Patents by Inventor Andrew Kwan Wai Leung

Andrew Kwan Wai Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CARRIER BOAT FOR DIE PACKAGE FLUX CLEANING
    Publication number: 20230101770
    Abstract: A carrier boat for die package flux cleaning, including: a body having at least one pair of substantially parallel sides, the body comprising one or more die package receptacles each oriented at a non-parallel angle relative to the substantially parallel sides of the body such that, when a die package is seated in a die package receptacle of the one or more die package receptacles, a first pair of opposing sides of a die of the die package are substantially perpendicular to the substantially parallel sides,
    Type: Application
    Filed: September 29, 2021
    Publication date: March 30, 2023
    Inventors: SUMING HU, FARSHAD GHAHGHAHI, ANDREW KWAN WAI LEUNG
  • Integrated circuit product customizations for identification code visibility
    Patent number: 11315883
    Abstract: An apparatus includes a substrate including an identification code on a first side of the substrate and near a perimeter of the substrate. The apparatus includes a stiffener structure attached to the first side of the substrate. The stiffener structure has a cutout in an outer perimeter of the stiffener structure. The stiffener structure is oriented with respect to the substrate to cause the cutout to expose the identification code. The cutout may have a first dimension and a second dimension orthogonal to the first dimension. The first dimension may exceed a corresponding first dimension of the identification code and the second dimension may exceed a corresponding second dimension of the identification code, thereby forming a void region between the identification code and edges of the stiffener structure.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: April 26, 2022
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Suming Hu, Roden Topacio, Farshad Ghahghahi, Jianguo Li, Andrew Kwan Wai Leung
  • INTEGRATED CIRCUIT PRODUCT CUSTOMIZATIONS FOR IDENTIFICATION CODE VISIBILITY
    Publication number: 20210143104
    Abstract: An apparatus includes a substrate including an identification code on a first side of the substrate and near a perimeter of the substrate. The apparatus includes a stiffener structure attached to the first side of the substrate. The stiffener structure has a cutout in an outer perimeter of the stiffener structure. The stiffener structure is oriented with respect to the substrate to cause the cutout to expose the identification code. The cutout may have a first dimension and a second dimension orthogonal to the first dimension. The first dimension may exceed a corresponding first dimension of the identification code and the second dimension may exceed a corresponding second dimension of the identification code, thereby forming a void region between the identification code and edges of the stiffener structure.
    Type: Application
    Filed: November 12, 2019
    Publication date: May 13, 2021
    Inventors: Suming Hu, Roden Topacio, Farshad Ghahghahi, Jianguo Li, Andrew Kwan Wai Leung