Abstract: An orthodontic appliance includes a telescopic assembly with an end tube and a telescopic member. A distal connector secured to the end tube at a generally distal end of the telescopic assembly. An end cap engages the distal end of the end tube. A spring is secured to the end cap and extends coaxially within the cover and the end tube. The spring is configured to impart a biasing force against the distal end of the telescopic member.

Abstract: A nanofluid is generally provided for use in a heat transfer system. The nanofluid can include nanoparticles suspended in a base liquid at a nanoparticle concentration in the nanofluid of about 0.01% to about 5% by volume. The nanoparticles can include zinc-oxide nanoparticles. The nanofluid for use in a heat transfer system can, in one embodiment, further include a surfactant. Thermal management systems configured to cool a computer having integrated circuits that generate heat during use are also provided. The thermal management system can include a zinc-oxide nanofluid circulated through a series of tubes via a pump such that heat produced by electronic components of the computer can be captured by the circulating nanofluid and then removed from the nanofluid by a radiator.

Abstract: An orthodontic appliance includes a telescopic assembly with an end tube and a telescopic member. A distal connector secured to the end tube at a generally distal end of the telescopic assembly. An end cap engages the distal end of the end tube. A spring is secured to the end cap and extends coaxially within the cover and the end tube. The spring is configured to impart a biasing force against the distal end of the telescopic member.

Abstract: A nanofluid is generally provided for use in a heat transfer system. The nanofluid can include nanoparticles suspended in a base liquid at a nanoparticle concentration in the nanofluid of about 0.01% to about 5% by volume. The nanoparticles can include zinc-oxide nanoparticles. The nanofluid for use in a heat transfer system can, in One embodiment, further include a surfactant. Thermal management systems configured to cool a computer having integrated circuits that generate heat during use are also provided. The thermal management system can include a zinc-oxide nanofluid circurated through a series of tubes via a pump such that heat produced by electronic components of the computer can be captured by the circulating nanofluid and then removed from the nanofluid by a radiator.

Abstract: An orthodontic appliance includes a telescopic assembly with an end tube and a telescopic member. A distal connector secured to the end tube at a generally distal end of the telescopic assembly. An end cap engages the distal end of the end tube. A spring is secured to the end cap and extends coaxially within the cover and the end tube. The spring is configured to impart a biasing force against the distal end of the telescopic member.

Abstract: An orthodontic appliance includes a telescopic assembly with an end tube and a telescopic member. A distal connector secured to the end tube at a generally distal end of the telescopic assembly. An end cap engages the distal end of the end tube. A spring is secured to the end cap and extends coaxially within the cover and the end tube. The spring is configured to impart a biasing force against the distal end of the telescopic member.

Abstract: A nanofluid is generally provided for use in a heat transfer system. The nanofluid can include nanoparticles suspended in a base liquid at a nanoparticle concentration in the nanofluid of about 0.01% to about 5% by volume. The nanoparticles can include zinc-oxide nanoparticles. The nanofluid for use in a heat transfer system can, in one embodiment, further include a surfactant. Thermal management systems configured to cool a computer having integrated circuits that generate heat during use are also provided. The thermal management system can include a zinc-oxide nanofluid circulated through a series of tubes via a pump such that heat produced by electronic components of the computer can be captured by the circulating nanofluid and then removed from the nanofluid by a radiator.

Abstract: A nanofluid is generally provided for use in a heat transfer system. The nanofluid can include nanoparticles suspended in a base liquid at a nanoparticle concentration in the nanofluid of about 0.01% to about 5% by volume. The nanoparticles can include zinc-oxide nanoparticles. The nanofluid for use in a heat transfer system can, in one embodiment, further include a surfactant. Thermal management systems configured to cool a computer having integrated circuits that generate heat during use are also provided. The thermal management system can include a zinc-oxide nanofluid circulated through a series of tubes via a pump such that heat produced by electronic components of the computer can be captured by the circulating nanofluid and then removed from the nanofluid by a radiator.

Abstract: An apparatus for cooling a computer's microprocessor includes a thermal housing having a receiving aperture in alignment with the microprocessor. A thermal head is inserted into and guided by the receiving aperture such that a cooled surface of the thermal head will be in thermal contact with the microprocessor. The thermal head defines a flow channel for passage of a refrigerant fluid so as to cause cooling at the cooled surface. A clamping arrangement is attached to the mounting structure to maintain the thermal head in operative position. The apparatus further includes a refrigeration system in fluid communication with the flow channel of the thermal head to supply refrigerant fluid thereto.

Abstract: An apparatus for cooling a computer's microprocessor includes a thermal housing having a receiving aperture in alignment with the microprocessor. A thermal head is inserted into and guided by the receiving aperture such that a cooled surface of the thermal head will begin thermal contact with the microprocessor. The thermal head defines a flow channel for passage of a refrigerant fluid so as to cause cooling at the cooled surface. A clamping arrangement is attached to the mounting structure to maintain the thermal head in operative position. The apparatus further includes a refrigeration system in fluid communication with the flow channel of the thermal head to supply refrigerant fluid thereto.