Patents by Inventor Andrew Kempf

Andrew Kempf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11729933
    Abstract: The disclosure provides a low-cost near-hermetic package, which may a substrate configured to support one or more internal components. The package may also include an enclosure comprising a cavity surrounding the one or more internal components and a first sidewall extending upward from the substrate. The first sidewall may be coupled to the substrate. The package may further include a first flexible circuit comprising conductive traces configured to connect to the one or more internal components. The first flexible circuit may include a first section outside the first sidewall of the enclosure, a second section inside the enclosure, and a third section between the first section and the second section joining to the enclosure and the substrate.
    Type: Grant
    Filed: February 1, 2022
    Date of Patent: August 15, 2023
    Assignee: TTM Technologies, Inc.
    Inventors: Michael Len, Nicholas S. Koop, Andrew Kempf, Matt Gortner
  • Publication number: 20220248553
    Abstract: The disclosure provides a low-cost near-hermetic package, which may a substrate configured to support one or more internal components. The package may also include an enclosure comprising a cavity surrounding the one or more internal components and a first sidewall extending upward from the substrate. The first sidewall may be coupled to the substrate. The package may further include a first flexible circuit comprising conductive traces configured to connect to the one or more internal components. The first flexible circuit may include a first section outside the first sidewall of the enclosure, a second section inside the enclosure, and a third section between the first section and the second section joining to the enclosure and the substrate.
    Type: Application
    Filed: February 1, 2022
    Publication date: August 4, 2022
    Inventors: Michael Len, Nick Koop, Andrew Kempf, Matt Gortner
  • Patent number: 4078853
    Abstract: An optical communication cable comprises one or more cores of light-transmitting optical fibers substantially decoupled mechanically from the rest of the cable structure. Surrounding each core is an inner jacket which forms a loose-fittng enveloping structure about the core. Surrounding the inner jacket or plurality of inner jackets is an outer jacket which is reinforced with primary strength members to carry expected tensile loads and to thereby relieve the fibers of the core or cores as cable strength members. The core fibers are also buckled into a slackened state under no-load conditions to allow for stress-free elongation of the core fibers during tensile pulling of the cable. In one embodiment, each core comprises linear arrays of optical fibers packaged in a plurality of ribbon structures which are stacked and helically stranded for further strain-relief. The arrays are specifically configured to permit mass cable splicing.
    Type: Grant
    Filed: February 25, 1976
    Date of Patent: March 14, 1978
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: Raymond Andrew Kempf, Manuel Roberto Santana, Morton I. Schwartz
  • Patent number: D383380
    Type: Grant
    Filed: February 5, 1996
    Date of Patent: September 9, 1997
    Assignee: Augat Inc.
    Inventors: Andrew Kempf, Thomas E. Simmons, Jr.