Patents by Inventor Andrew Leonard Zee

Andrew Leonard Zee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8888524
    Abstract: Embodiments of the present invention disclose a modular power adapter assembly for a portable electronic device. According to one example embodiment, the assembly includes a power adapter housing and an extender member connected to the adapter housing at a first end region thereof. Furthermore, a plug adapter is configured to receive power and removably attach to a second end region of the extender member. A cable is attached to the adapter housing to supply power to a connected portable electronic device.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: November 18, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Randall W. Martin, Fred Charles Thomas, III, Andrew Leonard Zee, Matthew Graeme Leck, Jonathan Patrick Summers, Marcus Andrew Hoggarth, Morten Villiers Warren
  • Publication number: 20140094065
    Abstract: Embodiments of the present invention disclose a modular power adapter assembly for a portable electronic device. According to one example embodiment, the assembly includes a power adapter housing and an extender member connected to the adapter housing at a first end region thereof. Furthermore, a plug adapter is configured to receive power and removably attach to a second end region of the extender member. A cable is attached to the adapter housing to supply power to a connected portable electronic device.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 3, 2014
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Randall W. Martin, Fred Charles Thomas, III, Andrew Leonard Zee, Matthew Graeme Leck, Jonathan Patrick Summers, Marcus Andrew Hoggarth, Morten Villiers Warren
  • Patent number: 7036667
    Abstract: A container is provided for shipping and storing a pre-wetted and pre-conditioned microfluidic “sipper” chip. The container contains both dry compartments and wet compartments. A base contains a fluid-filled reservoir configured to house the capillaries. The opening of the reservoir is sealed with an O-ring. The plastic mount of the chip rests on the base in a dry compartment. The upper surface of the chip contains several wells containing fluid. A gasket is provided with plugs configured to be disposed within and seal the wells. Alternatively, the wells are first sealed with a foil film adhered to the well openings with an adhesive and a gasket is disposed between the foil and a cover, which is removably attached to the base. When the cover is closed, the gasket and O-ring seal the wet compartments to prevent leakage and to slow evaporation.
    Type: Grant
    Filed: May 4, 2004
    Date of Patent: May 2, 2006
    Assignee: Caliper Life Sciences, Inc.
    Inventors: Michael Greenstein, Colin Kennedy, Huan Phan, Stephan Bianchi, Jonathan Reed Harris, Daren Walter Hebold, Robert Andrew Howard, Andrew Leonard Zee
  • Patent number: D963872
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: September 13, 2022
    Assignee: R2 TECHNOLOGIES, INC.
    Inventors: Wolfgang Günter Zender, James Edward Hastings, Timothy Dwaine Holt, Scott Janis, Madison Nicole Berger, Andrew Leonard Zee, Lea Sandra Kobeli, Steven Mardis Bagley
  • Patent number: D987834
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: May 30, 2023
    Assignee: R2 TECHNOLOGIES, INC.
    Inventors: Scott Janis, Madison Nicole Berger, Andrew Leonard Zee, Lea Sandra Kobeli, Steven Mardis Bagley