Patents by Inventor Andrew Kenichi Duvall

Andrew Kenichi Duvall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for vapor delivery in a substrate processing system
    Patent number: 9970108
    Abstract: A vapor delivery system includes an ampoule to store liquid precursor and a heater to partially vaporize the liquid precursor. A first valve communicates with a push gas source and the ampoule. A second valve supplies vaporized precursor to a heated injection manifold. A valve manifold includes a first node in fluid communication with an outlet of the heated injection manifold, a third valve having an inlet in fluid communication with the first node and an outlet in fluid communication with vacuum, a fourth valve having an inlet in fluid communication with the first node and an outlet in fluid communication with a second node, a fifth valve having an outlet in fluid communication with the second node, and a sixth valve having an outlet in fluid communication with the second node. A gas distribution device is in fluid communication with the second node.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: May 15, 2018
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Jun Qian, Hu Kang, Purushottam Kumar, Chloe Baldasseroni, Heather Landis, Andrew Kenichi Duvall, Mohamed Sabri, Ramesh Chandrasekharan, Karl Leeser, Shankar Swaminathan, David Smith, Jeremiah Baldwin, Eashwar Ranganathan, Adrien LaVoie, Frank Pasquale, Jeongseok Ha, Ingi Bae
  • SYSTEMS AND METHODS FOR VAPOR DELIVERY
    Publication number: 20160032453
    Abstract: A vapor delivery system includes an ampoule to store liquid precursor and a heater to partially vaporize the liquid precursor. A first valve communicates with a push gas source and the ampoule. A second valve supplies vaporized precursor to a heated injection manifold. A valve manifold includes a first node in fluid communication with an outlet of the heated injection manifold, a third valve having an inlet in fluid communication with the first node and an outlet in fluid communication with vacuum, a fourth valve having an inlet in fluid communication with the first node and an outlet in fluid communication with a second node, a fifth valve having an outlet in fluid communication with the second node, and a sixth valve having an outlet in fluid communication with the second node. A gas distribution device is in fluid communication with the second node.
    Type: Application
    Filed: July 14, 2015
    Publication date: February 4, 2016
    Inventors: Jun Qian, Hu Kang, Purushottam Kumar, Chloe Baldasseroni, Heather Landis, Andrew Kenichi Duvall, Mohamed Sabri, Ramesh Chandrasekharan, Karl Leeser, Shankar Swaminathan, David Smith, Jeremiah Baldwin, Eashwar Ranganathan, Adrien LaVoie, Frank Pasquale, Jeongseok Ha, lngi Bae