varying curvature and the recessed surface includes the concave central region and the convex peripheral region concentrically surrounding the concave central region. Pressure may be applied on the photonic sensor chip to press and bend the photonic sensor chip into the mold.

Abstract: Zwitterionic polymer and mixed charge copolymer bioconjugates, methods for making and using the bioconjugates.

Abstract: Zwitterionic polymer and mixed charge copolymer bioconjugates, methods for making and using the bioconjugates.

Abstract: Techniques for fabricating a semiconductor chip having a curved surface include placing a substantially flat photonic sensor chip on a recessed surface of a mold such that an active region of the photonic sensor chip at least partially covers a concave central region of the mold and an inactive region of the photonic sensor chip at least partially covers a convex peripheral region of the mold. The mold has a radially varying curvature and the recessed surface includes the concave central region and the convex peripheral region concentrically surrounding the concave central region. Pressure may be applied on the photonic sensor chip to press and bend the photonic sensor chip into the mold.

Abstract: Techniques for fabricating a semiconductor die having a curved surface can include placing a substantially flat semiconductor die in a recess surface of a concave mold such that corners or edges of the semiconductor die are unconstrained or are the only portions of the semiconductor die in physical contact with the concave mold. The semiconductor die can include through-die cut lines that can lead to substantially less tension in the semiconductor die as compared to the case where the semiconductor die does not include through-die cut lines. Accordingly, such through-die cut lines can allow for achieving relatively large curvatures.

Abstract: Techniques for fabricating a semiconductor die having a curved surface can include placing a substantially flat semiconductor die in a recess surface of a concave mold such that corners or edges of the semiconductor die are unconstrained or are the only portions of the semiconductor die in physical contact with the concave mold. The semiconductor die can include through-die cut lines that can lead to substantially less tension in the semiconductor die as compared to the case where the semiconductor die does not include through-die cut lines. Accordingly, such through-die cut lines can allow for achieving relatively large curvatures.

Abstract: Techniques for fabricating a semiconductor chip having a curved surface may include placing a substantially flat semiconductor chip in a recess surface of a concave mold such that corners or edges of the semiconductor chip are unconstrained or are the only portions of the semiconductor chip in physical contact with the concave mold; and bending the substantially flat semiconductor chip to form a concave shaped semiconductor chip by applying a force on the semiconductor chip toward the bottom of the recessed surface. The corners or edges of the semiconductor chip move or slide relative to the recess surface during the bending.

Abstract: Marine coatings including cationic polymers hydrolyzable to nonfouling zwitterionic polymers, coated marine surfaces, and methods for making and using the marine coatings.

Abstract: Techniques for fabricating a semiconductor chip having a curved surface may include placing a substantially flat semiconductor chip in a recess surface of a concave mold such that corners or edges of the semiconductor chip are unconstrained or are the only portions of the semiconductor chip in physical contact with the concave mold; and bending the substantially flat semiconductor chip to form a concave shaped semiconductor chip by applying a force on the semiconductor chip toward the bottom of the recessed surface. The corners or edges of the semiconductor chip move or slide relative to the recess surface during the bending.

Abstract: Techniques for fabricating a semiconductor chip having a curved surface include placing a substantially flat photonic sensor chip on a recessed surface of a mold such that an active region of the photonic sensor chip at least partially covers a concave central region of the mold and an inactive region of the photonic sensor chip at least partially covers a convex peripheral region of the mold. The mold has a radially varying curvature and the recessed surface includes the concave central region and the convex peripheral region concentrically surrounding the concave central region. Pressure may be applied on the photonic sensor chip to press and bend the photonic sensor chip into the mold.

Abstract: Zwitterionic polymer and mixed charge copolymer bioconjugates, methods for making and using the bioconjugates.

Abstract: Zwitterionic polymer and mixed charge copolymer bioconjugates, methods for making and using the bioconjugates.

Abstract: Zwitterionic polymer and mixed charge copolymer bioconjugates, methods for making and using the bioconjugates.

Abstract: Apparatus and associated methods for actuating variable stiffness material (VSM) structures and achieving deformation of the structures. The apparatus and the associated methods use internal embedded actuation elements and/or externally attached elements to the VSM structures to achieve the desired deformation. In particular, the actuation can be changed due to the variable stiffness nature of the materials. That is, the invention provides the ability to control the deformation of structures using local stiffness control over subregions of the component in addition to or in substitution for actuation. Furthermore, the invention exploits the variable stiffness properties of the VSM structures to enable new functionalities impossible to realize with conventional constant stiffness materials.

Abstract: Active seal assemblies employing active materials that can be controlled and remotely changed to alter the seal effectiveness, wherein the active seal assemblies actively change modulus properties such as stiffness, shape orientation, and the like. In this manner, in seal applications such as a vehicle door application, door opening and closing efforts can be minimized yet seal effectiveness can be maximized.

Abstract: A panel having active material based segments, wherein the segments define a hinge location that can be selectively stiffened or folded on demand. The active material based segments include an active material such that activation of the active material by an activation device can allow folding of the panel, can effect self-folding of the panel, or can serve to lock the panel into a fixed position when not activated. In this manner, the panel that can be variously stiffened or folded on demand. Other embodiments include forming the panel of the active material such that the panel can be compacted and stowed upon activation of the active material to change the modulus properties thereof.

Abstract: Active seal assisted latching assemblies employing active materials that can be controlled and remotely changed to effect the latching. In this manner, in seal applications such as a vehicle door application, door opening and closing efforts can be minimized yet seal effectiveness can be maximized.

Abstract: Active seal assemblies employing active materials that can be controlled and remotely changed to alter the seal effectiveness, wherein the active seal assemblies actively change modulus properties such as stiffness, shape orientation, and the like. In this manner, in seal applications such as a vehicle door application, door opening and closing efforts can be minimized yet seal effectiveness can be maximized.