Abstract: A flow reactor system and methods having tubing useful as polymerization chamber. The flow reactor has at least one inlet and at least one mixing chamber, and an outlet. The method includes providing two phases, an aqueous phase and a non-aqueous phase and forming an emulsion for introduction into the flow reactor.

Abstract: Compounds with fire extinguishing properties having the formula: wherein R1 is —CR5R6R7 or —CR5R6CR8R9R10 as well as fire extinguishing units including one or more of the compounds.

Abstract: A flow reactor system and methods having tubing useful as polymerization chamber. The flow reactor has at least one inlet and at least one mixing chamber, and an outlet. The method includes providing two phases, an aqueous phase and a non-aqueous phase and forming an emulsion for introduction into the flow reactor.

Abstract: A polysulfide material having reactive vinyl end groups and a method of making a vinyl end-capped polysulfide material are described. The vinyl end-capped polysulfide material has potential applications as a sealant, an adhesive, a coating, a caulking, or the like. In a specific example, the polysulfide material may be used as a precursor material for a sealant resin in the manufacturing of an integral fuel tank of an aircraft. An example method for making polysulfide materials includes contacting a vinyl-functionalized aryl halide and/or a vinyl-functionalized heteroaryl halide with dithiols and/or trithiols in the presence of an organic solvent.

Abstract: Global icephobic performance of a passive deicing structure may be achieved by including one or more ice nucleating zones that are configured, preselected, and/or arranged to promote selective formation of ice. Ice nucleation zones may be configured, preselected, and/or arranged to form ice that is weakly adherent and, hence, may be removed by sufficient shear force. Ice nucleation zones typically include nucleating particles to promote selective ice formation. Passive deicing structures typically include both ice nucleation zones and ice resisting zones, arranged to facilitate ice removal by shear force. Passive deicing structures may be used on apparatuses such as vehicles (e.g., aircraft) to mitigate the effects of ice formation on exposed surfaces.

Abstract: Global icephobic performance of a passive deicing structure may be achieved by including one or more ice nucleating zones that are configured, preselected, and/or arranged to promote selective formation of ice. Ice nucleation zones may be configured, preselected, and/or arranged to form ice that is weakly adherent and, hence, may be removed by sufficient shear force. Ice nucleation zones typically include nucleating particles to promote selective ice formation. Passive deicing structures typically include both ice nucleation zones and ice resisting zones, arranged to facilitate ice removal by shear force. Passive deicing structures may be used on apparatuses such as vehicles (e.g., aircraft) to mitigate the effects of ice formation on exposed surfaces.

Abstract: Improved poly(vinyl chloride) compositions which exhibit improved adhesivity to polyamide which find particular utility in the construction of multi-layer structures, particularly for the fabrication of improved structures for use in forming electrical insulation structures for wires and cables. In one useful embodiment, the multi-layer structure has in the following order: a layer of PVC and a layer of polyamide in contact with the layer of PVC wherein the layer of PVC includes a vinyl chloride containing copolymer or a terpolymer which exhibits good solubility with the PVC, and which further provides good adhesivity with the PA. The vinyl resin is selected from the group consisting of vinyl chloride-vinyl acetate-vinyl alcohol terpolymers.

Abstract: A novel class of fluorinated surfactant monomers which when blended and cured with conventional non-fluorinated monomers produces resins with dramatically modified surfaces. Resins which may be thus modified include urethanes, epoxides, acrylates, polyesters and other thermosetting materials.

Abstract: Oligomeric condensation products of certain diketones and phenols can be end-capped with a vinylbenzyl moiety and certain other moieties, especially alkyl groups, to afford thermosetting resins particularly valuable in making laminated circuit boards. Resins prepared by the reaction of 1 molar proportion of diacetylbenzene with from 3.5 to 4.0 molar proportions of phenol and end-capped with from 50 to 100% vinylbenzyl groups with the remainder being alkyls of 1 through 11 carbon atoms are particularly useful.

Abstract: A difunctional epoxy acrylate monomer is prepared by reacting a highly fluorinated diglycidyl either with an excess of acrylic acid in the presence of a suitable catalyst. The acrylate has the following structure; ##STR1## where N is an integer from 1 to 30. This monomer is totally miscible with nonfluorinated polyacrylates. Clear, colorless, low refractive index polymers can be prepared by polymerization of this monomer or blends with other acrylates to give products useful as low surface energy coatings, and low refractive index coatings, on a wide range of substrates.

Abstract: Thermosetting resins which are essentially vinylbenzyl end-capped ethers of the oligomeric condensation products of certain dihydric phenols and formaldehyde are readily polymerized to give an extensively cross-linked polymer particularly useful in printed circuit boards and similar laminates. Effective cost reduction may be enjoyed by replacing up to 50% of the vinylbenzyl moieties by other groups, such as alkyl and benzyl groups, without destroying the usefulness of the resulting thermosetting resins. The vinylbenzyl ether product from bisphenol-A is especially recommended.

Abstract: A method is presented to prepare totally functionalized ether-capped oligomeric polyphenols without molecular weight fractionation. The products generally are very low in inorganic salts and are characterized by the absence of volatiles leading to void formation in their subsequent curing. The success of the method rests upon conducting the reaction under totally homogeneous conditions throughout.

Abstract: Thermosetting resins which are essentially vinylbenzyl end-capped ethers of the oligomeric condensation products of certain dihydric phenols and formaldehyde are readily polymerized to give an extensively cross-linked polymer particularly useful in printed circuit boards and similar laminates. Effective cost reduction may be enjoyed by replacing up to 50% of the vinylbenzyl moieties by other groups, such as alkyl and benzyl groups, without destroying the usefulness of the resulting thermosetting resins. The vinylbenzyl ether product from bisphenol-A is especially recommended.

Abstract: The resins resulting from converting dicyclopentadiene-phenol adducts to their corresponding vinylbenzyl ethers are an excellent matrix in which to embed fibers to produce a composite. Such resins, especially as a blend of materials with varying molecular weight distribution, are amorphous materials whose glass transition temperature is well under the curing temperature, and whose solubility permits solutions with high solids content so as to afford coatings with high resin content. The extensively crosslinked polymer resulting from therma, photochemical, or free radical initiated polymerization has excellent thermal and electrical properties for use in multilayer circuit boards.

Abstract: Oligomeric condensation products of certain dialdehydes and phenols can be end-capped with a vinylbenzyl moiety and certain other moieties, especially alkyl groups, to afford thermosetting resins particularly valuable in making laminated circuit boards. Resins prepared by the reaction of 1 molar proportion of glyoxal with from 3 to 4 molar proportions of phenol and end-capped with from 50 to 85% vinylbenzyl groups with the remainder being alkyls of 1 through 11 carbon atoms are particularly useful.

Abstract: Homogeneous thermosetting copolymers comprising a mixture of styrene-terminated tetrakisphenols and compounds containing at least one pendant vinyl group as exemplified by styrene-terminated tetrakisphenol ethane and styrene-terminated bisphenol A will possess desirable characteristics such as low dielectric constants and high glass transition temperatures. These polymers may be utilized as a component in laminates or circuit boards which are employed in relatively complicated pieces of electronic equipment.

Abstract: Thermoset polymers of styrene terminated tetrakis phenols may be prepared from resins which possess the generic formula ##STR1## in which R is selected from the group consisting of alkyl, cycloalkyl, alkaryl and substituted alkaryl radicals and X is independently selected from the group consisting of hydrogen and halogen atoms. These polymers will be utilized as a component in laminates on circuit boards which are employed in relatively complicated pieces of electronic equipment.