Abstract: Broadband infrared radiation is used to heat and fuse an enamel paste to form an enamel seal between at least two solid substrates such as glass, ceramic or metal.

Abstract: A glass-flake loaded organic sealant system is useful for sealing active layers such as those in electronic devices and solar cells.

Abstract: Broadband infrared radiation is used to heat and fuse an enamel paste to form an enamel seal between at least two solid substrates such as glass, ceramic or metal.

Abstract: A glass-flake loaded organic sealant system is useful for sealing active layers such as those in electronic devices and solar cells.

Abstract: The present invention provides an adhesive composition for use in bonding a polymeric fitting to an olefin-containing component of an article used in medical applications. The adhesive composition according to the invention includes an adhesive polymer system dissolved in a solvent system. The solvent system includes an organic solvent having a solubility parameter within the range of from about 7.5 to about 10 (cal/cm3)1/2. Subsequent to forming a bond between the polymeric fitting and the olefin-containing component, the adhesive composition can meet the requirements for USP Class VI materials. In a preferred embodiment of the invention, the adhesive composition includes a low shear mixture of an adhesive polymer system including an atactic polypropylene and a low density polyethylene that is dissolved in a solvent system including a blend of d-limonene and a ketone selected from the group consisting of 4-heptanone and cyclohexanone.

Abstract: This invention relates to a solvent based adhesive composition including a major amount of a solvent system and a minor amount of an adhesive polymer system. The solvent system preferably includes a terpene and an aldehyde, ketone, or an aromatic solvent. The adhesive polymer system preferably includes one or a blend of polymers that dissolve, at least in part, in the solvent solution. The components of the solvent adhesive are compatible in that they do not separate upon standing. The solvent based adhesive composition provides good adhesion between polymer articles such as, for example, polyolefin and acrylic films, as well as good adhesion between polymeric articles and wood or metal substrates.

Abstract: The present invention provides an adhesive composition for use in bonding a polymeric fitting to an olefin-containing component of an article used in medical applications. The adhesive composition according to the invention includes an adhesive polymer system dissolved in a solvent system. The solvent system includes an organic solvent having a solubility parameter within the range of from about 7.5 to about 10 (cal/cm3)½. Subsequent to forming a bond between the polymeric fitting and the olefin-containing component, the adhesive composition can meet the requirements for USP Class VI materials. In a preferred embodiment of the invention, the adhesive composition includes a low shear mixture of an adhesive polymer system including an atactic polypropylene and a low density polyethylene that is dissolved in a solvent system including a blend of d-limonene and a ketone selected from the group consisting of 4-heptanone and cyclohexanone.

Abstract: This invention relates to a solvent based adhesive composition including a major amount of a solvent system and a minor amount of an adhesive polymer system. The solvent system preferably includes a terpene and an aldehyde, ketone, or an aromatic solvent. The adhesive polymer system preferably includes one or a blend of polymers that dissolve, at least in part, in the solvent solution. The components of the solvent adhesive are compatible in that they do not separate upon standing. The solvent based adhesive composition provides good adhesion between polymer articles such as, for example, polyolefin and acrylic films, as well as good adhesion between polymeric articles and wood or metal substrates.

Abstract: Thermosetting powder coating compositions are produced based on a low molecular weight glycidyl functional copolymer produced by solvent polymerization of ethylenic monomers in an organic solvent polymerization medium containing at least 15% by weight organic solvent based on the weight of solvent and monomers copolymerized, where the ethylenic monomers copolymerized comprise on a weight basis between about 15% and 35% glycidyl methacrylate, between about 5% and 60% methyl methacrylate, between about 2% and 15% butyl methacrylate, and between about 5% and 50% styrene, to produce glycidyl functional copolymer having a melt viscosity between 150 and 400 poise and a Tg between 80.degree. C. and 100.degree. C., where the copolymer is coreactive with carboxyl functional crosslinking compounds.