Patents by Inventor Andrew Machauf

Andrew Machauf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090241681
    Abstract: A biosensor using a stress sensor, such as a FET device or a piezoresistive device, embedded in a MEMS structure and coated with hydrogel is provided. The MEMS structure comprises any structure with a flexible portion and may include a cantilever, beam, or plate. When the hydrogel swells due to the presence of an analyte, the hydrogel imparts stress on the MEMS structure which is then detected by the embedded stress sensor. A passivation layer may be included in between the MEMS structure and the hydrogel. The MEMS structure may further be coated with a second hydrogel.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 1, 2009
    Inventors: Andrew Machauf, Ariel Cohen
  • Publication number: 20090170209
    Abstract: An apparatus and method for detecting an analyte wherein a member may respond to mechanical stress induced by a volume change of a sensitive hydrogel upon sensing an analyte and wherein the mechanical stress may be detected by a detector.
    Type: Application
    Filed: December 29, 2007
    Publication date: July 2, 2009
    Inventors: Andrew Machauf, Ariel Cohen, IIan Levy
  • Publication number: 20070298532
    Abstract: An apparatus comprising a substrate having therein one or more porous regions, a micro-electro-mechanical (MEMS) device formed on the substrate, a cap formed on the substrate, wherein the cap encapsulates the MEMS device and is formed over at least one of the one or more porous regions, and a sealing layer formed on a back side of the substrate. A process comprising forming one or more porous regions in a substrate, forming a micro-electro-mechanical (MEMS) device on the substrate, forming a sacrificial layer on the substrate over the MEMS device, wherein the sacrificial layer is over at least one of the one or more porous regions, forming a cap on the substrate, wherein the cap encapsulates the MEMS device and the sacrificial layer, etching the sacrificial layer inside the cap by inserting etchant through at least one of the one or more porous regions, and forming a sealing layer on a back side of the substrate.
    Type: Application
    Filed: June 27, 2006
    Publication date: December 27, 2007
    Inventor: Andrew Machauf