Abstract: In example implementations, an apparatus is provided. The apparatus includes an interface, a graphics card connected to the interface, and a controller communicatively coupled to the interface. The graphics card includes an air moving device. The controller is to send a logic control to the graphics card to activate the air moving device in response to a performance parameter.

Abstract: In an example implementation according to aspects of the present disclosure, an electronic assembly comprises a chassis including a wall and a component section. The electronic assembly comprises a printed circuit board (PCB) having an inset that forms a gap between the PCB and the wall of the chassis to enable fluid to flow along the wall of the chassis from a first region of the electronic assembly located adjacent to a first side of the PCB to a second region of the electronic assembly located adjacent to a second side of the PCB. The electronic assembly also includes a fluid mover to move fluid, via the inset, from the first region of the electronic assembly to the component section located in the second region of the electronic assembly.

Abstract: A processor cooling system may include a processor, a shell having an interior thermally coupled to the processor to receive heat from the processor and a mass of solid to liquid (STL) phase change material filling the shell.

Abstract: An example heat transfer apparatus includes a first heatsink, having a first thermal resistance, to remove heat from a first component, a second heatsink, having a second thermal resistance different from the first thermal resistance, to remove heat from a second component, and a mounting structure supporting the first heatsink to couple the first heatsink to the first component. The second heatsink is supported by the first heatsink to couple the second heatsink to the second component.

Abstract: A voltage regulator assembly can include a voltage regulator to provide power to a processor. The voltage regulator can occupy a volumetric space and includes a voltage regulator component grouping within the volumetric space. The voltage regulator assembly can include a heat dissipater with a heat absorption end portion thermally coupled to the voltage regulator. The heat dissipater can be routed along the voltage regulator and into an enlarged spacing between the voltage regulator component groupings. The heat absorption end portion of the heat dissipater can be positioned within the volumetric space of the voltage regulator. The heat dissipater can include a heat rejection end portion that is routed outside of the volumetric space of the voltage regulator.

Abstract: An example of an apparatus may include an input connection to receive a pulse-width-modulated signal. The pulse-width-modulated signal may control a speed of a fan. An output connection may provide a tachometer signal to indicate the speed of the fan. A controller may provide an identification signal via the output connection. The identification signal may be provided in response to receipt of a predetermined duty cycle via the pulse-width-modulated signal. The identification signal may provide an identification corresponding to the fan.

Abstract: An example of an apparatus with an input connection to receive an input tachometer signal. The input tachometer signal may include a frequency to indicate a fan speed. A pulse width modulator may be coupled to the input connection and generate an output tachometer signal. The output tachometer signal may comprise an output frequency and a duty cycle. The output frequency may be based on the frequency of the input tachometer signal, and the duty cycle may indicate an identification corresponding to the fan.

Abstract: A method of regulating power consumption per core within a multi-core package may include estimating power draw for each core within the multi-core processing system. Estimating the power draw for each core within the multi-core processing system may include dividing a total power draw of the multi-core processing system by a number of active cores operating within the multi-core processing system multiplied by a percent utilization of the multi-core processing system. The method may include determining a thermal margin for the multi-core processing system, and instigating a lower power limit for the multi-core processing system in response to a determination that the thermal margin reduces to a predetermined level.

Abstract: In an example implementation, an expansion card assembly includes a low-profile expansion card, a card cooler attached to the card to force air over the card, and an airflow guide attachable to the card to direct forced air from the card cooler out of a full-height computer enclosure.

Abstract: A system for protecting components on a printed circuit board (PCB) includes a polycarbonate sheet. The polycarbonate sheet is formed to match a gross contour of a number of components coupled to the PCB. The system further includes a number of a fasteners to couple the polycarbonate sheet to the PCB.

Abstract: In an example implementation, an expansion card assembly includes a low-profile expansion card, a card cooler attached to the card to force air over the card, and an airflow guide attachable to the card to direct forced air from the card cooler out of a full-height computer enclosure.

Abstract: An air duct is described herein. The air duct includes a duct housing having a first end and a second end and at least one vent disposed between the first end and the second end. The air duct also includes a plurality of dividers disposed between the first end and the second end and a plurality of channels. The plurality of channels are disposed between the first end and the second end and are derived from the plurality of dividers. The plurality of channels are to cool a first component and a second component of a computing device, wherein the duct housing is to encompass the first component and the second component. The duct housing is positioned with the first component located upstream of an air flow and the second component disposed downstream of the air flow.

Abstract: A system for protecting components on a printed circuit board (PCB) includes a polycarbonate sheet. The polycarbonate sheet is formed to match a gross contour of a number of components coupled to the PCB. The system further includes a number of a fasteners to couple the polycarbonate sheet to the PCB.

Abstract: An air duct is described herein. The air duct includes a duct housing having a first end and a second end and at least one vent disposed between the first end and the second end. The air duct also includes a plurality of dividers disposed between the first end and the second end and a plurality of channels. The plurality of channels are disposed between the first end and the second end and are derived from the plurality of dividers. The plurality of channels are to cool a first component and a second component of a computing device, wherein the duct housing is to encompass the first component and the second component. The duct housing is positioned with the first component located upstream of an air flow and the second component disposed downstream of the air flow.

Abstract: A heat sink module has a leg for tool-less engagement with a mounting structure on a circuit board. Engagement of the heat sink module with the mounting structure is to cause thermal contact between the heat sink module and a heat generating device.

Abstract: Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Abstract: A heat sink module has a leg for tool-less engagement with a mounting structure on a circuit board. Engagement of the heat sink module with the mounting structure is to cause thermal contact between the heat sink module and a heat generating device.

Abstract: Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Abstract: A method and system of controlling computer system external effects. At least some of the illustrative embodiments may be a computer system comprising a processor (wherein a computer system user interacting with software executed on the processor triggers a software event), and an external effects controller coupled to the processor (wherein the external effects controller controls at least one device being a purely aesthetic device or a non-aesthetic device operated in a manner for aesthetic reasons). The computer system user selectively associates the at least one device to the software event such that, if associated, upon occurrence of the software event an operational state of the at least one device is changed by the external effects controller.

Abstract: A heat transfer system is provided. The system includes a heat sink disposed proximate a first circuit. An air mover is adapted to provide airflow, and at least a portion of the airflow can flow through the heat sink along a flow path having a path length. A first portion of the airflow flows along the entire path length through the heat sink. A remaining portion of the airflow exits the heat sink prior to flowing the entire path length.