Patents by Inventor Andrew Michael Homick

Andrew Michael Homick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9401569
    Abstract: A header assembly of a mezzanine connector system may include a main housing defining signal channels extending through the main housing and ground channels extending into a first surface of the main housing, a plurality of signal modules, and a plurality of ground shields. At least a portion of each of the plurality of signal modules is retained within a respective one of the signal channels. At least a portion of each of the plurality of ground shields is retained within at least one of the ground channels.
    Type: Grant
    Filed: October 6, 2014
    Date of Patent: July 26, 2016
    Assignees: TYCO ELECTRONICS CORPORATION, TYCO ELECTRONICS JAPAN G.K.
    Inventors: Wayne Samuel Davis, Michael James Horning, John Joseph Consoli, Thomas Edward Messenger, Andrew Michael Homick, Daniel Briner Shreffler, Chad W. Morgan, Raymond D. Boyer, Vincent Ruminski, Masayuki Aizawa, Edward Lee Hengst
  • Publication number: 20160099532
    Abstract: A header assembly of a mezzanine connector system may include a main housing defining signal channels extending through the main housing and ground channels extending into a first surface of the main housing, a plurality of signal modules, and a plurality of ground shields. At least a portion of each of the plurality of signal modules is retained within a respective one of the signal channels. At least a portion of each of the plurality of ground shields is retained within at least one of the ground channels.
    Type: Application
    Filed: October 6, 2014
    Publication date: April 7, 2016
    Applicant: Tyco Electronics Japan G.K.
    Inventors: Wayne Samuel Davis, Michael James Horning, John Joseph Consoli, Thomas Edward Messenger, Andrew Michael Homick, Daniel Briner Shreffler, Chad W. Morgan, Raymond D. Boyer, Vincent Ruminski, Masayuki Aizawa, Edward Lee Hengst