Patents by Inventor Andrew Lee Hector

Andrew Lee Hector has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for the electrochemical deposition of a semiconductor material
    Patent number: 9322108
    Abstract: A process for the electrochemical deposition of a semiconductor material, which process comprises: (i) providing a non-aqueous solvent; (ii) providing at least one precursor salt which forms a source of the constituent elements within the semiconductor material to be deposited; and (iii) electrodepositing the semiconductor material onto an electrode substrate using the precursor salt in the non-aqueous solvent, characterized in that: (iv) the semiconductor material is a p-block or a post-transition metal semiconductor material containing at least one p-block element or post-transition metal; and (v) the non-aqueous solvent is a halocarbon non-aqueous solvent.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: April 26, 2016
    Assignee: University of Southampton
    Inventors: Gillian Reid, Philip Nigel Bartlett, Andrew Lee Hector
  • PROCESS FOR THE ELECTROCHEMICAL DEPOSITION OF A SEMICONDUCTOR MATERIAL
    Publication number: 20150329983
    Abstract: A process for the electrochemical deposition of a semiconductor material, which process comprises: (i) providing a non-aqueous solvent; (ii) providing at least one precursor salt which forms a source of the constituent elements within the semiconductor material to be deposited; and (iii) electrodepositing the semiconductor material onto an electrode substrate using the precursor salt in the non-aqueous solvent, characterised in that: (iv) the semiconductor material is a p-block or a post-transition metal semiconductor material containing at least one p-block element or post-transition metal; and (v) the non-aqueous solvent is a halocarbon non-aqueous solvent.
    Type: Application
    Filed: July 24, 2013
    Publication date: November 19, 2015
    Inventors: Gillian Reid, Philip Nigel Bartlett, Andrew Lee Hector