Patents by Inventor Andrew Killorin

Andrew Killorin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Customized heat dissipation from different types of integrated circuit dies packaged on a common substrate
    Publication number: 20250029888
    Abstract: An electronic device includes: (i) first and second integrated circuit (IC) dies co-located on a surface of a substrate in proximity to each other, (ii) a heat sink disposed on the first and second IC dies, and (iii) a lid, which is disposed between the first IC die and the heat sink, and the lid is not disposed between the second IC die and the heat sink.
    Type: Application
    Filed: July 17, 2024
    Publication date: January 23, 2025
    Inventors: Carl E. Benes, Meenakshi Upadhyaya, Joshua F. Dillon, Andrew Killorin, Eric William Tremble, Wolfgang Sauter