Patents by Inventor Andrew McIntosh Soutar
Andrew McIntosh Soutar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9072203Abstract: A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.Type: GrantFiled: March 13, 2002Date of Patent: June 30, 2015Assignee: Enthone Inc.Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
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Publication number: 20110279991Abstract: A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.Type: ApplicationFiled: July 20, 2011Publication date: November 17, 2011Applicant: ENTHONE INC.Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
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Publication number: 20110192638Abstract: A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.Type: ApplicationFiled: April 22, 2011Publication date: August 11, 2011Applicant: ENTHONE INC.Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
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Patent number: 7594718Abstract: Disclosed is method of coating an inkjet print head using a UV curable coating composition containing a (methyl)acryloxy or vinyl functionalized silane, silica and polyurethane acrylate oligomer containing at least two acrylate groups.Type: GrantFiled: November 22, 2006Date of Patent: September 29, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Andrew McIntosh Soutar, Min Qian, Guangjin Li, Ivan Thomas Pereira
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Patent number: 7306315Abstract: Disclosed is a method of coating an inkjet print head using a UV curable coating composition containing a (methyl)acryloxy or vinyl functionalized silane, silica and acrylate oligomer containing at least two acrylate groups.Type: GrantFiled: November 22, 2006Date of Patent: December 11, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Andrew McIntosh Soutar, Min Qian, Kok Mun Hew, Ivan Thomas Pereira, Guangjin Li
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Patent number: 7196136Abstract: Disclosed is a UV curable coating composition comprising a (methyl)acryloxy or vinyl functionalized silane, silica and acrylate oligomer containing at least two acrylate groups.Type: GrantFiled: April 29, 2004Date of Patent: March 27, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Andrew McIntosh Soutar, Min Qian, Guangjin Li, Ivan Thomas Pereira
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Patent number: 7183353Abstract: Disclosed is a UV curable coating composition comprising a (methyl)acryloxy or vinyl functionalized silane, silica and acrylate oligomer containing at least two acrylate groups.Type: GrantFiled: April 29, 2004Date of Patent: February 27, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Andrew McIntosh Soutar, Min Qian, Kok Mun Hew, Ivan Thomas Pereira, Guangjin Li
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Patent number: 6860925Abstract: A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.Type: GrantFiled: April 8, 2002Date of Patent: March 1, 2005Assignee: Enthone IncorporatedInventors: Andrew McIntosh Soutar, Peter Thomas McGrath
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Publication number: 20020152925Abstract: A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.Type: ApplicationFiled: April 8, 2002Publication date: October 24, 2002Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
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Publication number: 20020150692Abstract: A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.Type: ApplicationFiled: March 13, 2002Publication date: October 17, 2002Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
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Patent number: 6395329Abstract: A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.Type: GrantFiled: September 29, 1997Date of Patent: May 28, 2002Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
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Patent number: 6319543Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.Type: GrantFiled: March 31, 1999Date of Patent: November 20, 2001Assignee: Alpha Metals, Inc.Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
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Patent number: 6158491Abstract: A process for the corrosion protection of copper or copper alloy which process comprises contacting the surface with an aqueous solution of at least one compound of general formula (I), wherein X is N, Y is CR and Z is N, or X is N, Y is N and Z is N or CR or X is CR, Y is N and Z is N, where R is a hydrogen atom or R.sup.1, and R.sup.1 is an alkyl, aryl, aralkyl, halogen, trihalomethyl, amino, heterocyclic, NHR.sup.2, NR.sup.3 R.sup.4, CN, CO.sub.2 H, CO.sub.2 R.sup.5, OH or OR.sup.6 group, where each of R.sup.2 to R.sup.6 independently represents an alkyl, aryl, or aralkyl group.Type: GrantFiled: August 28, 1997Date of Patent: December 12, 2000Assignee: Cookson Group PLCInventors: John Reynolds, Andrew McIntosh Soutar, Keith William Peter White, Anthony Williams
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Patent number: 5955141Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.Type: GrantFiled: September 17, 1997Date of Patent: September 21, 1999Assignee: Alpha Metals, Inc.Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
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Patent number: RE45175Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.Type: GrantFiled: October 18, 2012Date of Patent: October 7, 2014Assignee: Fry's Metals, Inc.Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
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Patent number: RE45279Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver. REEXAMINATION RESULTS The questions raised in reexamination proceedings Nos. 90/012,336 and 90/009,934, filed Jun. 4, 2012 and Aug.Type: GrantFiled: May 14, 2012Date of Patent: December 9, 2014Assignee: Fry's Metals, Inc.Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath