Abstract: A microbeamformer integrated circuit has sixty-lour microbeaauCormer channels which may be utilized with a 64-element or 128-element array transducer. Each microbeamformer channel includes a transmitter, a plurality of connection points for selectively coupling the transmitter to one or more transducer elements, a transmit/receive switch coupled to an output of the transmitter, and a receive channel including a variable delay. The connection points may be configured with only one connection point coupled to a transducer element, two connection points coupled to the same transducer element, or multiple connection points coupled to multiple transducer elements. The transmitter may also comprise a separate pulser coupled to each connection point. The receive channels are grouped in groups of sixteen which may be selectively coupled to one of two channel drivers to provide partially beamformed signals to the channels of a system beamformer.

Abstract: An acoustic assembly that includes an integrated circuit package having an electrically conductive via configured to pass from an active portion of the integrated circuit package through a bottom portion of the integrated circuit package. The bottom portion is a bottom side of a substrate of the integrated circuit package. An acoustic element is positioned on the bottom side of the substrate and the via is arranged to electrically couple the active portion of the integrated circuit package to the acoustic element. In one embodiment, the acoustic element is an acoustic stack and the integrated circuit package is an ASIC. The assembly microbeamformed transducer.

Abstract: An ultrasound transducer matrix array for an ultrasound probe having a large field of view both in azimuth and elevation direction is proposed. The ultrasound transducer matrix array (1?) comprises a center region (11?) and at least three branch regions (13) each comprising a 2-dimensional matrix array (5) of ultrasound transducer elements (3). The center region comprises at least three edges (15) from which the respective branch regions extend. Each branch region (13) is curved around an axis parallel to the edge (15) of the center region (11) from which the respective branch region (13) extends. With an ultrasound probe comprising such ultrasound transducer area with branch regions interconnected by a common, preferably flat center region, an ideal matrix array having a field of view with a spheroidal shape may be approximated.

Abstract: A microbeamformer integrated circuit has sixty-lour microbeaauCormer channels which may be utilized with a 64-element or 128-element array transducer. Each microbeamformer channel includes a transmitter, a plurality of connection points for selectively coupling the transmitter to one or more transducer elements, a transmit/receive switch coupled to an output of the transmitter, and a receive channel including a variable delay. The connection points may be configured with only one connection point coupled to a transducer element, two connection points coupled to the same transducer element, or multiple connection points coupled to multiple transducer elements. The transmitter may also comprise a separate pulser coupled to each connection point. The receive channels are grouped in groups of sixteen which may be selectively coupled to one of two channel drivers to provide partially beamformed signals to the channels of a system beamformer.

Abstract: An ultrasound transducer includes one or more microbeamformer integrated circuit chips, an array of acoustic elements, and a redistribution interconnect coupled via conductive elements between the one or more integrated circuit chips and the array of acoustic elements. The one or more microbeamformer integrated circuit chips each include a plurality of bond pads separated from adjacent ones thereof by a first pitch set. The acoustic elements of the array are separated from adjacent ones thereof by a second pitch set, the second pitch set being different from the first pitch set. In addition, the redistribution interconnect couples on a first side of the redistribution interconnect to the one or more microbeamformer integrated circuit chips via conductive elements. The redistribution interconnect couples on a second side to the array of transducer elements via conductive elements.

Abstract: An acoustic assembly that includes an integrated circuit package having an electrically conductive via configured to pass from an active portion of the integrated circuit package through a bottom portion of the integrated circuit package. The bottom portion is a bottom side of a substrate of the integrated circuit package. An acoustic element is positioned on the bottom side of the substrate and the via is arranged to electrically couple the active portion of the integrated circuit package to the acoustic element. In one embodiment, the acoustic element is an acoustic stack and the integrated circuit package is an ASIC. The assembly microbeamformed transducer.

Abstract: An ultrasound transducer includes one or more microbeam-former integrated circuit chips, an array of acoustic elements, and a redistribution interconnect coupled via conductive elements between the one or more integrated circuit chips and the array of acoustic elements. The one or more microbeamformer integrated circuit chips each include a plurality of bond pads separated from adjacent ones thereof by a first pitch set. The acoustic elements of the array are separated from adjacent ones thereof by a second pitch set, the second pitch set being different from the first pitch set. In addition, the redistribution interconnect couples on a first side of the redistribution interconnect to the one or more microbeamformer integrated circuit chips via conductive elements. The redistribution interconnect couples on a second side to the array of transducer elements via conductive elements.

Abstract: The invention is directed towards improved structures for use with micro-machined ultrasonic transducers (MUTs), and methods for fabricating the improved structures. In one embodiment, a MUT on a substrate includes an acoustic cavity formed within the substrate at a location below the MUT. The cavity is filled with an acoustic attenuation material to absorb acoustic waves in the substrate, and to reduce parasitic capacitance. In another embodiment, the cavity is formed below a plurality of MUTs, and filled with an attenuation material. In still another embodiment, an attenuation material substantially encapsulates a plurality of MUTs on a dielectric layer. In yet other embodiments, at least one monolithic semiconductor circuit is formed in the substrate that may be operatively coupled to the MUTs to perform signal processing and/or control operations.

Abstract: An ultrasonic 2D array has elements extending in two dimensions which can be individually controlled and operated to form a 2D array for scanning a volumetric region in three dimensions. Individual ones of the elements can also be selected and operated together to form a 1D array for scanning a planar region in two dimensions. The array transmits scanlines to scan the volumetric region and the planar region in a time interleaved manner with the frame rate of the planar region be higher than that of the volumetric region. A spectral display may also be produced of a sample volume located in the planar region.

Abstract: The invention is directed towards improved structures for use with micro-machined ultrasonic transducers (MUTs), and methods for fabricating the improved structures. In one embodiment, a MUT on a substrate includes an acoustic cavity formed within the substrate at a location below the MUT. The cavity is filled with an acoustic attenuation material to absorb acoustic waves in the substrate, and to reduce parasitic capacitance. In another embodiment, the cavity is formed below a plurality of MUTs, and filled with an attenuation material. In still another embodiment, an attenuation material substantially encapsulates a plurality of MUTs on a dielectric layer. In yet other embodiments, at least one monolithic semiconductor circuit is formed in the substrate that may be operatively coupled to the MUTs to perform signal processing and/or control operations.

Abstract: An ultrasonic diagnostic imaging system and method uses harmonic imaging to acquire a plurality of images at a variety of look angles. The number of acquired ultrasonic images that are compounded to form a spatially compounded image is varied in response to changes in system operating parameters initiated directly or indirectly by the system user.

Abstract: An ultrasound system is described which can be turned off quickly by an operator command or in response to an interruption of a.c. power to the system. When a.c. power is cut off, the system switches to battery backup while a processor executes an orderly shutdown sequence. The system can completely shut down, or the state of the system can be minimally preserved by battery backup in either volatile or nonvolatile memory so that the system can restart without having to sequence through an entire bootup procedure. This enables the system to remain active even when the ultrasound system is unplugged and being moved.

Abstract: An ultrasound system is described which exhibits reduced power consumption and improved reliability. When the ultrasound system is idle for a period of time it automatically invokes a sequence of energy-saving procedures, including readying the system for use at a predetermined time. The use of periodically invoked low power states, even if only for seconds at a time, will over the long term save energy including the cost of air conditioning the site of the ultrasound system. Such low power states also reduce the heat dissipation and exposure of components to heat, one of the major causes of component failure. Thus an embodiment of the present invention can improve ultrasound system reliability and long term effectiveness and cost.

Abstract: An ultrasound system is described which can be turned off quickly and restarted to be ready for scanning in a matter of seconds. This is accomplished by allowing a processor and/or memory within the system to remain active even when the system is “turned off.” When the system is turned off the state of the system is minimally preserved in either volatile or nonvolatile memory so that the system can quickly restart without having to sequence through an entire bootup procedure.

Abstract: An ultrasound system is described which will automatically turn on at predetermined times and condition itself for a specific scanning procedure. The system can also respond to remote queries even when not in service. Such an ultrasound system can be turned off at night, respond to external queries during the night, and be ready for use at a desired time the next day, without operator intervention, thereby conserving energy while maintaining efficiency.

Abstract: An ultrasonic 2D array has elements extending in two dimensions which can be individually controlled and operated to form a 2D array for scanning a volumetric region in three dimensions. Individual ones of the elements can also be selected and operated together to form a 1D array for scanning a planar region in two dimensions. An ultrasonic probe containing the inventive array can be quickly switched between two and three dimensional imaging modes to produce both a three dimensional image and a two dimensional image in real time.

Abstract: An ultrasonic diagnostic imaging system and method are described in which the number of acquired ultrasonic images which are compounded to form a spatially compounded image is variable. The number of acquired images which is compounded is varied in response to changes in system operating parameters initiated directly or indirectly by the system user.

Abstract: An ultrasonic sensing array having ultrasonic transducer elements formed on a micromachined single-crystal semiconductor wafer provided with a deep recess under each transducer. Etch-altering dopants are diffused into the wafer to form rimmed support structures for dielectric stress-balanced elements. Composite dielectric layers are grown on both surfaces of the wafer. One composite layer serves as a diaphragm underlying the transducer elements. The other composite layer serves as a mask for etching away the substrate under each transducer element to form the deep recess while leaving the support structures and diaphragm layer. The resulting hollow or recess under each transducer element reduces the parasitic capacitance between the transducer and support substrate. The transducer elements are made by forming conductive bottom plates on the dielectric diaphragm layer, adding a piezoelectric polymer layer and thereafter forming the conductive top plates.

Abstract: An ultrasonic sensing array having ultrasonic transducer elements formed on a micromachined single-crystal semiconductor wafer provided with a deep recess under each transducer. Etch-altering dopants are diffused into the water to form rimmed support structures for dielectric stress-balanced elements. Composite dielectric layers are grown on both surfaces of the wafer. One composite layer serves as a diaphragm underlying the transducer elements. The other composite layer serves as a mask for etching away the substrate under each transducer element to form the deep recess while leaving the support structures and diaphragm layer. The resulting hollow or recess under each transducer element reduces the parasitic capacitance between the transducer and support substrate. The transducer elements are made by forming conductive bottom plates on the dielectric diaphragm layer, adding a piezoelectric polymer layer and thereafter forming the conductive top plates.

Abstract: An improved lateral insulated gate transistor includes a dual function anode and employs specially configured anode and cathode regions within the drift layer to promote lateral current flow. A vertical diode is disposed between a substrate cathode and anode of the device. Under forward bias conditions, the device exhibits insulated gate controlled conduction, and under reverse bias conditions, the device exhibits conduction between the substrate cathode and anode of the vertical diode.