Patents by Inventor Andrew Lim

Andrew Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250148322
    Abstract: Disclosed are techniques for generating features to train a predictive model to predict a customer lifetime value or churn rate. In one embodiment, a method is disclosed comprising receiving a record that includes a plurality of fields and selecting a value associated with a selected field in the plurality of fields. The method then queries a lookup table comprising a mapping of values to aggregated statistics using the value and receives an aggregated statistic based on the querying. Next, the method generates a feature vector by annotating the record with the aggregated statistic. The method uses this feature vector as an input to a predictive model.
    Type: Application
    Filed: January 10, 2025
    Publication date: May 8, 2025
    Inventors: Yan YAN, Aria HAGHIGHI, Nicholas RESNICK, Andrew LIM
  • Patent number: 12271431
    Abstract: Systems and methods for re-using content in a content management system. The content management system may have two or more repositories. A link document may be generated in a link repository for a source document in a source repository. The link document may be a copy of the source document, and synchronized to the source document in a number of different ways, dynamically or statically. When the source document is updated, the source repository may notify the link repository about the change, receive a pull request from the link repository for the change, and generate an updated link document. A static copy of the link document may be created to prevent further changes to the link document for business or compliance purposes.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: April 8, 2025
    Assignee: Veeva Systems Inc.
    Inventors: Leah Avalon Weitz, Stephen Paul Harper, Bailey Chen, Joshua Andrew Lim, Sindhusha Reddy Jensen, Eric Bezar, Jon Stone, Derek Allwardt, Richard Mayfield
  • Patent number: 12198072
    Abstract: Disclosed are techniques for generating features to train a predictive model to predict a customer lifetime value or churn rate. In one embodiment, a method is disclosed comprising receiving a record that includes a plurality of fields and selecting a value associated with a selected field in the plurality of fields. The method then queries a lookup table comprising a mapping of values to aggregated statistics using the value and receives an aggregated statistic based on the querying. Next, the method generates a feature vector by annotating the record with the aggregated statistic. The method uses this feature vector as an input to a predictive model.
    Type: Grant
    Filed: December 20, 2023
    Date of Patent: January 14, 2025
    Assignee: AMPERITY, INC.
    Inventors: Yan Yan, Aria Haghighi, Nicholas Resnick, Andrew Lim
  • Publication number: 20240152782
    Abstract: Disclosed are techniques for generating features to train a predictive model to predict a customer lifetime value or churn rate. In one embodiment, a method is disclosed comprising receiving a record that includes a plurality of fields and selecting a value associated with a selected field in the plurality of fields. The method then queries a lookup table comprising a mapping of values to aggregated statistics using the value and receives an aggregated statistic based on the querying. Next, the method generates a feature vector by annotating the record with the aggregated statistic. The method uses this feature vector as an input to a predictive model.
    Type: Application
    Filed: December 20, 2023
    Publication date: May 9, 2024
    Inventors: Yan YAN, Aria HAGHIGHI, Nicholas RESNICK, Andrew LIM
  • Patent number: 11893507
    Abstract: Disclosed are techniques for generating features to train a predictive model to predict a customer lifetime value or churn rate. In one embodiment, a method is disclosed comprising receiving a record that includes a plurality of fields and selecting a value associated with a selected field in the plurality of fields. The method then queries a lookup table comprising a mapping of values to aggregated statistics using the value and receives an aggregated statistic based on the querying. Next, the method generates a feature vector by annotating the record with the aggregated statistic. The method uses this feature vector as an input to a predictive model.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: February 6, 2024
    Assignee: AMPERITY, INC.
    Inventors: Yan Yan, Aria Haghighi, Nicholas Resnick, Andrew Lim
  • Publication number: 20230131884
    Abstract: The example embodiments are directed toward improvements in generating affinity groups. In an embodiment, a method is disclosed comprising generating probabilities of object interactions for a plurality of users, a given object recommendation ranking for a respective user comprising a ranked list of object attributes; calculating interaction probabilities for each user over a forecasting window; calculating affinity group rankings based on the probabilities of object interactions and the interaction probabilities for each user; and grouping the plurality of users based on the affinity group rankings.
    Type: Application
    Filed: October 27, 2021
    Publication date: April 27, 2023
    Inventors: Andrew LIM, Joseph CHRISTIANSON, Joyce GORDON, Nicholas RESNICK, Yan YAN
  • Publication number: 20230126932
    Abstract: The example embodiments are directed toward improvements in predicting an ideal audience size. In an embodiment, a method is disclosed comprising receiving a set of users associated with an object attribute; selecting samples from the set of users; computing hit rates for the samples, a respective hit rate in the hit rates computed by calculating a total number of users in a respective sample associated with an interaction associated with the object attribute; and selecting a recommended sample from the samples, the recommended sample comprising a sample having an associated hit rate that meets a preconfigured hit rate threshold.
    Type: Application
    Filed: October 27, 2021
    Publication date: April 27, 2023
    Inventors: Yan YAN, Christopher James CHAPO, Joseph CHRISTIANSON, Joyce GORDON, Andrew LIM, Nicholas RESNICK
  • Publication number: 20230128579
    Abstract: The example embodiments are directed toward predicting the lifetime value of a user using an ensemble model. In an embodiment, a system is disclosed, including a generative model for generating a first prediction representing a first lifetime value of a user during a forecasting period and a discriminative model configured for generating a second prediction representing a second lifetime value of the user during the forecasting period. The system further includes a meta-model for receiving the first prediction and the second prediction and generating a third prediction based on the first prediction and the second prediction, the third prediction representing a third lifetime value of the user during the forecasting period.
    Type: Application
    Filed: October 27, 2021
    Publication date: April 27, 2023
    Inventors: Nicholas RESNICK, Joseph CHRISTIANSON, Joyce GORDON, Andrew LIM, Yan YAN
  • Publication number: 20150104591
    Abstract: A re-adherable adherent sheet with an inkjet, laser or digital press printing receptive top coat for the purpose of removable graphic signage is provided. A polyurethane adherent layer is provided that allows for repeated, non diminishing, residue free adherence and re-adherence onto various surfaces such as glass, tile, coated metals, coated wood, and valley less plastics by displacing air out between the polyurethane adherent layer and the adhered surface.
    Type: Application
    Filed: October 16, 2013
    Publication date: April 16, 2015
    Inventors: Andrew Lim, Jong Youl Song
  • Patent number: 8085898
    Abstract: The present invention relates to a dual energy X-ray apparatus and method for osteoporosis assessment and monitoring. The present invention takes a bone densitometry reading of a patient's wrist to assess osteoporosis and monitor bone loss condition by repeat measurements along with therapy. The bone densitometry system has an X-ray source, dual energy detectors, an arm-rest to place the patient's arm, a motion system to move the source-detector gantry along the patient's forearm, and a computer with a database to archive the wrist image, calculate the bone mineral density, maintain a history of patient information, and generate patient history reports.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: December 27, 2011
    Assignee: Osteometer Meditech, Inc.
    Inventors: Neeraj Agrawal, Manoocher Mansouri Aliabadi, Christian Wulff, Kahn-Tze Andrew Lim
  • Publication number: 20100284515
    Abstract: The present invention relates to a dual energy X-ray apparatus and method for osteoporosis assessment and monitoring. The present invention takes a bone densitometry reading of a patient's wrist to assess osteoporosis and monitor bone loss condition by repeat measurements along with therapy. The bone densitometry system has an X-ray source, dual energy detectors, an arm-rest to place the patient's arm, a motion system to move the source-detector gantry along the patient's forearm, and a computer with a database to archive the wrist image, calculate the bone mineral density, maintain a history of patient information, and generate patient history reports.
    Type: Application
    Filed: May 8, 2009
    Publication date: November 11, 2010
    Inventors: Neeraj Agrawal, Manoocher Mansouri Aliabadi, Christian Wulff, Kahn-Tze Andrew Lim
  • Publication number: 20100135458
    Abstract: The present invention relates to a dual energy X-ray apparatus and method for osteoporosis assessment and monitoring. The present invention takes a bone densitometry reading of a patient's wrist to assess osteoporosis and monitor bone loss condition by repeat measurements along with therapy. The bone densitometry system has an X-ray source, dual energy detectors, an arm-rest to place the patient's arm, a motion system to move the source-detector gantry along the patient's forearm, and a computer with a database to archive the wrist image, calculate the bone mineral density, maintain a history of patient information, and generate patient history reports.
    Type: Application
    Filed: November 19, 2009
    Publication date: June 3, 2010
    Inventors: Neeraj Agrawal, Manoocher Mansouri Aliabadi, Christian Wulff, Kahn-Tze Andrew Lim
  • Publication number: 20070109125
    Abstract: A robust system, apparatus, and method for precise in-house positioning utilizing RFID (Radio Frequency Identification) technology are described in this invention. The in-house environment is partitioned into separate locations, and a set of RFID tags are scattered in the environment. Reading patterns of RFID tags are collected at each location by an RFID reader as samples. Pattern recognition and classification methods are used, when human, vehicle, or other carrier move around the environment with an RFID reader to estimate its physical location based on the reading pattern. The precision can be within one meter. The method is adaptive to different tag distribution, reader range, defective tags, and other physical constraints.
    Type: Application
    Filed: July 24, 2006
    Publication date: May 17, 2007
    Inventors: Kaicheng ZHANG, Andrew LIM, Wenbin ZHU, Jiuqing DENG, Chan CHE
  • Publication number: 20070045826
    Abstract: Microfeature workpiece substrates having through-substrate vias, and associated methods of formation are disclosed. A method in accordance with one embodiment for forming a support substrate for carrying microfeature dies includes exposing a support substrate to an electrolyte, with the support substrate having a first side with a first conductive layer, a second side opposite the first side with a second conductive layer, and a conductive path extending through the support substrate from the first conductive layer to the second conductive layer. The method can further include forming a bond pad at a bond site of the first conductive layer by disposing at least one conductive bond pad material at the bond site, wherein disposing the at least one conductive bond pad material can include passing an electrical current between the first and second conductive layers via the conductive path, while the substrate is exposed to the electrolyte.
    Type: Application
    Filed: September 1, 2005
    Publication date: March 1, 2007
    Applicant: Micron Technology, Inc.
    Inventors: Teck Lee, Andrew Lim
  • Patent number: 7112048
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: September 26, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • Patent number: 6720666
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: April 13, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • Patent number: 6692987
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Grant
    Filed: February 5, 2002
    Date of Patent: February 17, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • Publication number: 20030211660
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Application
    Filed: April 8, 2003
    Publication date: November 13, 2003
    Applicant: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • Publication number: 20030211659
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Application
    Filed: April 8, 2003
    Publication date: November 13, 2003
    Applicant: Micron Technology, Inc.
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang
  • Publication number: 20030148557
    Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
    Type: Application
    Filed: February 5, 2002
    Publication date: August 7, 2003
    Inventors: Thiam Chye Lim, Kay Kit Tan, Kian Chai Lee, Victor Cher Khng Tan, Kwang Hong Tan, Chong Pei Andrew Lim, Yong Kian Tan, Teck Kheng Lee, Sian Yong Khoo, Yoke Kuin Tang